Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/29/2005WO2005122731A2 Method to form a conductive structure
12/29/2005WO2005122706A2 Method of aligning semiconductor device and semiconductor structure thereof
12/29/2005WO2005122691A2 Crystal growth method and apparatus
12/29/2005WO2005106927A3 Hot electron transistor
12/29/2005WO2005104217A3 System and method for etching a mask
12/29/2005WO2005103825A3 Device for covering substrates in a rotating manner
12/29/2005WO2005100496A3 Chemical-mechanical polishing composition and method for using the same
12/29/2005WO2005081769A3 Nor-type channel-program channel-erase contactless flash memory on soi
12/29/2005WO2005076076A3 Directly photodefinable polymer compositions and methods thereof
12/29/2005WO2005067462A3 Multi-position stop mechanism
12/29/2005WO2005059957A3 Metal interconnect system and method for direct die attachment
12/29/2005WO2005050709A3 LARGE AREA, UNIFORMLY LOW DISLOCATION DENSITY GaN SUBSTRATE AND PROCESS FOR MAKING THE SAME
12/29/2005WO2005041291A3 Mask and method for using the mask in lithographic processing
12/29/2005WO2005041258A3 Self-aligning tray and carrier apparatus
12/29/2005WO2004109769A3 Microelectromechanical systems and methods for encapsulating
12/29/2005WO2004094702A8 Multi-chemistry plating system
12/29/2005WO2004093150A3 Method for treating semiconductor processing components and components formed thereby
12/29/2005WO2004081983A3 Substrate processing apparatus and method for the controlled formation of layers incuding self-assembled monolyaers
12/29/2005WO2003038861A3 A method of stacking layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers
12/29/2005US20050289487 Method and system for dynamic modeling and recipe optimization of semiconductor etch processes
12/29/2005US20050288887 Temperature adaptive circuit, circuit temperature raising method and circuit temperature raising program
12/29/2005US20050288817 Chamber based dispatch method
12/29/2005US20050288815 Semiconductor device manufacturing information service system and server used in the same
12/29/2005US20050288812 Quality prognostics system and method for manufacturing processes
12/29/2005US20050288457 Co-curable compositions
12/29/2005US20050288396 Epoxy resin compositions
12/29/2005US20050288392 Modular board device and high frequency module and method for producing them
12/29/2005US20050287952 Heat sink formed of multiple metal layers on backside of integrated circuit die
12/29/2005US20050287929 Integrated endpoint detection system with optical and eddy current monitoring
12/29/2005US20050287928 Method and apparatus for post-CMP cleaning of a semiconductor work piece
12/29/2005US20050287846 Method for manufacturing thin film integrated circuit, and element substrate
12/29/2005US20050287826 Method of sealing low-k dielectrics and devices made thereby
12/29/2005US20050287825 Laser anneal method of a semiconductor layer
12/29/2005US20050287824 ECR-plasma source and methods for treatment of semiconductor structures
12/29/2005US20050287823 Dual-frequency silicon nitride for spacer application
12/29/2005US20050287822 Method of forming polysilicon layer in semiconductor device
12/29/2005US20050287821 Wafer processing system, coating/developing apparatus, and wafer, processing apparatus
12/29/2005US20050287820 Mold for nano imprinting
12/29/2005US20050287819 Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides
12/29/2005US20050287818 Material and method for forming low-dielectric-constant film
12/29/2005US20050287817 Low dielectric constant zinc oxide
12/29/2005US20050287816 Methods of forming patterned photoresist layers over semiconductor substrates
12/29/2005US20050287815 Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
12/29/2005US20050287814 H2O plasma for simultaneous resist removal and charge releasing
12/29/2005US20050287813 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
12/29/2005US20050287812 Method for repairing plasma damage after spacer formation for integrated circuit devices
12/29/2005US20050287811 Semiconductor device fabrication method
12/29/2005US20050287810 Method for making a semiconductor device with reduced spacing
12/29/2005US20050287809 Method for fabricating semiconductor device capable of decreasing critical dimension in peripheral region
12/29/2005US20050287808 Lactate-containing corrosion inhibitor
12/29/2005US20050287807 Formation of composite tungsten films
12/29/2005US20050287806 Vertical CVD apparatus and CVD method using the same
12/29/2005US20050287805 Electronic device
12/29/2005US20050287804 Systems and methods of forming refractory metal nitride layers using organic amines
12/29/2005US20050287803 Semiconductor device having a metal wiring structure and method of manufacturing the same
12/29/2005US20050287802 Method for forming metal line in semiconductor memory device having word line strapping structure
12/29/2005US20050287801 Method for fabricating semiconductor device having landing plug contact structure
12/29/2005US20050287800 Multilayer interconnection structure and method for forming the same
12/29/2005US20050287799 Method for fabricating semiconductor device
12/29/2005US20050287798 Preventing cavitation in high aspect ratio dielectric regions of semiconductor device
12/29/2005US20050287797 Method of making a semiconductor device manufacturing mask substrate
12/29/2005US20050287796 Methods of fabricating metal lines in semiconductor devices
12/29/2005US20050287795 Method of forming high aspect ratio structures
12/29/2005US20050287794 Contact structure
12/29/2005US20050287793 Diffusion barrier process for routing polysilicon contacts to a metallization layer
12/29/2005US20050287792 Method for forming barrier layer of semiconductor device
12/29/2005US20050287791 Method of forming laminate and method of manufacturing photovoltaic device
12/29/2005US20050287790 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device
12/29/2005US20050287789 Substrate with patterned conductive layer
12/29/2005US20050287788 Manufacturing method of nanowire array
12/29/2005US20050287787 Porous ceramic materials as low-k films in semiconductor devices
12/29/2005US20050287786 Device and method using isotopically enriched silicon
12/29/2005US20050287785 Method of stacking wafers with anisotropic conductive adhesive
12/29/2005US20050287784 Interconnect junction providing reduced current crowding and method of manufacturing same
12/29/2005US20050287783 Microelectronic devices and methods for forming interconnects in microelectronic devices
12/29/2005US20050287782 Methods for manufacturing a soft error and defect resistant pre-metal dielectric layer
12/29/2005US20050287781 Method for interconnecting electronic components using a blend solution to from a conducting layer and an insulating layer
12/29/2005US20050287780 Semiconductor constructions
12/29/2005US20050287779 Integrated circuit structure and method of fabrication
12/29/2005US20050287778 Method for forming an ultra-shallow junction in a semiconductor substrate using a nuclear stopping layer
12/29/2005US20050287777 Semiconductor device and method of fabrication thereof
12/29/2005US20050287776 Method of plasma doping
12/29/2005US20050287775 Film formation apparatus and method for semiconductor process
12/29/2005US20050287774 Method of improving surface flatness of group-III nitride crystal, substrate for epitaxial growth, and semiconductor device
12/29/2005US20050287773 Laser beam projection mask, and laser beam machining method and laser beam machine using same
12/29/2005US20050287772 Process for producing a web of a semiconductor material
12/29/2005US20050287771 Liquid precursors for the CVD deposition of amorphous carbon films
12/29/2005US20050287770 Alternative methods for fabrication of substrates and heterostructures made of silicon compounds and alloys
12/29/2005US20050287769 Substrate production apparatus for producing a substrate for a display device
12/29/2005US20050287768 Method and apparatus for cleaving brittle materials
12/29/2005US20050287767 Semiconductor substrate and process for producing it
12/29/2005US20050287766 Wafer-level diamond spreader
12/29/2005US20050287765 Method for manufacturing semiconductor device
12/29/2005US20050287764 Method of fabricating shallow trench isolation by ultra-thin simox processing
12/29/2005US20050287763 Method of manufacturing a semiconductor device
12/29/2005US20050287762 Formation of removable shroud by anisotropic plasma etch
12/29/2005US20050287761 Method for fabricating a capacitor in a semiconductor device
12/29/2005US20050287760 Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process
12/29/2005US20050287759 Method and apparatus for a semiconductor device with a high-k gate dielectric
12/29/2005US20050287758 Method of fabricating capacitor in semiconductor device and semiconductor device using the same
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