Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/22/2005US20050282472 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
12/22/2005US20050282471 Chemical mechanical polishing slurry useful for tunsten/titanium substrate
12/22/2005US20050282410 Flexible contact-connection device
12/22/2005US20050282408 Method for crystallizing semiconductor with laser beams
12/22/2005US20050282407 Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
12/22/2005US20050282406 Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
12/22/2005US20050282404 Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition
12/22/2005US20050282403 Ceramic electronic device and the production method
12/22/2005US20050282402 Resist for forming pattern and method for forming pattern using the same
12/22/2005US20050282401 Zeolite films for low k applications
12/22/2005US20050282400 Method of forming a dielectric film
12/22/2005US20050282399 Electroformed metallization
12/22/2005US20050282398 Oxygen plasma treatment for enhanced HDP-CVD gapfill
12/22/2005US20050282397 Semiconductor constructions
12/22/2005US20050282396 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
12/22/2005US20050282395 Method for forming an improved low power SRAM contact
12/22/2005US20050282394 Method for manufacturing a semiconductor device
12/22/2005US20050282393 Structure and method for collar self-aligned to buried plate
12/22/2005US20050282392 Sti formation in semiconductor device including soi and bulk silicon regions
12/22/2005US20050282391 Method of polishing a tungsten-containing substrate
12/22/2005US20050282390 Polishing composition for semiconductor wafers
12/22/2005US20050282389 Semiconductor device fabrication method
12/22/2005US20050282387 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
12/22/2005US20050282386 Semiconductor device and fabrication process thereof
12/22/2005US20050282385 Conductive material patterning methods
12/22/2005US20050282384 Method for forming protective film and electroless plating bath
12/22/2005US20050282383 Systems for forming insulative coatings for via holes in semiconductor devices
12/22/2005US20050282382 Method of preventing photoresist poisoning of a low-dielectric-constant insulator
12/22/2005US20050282381 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer
12/22/2005US20050282380 Method and apparatus for chemical mechanical polishing of semiconductor substrates
12/22/2005US20050282379 Spin transistor, programmable logic circuit, and magnetic memory
12/22/2005US20050282378 Interconnects forming method and interconnects forming apparatus
12/22/2005US20050282377 Method of making a semiconductor device having improved contacts
12/22/2005US20050282376 Method of making a semiconductor device having improved contacts
12/22/2005US20050282375 Semiconductor device and manufacturing method thereof
12/22/2005US20050282374 Method of forming a thin wafer stack for a wafer level package
12/22/2005US20050282372 Semiconductor device and a method of manufacture therefor
12/22/2005US20050282371 Sequential station tool for wet processing of semiconductor wafers
12/22/2005US20050282370 Selective salicidation methods
12/22/2005US20050282369 Enhanced step coverage of thin films on patterned substrates by oblique angle PVD
12/22/2005US20050282367 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
12/22/2005US20050282366 Method for monitoring ion implant doses
12/22/2005US20050282365 Film formation apparatus and method for semiconductor process
12/22/2005US20050282364 Method of fabricating a semiconductor thin film and semiconductor thin film fabrication apparatus
12/22/2005US20050282363 Method of forming fine pattern of semiconductor device using SiGe layer as sacrificial layer, and method of forming self-aligned contacts using the same
12/22/2005US20050282362 Tape adhering method and tape adhering apparatus
12/22/2005US20050282361 Semiconductor wafer and manufacturing process thereof
12/22/2005US20050282360 Semiconductor wafer and manufacturing process for semiconductor device
12/22/2005US20050282359 Wafer processing method
12/22/2005US20050282358 Method for transferring an electrically active thin layer
12/22/2005US20050282357 Method of peeling off and method of manufacturing semiconductor device
12/22/2005US20050282356 Semiconductor layer structure and method of making the same
12/22/2005US20050282355 High density bonding of electrical devices
12/22/2005US20050282354 Semiconductor device manufacturing method
12/22/2005US20050282353 Trench isolation structure and a method of manufacture therefor
12/22/2005US20050282352 Method of forming dual gate dielectric layer
12/22/2005US20050282351 Methods and systems to mitigate etch stop clipping for shallow trench isolation fabrication
12/22/2005US20050282350 Atomic layer deposition for filling a gap between devices
12/22/2005US20050282349 Method for forming device isolation film of semiconductor device
12/22/2005US20050282348 Method of manufacturing thin film capacitor
12/22/2005US20050282347 Semiconductor device with inductive component and method of making
12/22/2005US20050282346 MIM capacitors
12/22/2005US20050282345 Transistor with vertical dielectric structure
12/22/2005US20050282344 MOSFET and method of fabricating the same
12/22/2005US20050282343 Method of forming transistor having channel region at sidewall of channel portion hole
12/22/2005US20050282342 Field effect transistor and fabrication method thereof
12/22/2005US20050282341 High-temperature stable gate structure with metallic electrode
12/22/2005US20050282340 Semiconductor apparatus with improved ESD withstanding voltage
12/22/2005US20050282339 Method of forming a field effect transistor
12/22/2005US20050282338 Methods of forming gate patterns using isotropic etching of gate insulating layers
12/22/2005US20050282337 High write and erase efficiency embedded flash cell
12/22/2005US20050282336 [method of fabricating read only memory and memory cell array]
12/22/2005US20050282335 Method for manufacturing a semiconductor device having polysilicon plugs
12/22/2005US20050282334 NROM flash memory devices on ultrathin silicon
12/22/2005US20050282333 Memory cell transistor having different source/drain junction profiles connected to DC node and BC node and manufacturing method thereof
12/22/2005US20050282332 Non-volatile memory cell and method of operating the same
12/22/2005US20050282330 Method for making a semiconductor device including a superlattice having at least one group of substantially undoped layers
12/22/2005US20050282329 CMOS transistors with dual high-k gate dielectric and methods of manufacture thereof
12/22/2005US20050282328 Removal of carbon from an insulative layer using ozone
12/22/2005US20050282327 Flash memory device having a graded composition, high dielectric constant gate insulator
12/22/2005US20050282326 Method for fabricating dual-metal gate device
12/22/2005US20050282325 Structure and method to improve channel mobility by gate electrode stress modification
12/22/2005US20050282324 Semiconductor device containing distorted silicon layer formed on silicon germanium layer
12/22/2005US20050282323 Hybrid substrate and method for fabricating the same
12/22/2005US20050282322 Retaining ring with conductive portion
12/22/2005US20050282321 High-voltage mos device and fabrication thereof
12/22/2005US20050282320 Method of manufacturing semiconductor device
12/22/2005US20050282319 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
12/22/2005US20050282318 Method of forming a transistor with a bottom gate
12/22/2005US20050282317 Thin film semiconductor apparatus and method for driving the same
12/22/2005US20050282316 Method of manufacturing an electronic device comprising a thin film transistor
12/22/2005US20050282315 High-reliability solder joint for printed circuit board and semiconductor package module using the same
12/22/2005US20050282314 Printed circuit boards and methods for fabricating the same
12/22/2005US20050282313 Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
12/22/2005US20050282312 Semiconductor device and manufacturing method thereof
12/22/2005US20050282311 Flip-chip substrate and flip-chip bonding process thereof
12/22/2005US20050282310 Encapsulation of multiple integrated circuits
12/22/2005US20050282309 Circuit board with embedded passive component and fabrication process thereof
12/22/2005US20050282308 Organic electroluminescent display device and method of producing the same
12/22/2005US20050282307 Particulate for organic and inorganic light active devices and methods for fabricating the same
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