Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/13/2005US20050226047 Semiconductor device and method of manufacture thereof
10/13/2005US20050226044 Semiconductor storage
10/13/2005US20050226042 Thin film magnetic memory device for programming required information with an element similar to a memory cell information programming method
10/13/2005US20050226041 Stacked 1T-nmemory cell structure
10/13/2005US20050226036 Memory device and storage apparatus
10/13/2005US20050226035 Multi-cell resistive memory array architecture with select transistor
10/13/2005US20050226030 Magnetic memory device
10/13/2005US20050226000 Optical apparatus for illuminating an object
10/13/2005US20050225988 Optical device for LED-based lamp
10/13/2005US20050225973 LED with series-connected monolithically integrated mesas
10/13/2005US20050225956 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
10/13/2005US20050225937 Cooling device and heat treating device using the same
10/13/2005US20050225923 Method of determining the correct average bias compensation voltage during a plasma process
10/13/2005US20050225917 Integrated semiconductor circuit and method for testing the same
10/13/2005US20050225905 Tunnel magnetoresistance device
10/13/2005US20050225859 System and method for calibrating a spatial light modulator array using shearing interferometry
10/13/2005US20050225836 Pattern generator mirror configurations
10/13/2005US20050225771 Method and apparatus for crystallizing semiconductor with laser beams
10/13/2005US20050225741 Exposure apparatus
10/13/2005US20050225739 Exposure apparatus and device fabrication method using the same
10/13/2005US20050225736 Local flare correction
10/13/2005US20050225642 Apparatus and method for the determination of positioning coordinates for semiconductor substrates
10/13/2005US20050225632 Apparatus and method for acquiring a complete image of a surface of a semiconductor substrate
10/13/2005US20050225546 Image display device
10/13/2005US20050225451 RF tag, RF tag attitude detection apparatus, and RF tag attitude detection system
10/13/2005US20050225413 Microelectromechanical structures, devices including the structures, and methods of forming and tuning same
10/13/2005US20050225377 Boost circuit and semiconductor integrated circuit
10/13/2005US20050225362 Power system inhibit method and device and structure therefor
10/13/2005US20050225360 Voltage detection circuit, power supply unit and semiconductor device
10/13/2005US20050225345 Method of testing semiconductor wafers with non-penetrating probes
10/13/2005US20050225342 Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
10/13/2005US20050225340 Conductive material for integrated circuit fabrication
10/13/2005US20050225253 Display device and manufacturing method of the same
10/13/2005US20050225248 Honeycomb optical window deposition shield and method for a plasma processing system
10/13/2005US20050225204 Indium or tin bonded acoustic transducer systems
10/13/2005US20050224995 Carryover reduction in multiple CDSEM line matching
10/13/2005US20050224994 Compact SRAMs and other multiple transistor structures
10/13/2005US20050224992 Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
10/13/2005US20050224991 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
10/13/2005US20050224989 Passive within via
10/13/2005US20050224988 Method for embedding a component in a base
10/13/2005US20050224986 Stable metal structure with tungsten plug
10/13/2005US20050224985 Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/13/2005US20050224983 Semiconductor structures and methods for forming patterns using nitrogen-free SiCOH anti-reflective layers
10/13/2005US20050224981 Semiconductor processing methods for forming electrical contacts
10/13/2005US20050224980 Interconnect adapted for reduced electron scattering
10/13/2005US20050224979 Cu interconnects with composite barrier layers for wafer-to-wafer uniformity
10/13/2005US20050224978 Heat curable adhesive composition, article, semiconductor apparatus and method
10/13/2005US20050224977 Wiring substrate and method using the same
10/13/2005US20050224976 Electrical connection terminal of embedded chip and method for fabricating the same
10/13/2005US20050224975 High density nanostructured interconnection
10/13/2005US20050224974 Electronic component mounting method and apparatus
10/13/2005US20050224973 Extension of fatigue life for C4 solder ball to chip connection
10/13/2005US20050224972 Circuit device and method of manufacturing the circuit device
10/13/2005US20050224971 Circuit board, device mounting structure, device mounting method, and electronic apparatus
10/13/2005US20050224970 Semiconductor device and method of producing the semiconductor device
10/13/2005US20050224969 Chip package structure and process for fabricating the same
10/13/2005US20050224968 Wafer level mounting frame for ball grid array packaging, and method of making and using the same
10/13/2005US20050224966 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
10/13/2005US20050224965 Method for detaching a semiconductor chip from a foil and apparatus for mounting semiconductor chips
10/13/2005US20050224962 Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
10/13/2005US20050224961 Electronic package with optimized lamination process
10/13/2005US20050224959 Die with discrete spacers and die spacing method
10/13/2005US20050224955 Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
10/13/2005US20050224954 Thermal dissipation in integrated circuit systems
10/13/2005US20050224953 Heat spreader lid cavity filled with cured molding compound
10/13/2005US20050224951 Jet-dispensed stress relief layer in contact arrays, and processes of making same
10/13/2005US20050224950 Integrated circuit adapted for ECO and FIB debug
10/13/2005US20050224949 Semiconductor device and method of fabricating the same
10/13/2005US20050224947 Three-dimensional multichip stack electronic package structure
10/13/2005US20050224944 Stacked semiconductor device
10/13/2005US20050224943 Semiconducting device with stacked dice
10/13/2005US20050224940 Method for maintaining solder thickness in flipchip attach packaging processes
10/13/2005US20050224939 Semiconductor device and method for manufacturing same
10/13/2005US20050224937 Exposed pad module integrated a passive device therein
10/13/2005US20050224934 Circuit device
10/13/2005US20050224933 Thermally enhanced component interposer: finger and net structures
10/13/2005US20050224931 Method of producing electronic circuit and electronic circuit
10/13/2005US20050224930 System for reducing or eliminating semiconductor device wire sweep
10/13/2005US20050224922 Polymer dielectrics for memory element array interconnect
10/13/2005US20050224921 Method for bonding wafers to produce stacked integrated circuits
10/13/2005US20050224920 Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device
10/13/2005US20050224919 Spacer die structure and method for attaching
10/13/2005US20050224918 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
10/13/2005US20050224916 Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods
10/13/2005US20050224915 Resistor network such as a resistor ladder network and a method for manufacturing such a resistor network
10/13/2005US20050224914 Semiconductor integrated circuit device, method of enerating pattern thereof, method of manufacturing the same, and pattern generating apparatus for the same
10/13/2005US20050224913 Devices comprising aluminum oxide and metal oxide dielectric materials, capacitor constructions, and methods of forming capacitor constructions
10/13/2005US20050224911 Semiconductor integrated circuit
10/13/2005US20050224910 Semiconductor integrated circuit having polysilicon fuse, method of forming the same, and method of adjusting circuit parameter thereof
10/13/2005US20050224908 Integrated circuit with intergrated capacitor and methods for making same
10/13/2005US20050224907 Isolation structure with nitrogen-containing liner and methods of manufacture
10/13/2005US20050224906 Chemical sensor using chemically induced electron-hole production at a schottky barrier
10/13/2005US20050224905 High efficiency organic photovoltaic cells employing hybridized mixed-planar heterojunctions
10/13/2005US20050224902 Wireless substrate-like sensor
10/13/2005US20050224899 Wireless substrate-like sensor
10/13/2005US20050224898 MOSFET with a thin gate insulating film
10/13/2005US20050224897 High-K gate dielectric stack with buffer layer to improve threshold voltage characteristics
10/13/2005US20050224896 High voltage semiconductor device utilizing a deep trench structure
10/13/2005US20050224895 Semiconductor memory device and manufacturing method thereof
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