Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/10/2006US6984555 Device and method for inhibiting oxidation of contact plugs in ferroelectric capacitor devices
01/10/2006US6984554 Transistor with group III/VI emitter
01/10/2006US6984553 Method for forming shallow trench isolation with control of bird beak
01/10/2006US6984552 Method for doping semiconductor layer, method for producing thin film semiconductor element and thin film semiconductor element
01/10/2006US6984551 MIS semiconductor device and method of fabricating the same
01/10/2006US6984550 Semiconductor device and manufacturing method thereof
01/10/2006US6984549 Methods of forming semiconductor fuse arrangements
01/10/2006US6984548 Method of making a nonvolatile memory programmable by a heat induced chemical reaction
01/10/2006US6984547 Contactless uniform-tunneling separate p-well (cusp) non-volatile memory array architecture, fabrication and operation
01/10/2006US6984546 Method for forming a thin film light emitting device
01/10/2006US6984545 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
01/10/2006US6984544 Die to die connection method and assemblies and packages including dice so connected
01/10/2006US6984543 Method of producing laminated PTC thermistor
01/10/2006US6984542 Method of forming wiring
01/10/2006US6984541 Method of manufacturing capacitive type dynamic quantity sensor
01/10/2006US6984540 Surface acoustic wave device and method for producing the same
01/10/2006US6984539 Method of manufacturing light-emitting diode device
01/10/2006US6984538 Method for quantum well intermixing using pre-annealing enhanced defects diffusion
01/10/2006US6984537 Method of forming two-transistor pixel with buried reset channel
01/10/2006US6984536 Method for manufacturing a gallium nitride group compound semiconductor
01/10/2006US6984535 Selective etching of a protective layer to form a catalyst layer for an electron-emitting device
01/10/2006US6984533 Method of sorting dice by speed during die bond assembly and packaging to customer order
01/10/2006US6984532 Method of judging residual film by optical measurement
01/10/2006US6984531 Electrical field alignment vernier
01/10/2006US6984530 Method of fabricating a MRAM device
01/10/2006US6984529 Fabrication process for a magnetic tunnel junction device
01/10/2006US6984477 Resist pattern forming apparatus and method thereof
01/10/2006US6984474 Reticle barrier system for extreme ultra-violet lithography
01/10/2006US6984473 Method of patterning a mask blank
01/10/2006US6984472 Exposure method and apparatus
01/10/2006US6984441 Composite laminate and method for manufacturing the same
01/10/2006US6984436 Graded material and method for synthesis thereof and method for processing thereof
01/10/2006US6984421 Enclosing them with a frame structure consisting of a light-sensitive reaction resin and covering the latter with another structured layer of reaction resin after applying an auxiliary film
01/10/2006US6984417 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
01/10/2006US6984413 Removable pressure-sensitive adhesive sheet
01/10/2006US6984362 Processing apparatus, measuring apparatus, and device manufacturing method
01/10/2006US6984334 Method of manufacturing optical element
01/10/2006US6984332 Method for making a micro-electro-mechanical gyroscope
01/10/2006US6984302 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors
01/10/2006US6984301 Methods of forming capacitor constructions
01/10/2006US6984294 Method of forming a conductive barrier layer having improved coverage within critical openings
01/10/2006US6984288 Plasma processor in plasma confinement region within a vacuum chamber
01/10/2006US6984286 Adjusting fillet geometry to couple a heat spreader to a chip carrier
01/10/2006US6984267 Manufacture system for semiconductor device with thin gate insulating film
01/10/2006US6984198 Experiment management system, method and medium
01/10/2006US6984167 containing silica powder produced by melting raw material silica powder in flame; perfectly spherical; also contains alumina powder; average grain diameter of silica powder is 2 7 mu m; for silicon wafers
01/10/2006US6984164 Polishing apparatus
01/10/2006US6984163 Polishing pad with high optical transmission window
01/10/2006US6984162 Apparatus methods for controlling wafer temperature in chemical mechanical polishing
01/10/2006US6984125 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
01/10/2006US6984097 Mounting/demounting device for wafer carrier lid
01/10/2006US6983755 Cleaning method and cleaning apparatus for performing the same
01/10/2006US6983718 Electron beam physical vapor deposition apparatus
01/10/2006US6983703 Driving means to position a load
01/10/2006US6983620 are located in a process chamber of a chemical vapor deposition (CVD) reactor on substrate holders carried on dynamic gas cushions by a substrate holder carrier
01/10/2006US6983539 Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps
01/10/2006US6983536 Method and apparatus for manufacturing known good semiconductor die
01/10/2006CA2232973C Flip chip underfill system and method
01/10/2006CA2191167C Method for manufacturing a heterobipolar transistor
01/10/2006CA2116805C Mask and method for manufacturing the same
01/09/2006CA2475212A1 Silicon-based ceramic coatings for quartz crucibles for czochralski growth of silicon single crystals, similar unidirectional growth methods and similar semiconductor materials, and other applications requiring reduced chemical reactivity of fused silica
01/05/2006WO2006002410A2 Compressive sige <110> growth mosfet devices
01/05/2006WO2006002213A1 Multiple device package
01/05/2006WO2006002149A1 Method to form a film
01/05/2006WO2006002138A2 Etch and deposition control for plasma implantation
01/05/2006WO2006001942A2 Electronic isolation device
01/05/2006WO2006001915A2 Semiconductor device with multiple semiconductor layers
01/05/2006WO2006001564A1 Semiconductor package picker
01/05/2006WO2006001558A1 High selectivity cmp slurry composition for sti process in semiconductor manufacture
01/05/2006WO2006001520A1 Exposure apparatus, exposure method, and exposure mask
01/05/2006WO2006001416A1 Management method, management system, and program
01/05/2006WO2006001402A1 Method of soldering electronic component having solder bumps to substrate
01/05/2006WO2006001332A1 Method of spin recording and apparatus
01/05/2006WO2006001291A1 Projection optical system, exposure device, and exposure method
01/05/2006WO2006000821A1 Method of manufacture of electronic or functional devices
01/05/2006WO2006000691A1 Hybrid epitaxy support and method for making same
01/05/2006WO2006000669A2 Method for producing a multilayer structure comprising a separating layer
01/05/2006WO2006000180A2 Bonding film, semiconductor component comprising a bonding film, and method for the production thereof
01/05/2006WO2005109491B1 Methods of forming electrical connections for semiconductor constructions
01/05/2006WO2005108643A8 Method and device for the low-temperature epitaxy on a plurality of semiconductor substrates
01/05/2006WO2005101499A3 Methods of forming solder bumps on exposed metal pads and related structures
01/05/2006WO2005101480A3 Circuit mounted on an especially electroconductive substrate by means of a planar connection technique
01/05/2006WO2005101464A3 Polymerase chain reaction using metallic glass-coated microwire
01/05/2006WO2005050701A3 Stressed semiconductor device structures having granular semiconductor material
01/05/2006WO2005048311A3 Bump-on-lead flip chip interconnection
01/05/2006WO2005031850A3 Detection and reduction of dielectric breakdown in semiconductor devices
01/05/2006WO2005010945A3 Failure analysis methods and systems
01/05/2006WO2004105084A3 Method of room temperature covalent bonding
01/05/2006US20060004544 Monitoring device and monitoring method for vacuum device
01/05/2006US20060004490 Registration correction amount calculating apparatus for calculating amount of correction for registration inspection apparatus from registration inspection data of pattern formed on wafer
01/05/2006US20060003675 Fixed-abrasive chemical-mechanical planarization of titanium nitride
01/05/2006US20060003673 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
01/05/2006US20060003672 Polishing apparatus
01/05/2006US20060003603 Method and apparatus for processing
01/05/2006US20060003602 Semiconductor structures and methods of fabricating semiconductor structures comprising hafnium oxide modified with lanthanum, a lanthanide-series metal, or a combination thereof
01/05/2006US20060003601 Method of forming fine patterns
01/05/2006US20060003600 Contact planarization for integrated circuit processing
01/05/2006US20060003599 Semiconductor device and method for manufacturing same
01/05/2006US20060003598 Gradient low k material
01/05/2006US20060003597 Enhanced nitride layers for metal oxide semiconductors