Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/05/2006US20060003495 Method for fabricating an electronic component embedded substrate
01/05/2006US20060003494 Stacked package electronic device
01/05/2006US20060003493 Integrated metallic contact probe storage device
01/05/2006US20060003492 Substrate based unmolded package
01/05/2006US20060003491 Apparatus for ejecting relatively thin IC chip from semiconductor wafer
01/05/2006US20060003490 Method of manufacturing nitride semiconductor device
01/05/2006US20060003489 One mask Pt/PCMO/Pt stack etching process for RRAM applications
01/05/2006US20060003488 Display pixel and method of fabricating the same
01/05/2006US20060003487 Low power consumption OLED material for display applications
01/05/2006US20060003486 Plasma treatment method for electromigration reduction
01/05/2006US20060003485 Devices and methods of making the same
01/05/2006US20060003484 Using deuterated source gasses to fabricate low loss GeSiON SiON waveguides
01/05/2006US20060003483 Optoelectronic packaging with embedded window
01/05/2006US20060003482 Elastomeric cmos based micro electromechanical varactor
01/05/2006US20060003481 Method for fabricating semiconductor components using conductive layer and grooves
01/05/2006US20060003480 Method of manufacturing thick dielectric pattern and method of manufacturing image displaying apparatus
01/05/2006US20060003479 Method for fabricating liquid crystal display device of color-filter on transistor type
01/05/2006US20060003478 Method of manufacturing display device
01/05/2006US20060003477 Method for producing a light source provided with electroluminescent diodes and comprising a luminescence conversion element
01/05/2006US20060003476 Method for the production of multilayer discs
01/05/2006US20060003475 Semiconductor devices shared element(s) apparatus and method
01/05/2006US20060003474 Roll-to-sheet manufacture of OLED materials
01/05/2006US20060003473 Semiconductor device having ferroelectric material capacitor and method of making the same
01/05/2006US20060003472 Polymer-based ferroelectric memory
01/05/2006US20060003471 Self-aligned, low-resistance, efficient memory array
01/05/2006US20060003470 Phase-change random access memory device and method for manufacturing the same
01/05/2006US20060003469 Process for fabrication of a ferrocapacitor
01/05/2006US20060003468 Method for applying a layer to a hydrophobic surface
01/05/2006US20060003467 Method for producing an electromagnetic radiation-emitting semiconductor chip and a corresponding electromagnetic radiation-emitting semiconductor chip
01/05/2006US20060003455 such as nickel or copper present in a silicon wafer; involves dissolving wafer in hydrofluoric acid, measurement and calibration
01/05/2006US20060003268 Method of forming semiconductor patterns
01/05/2006US20060003267 Nano-structure and method of fabricating nano-structures
01/05/2006US20060003255 Methods for optimizing physical characteristics of selectively consolidatable materials
01/05/2006US20060003254 Photosensitive composition and method for forming pattern using same
01/05/2006US20060003237 Transparent amorphous carbon structure in semiconductor devices
01/05/2006US20060003236 Photomask and near-field exposure method
01/05/2006US20060003235 Semiconductor manufacturing method and an exposure mask
01/05/2006US20060003233 Exposure mask, method of designing and manufacturing the same, exposure method and apparatus, pattern forming method, and device manufacturing method
01/05/2006US20060003188 ITO thin film, method of producing the same, transparent conductive film, and touch panel
01/05/2006US20060003182 Method for forming controlled geometry hardmasks including subresolution elements and resulting structures
01/05/2006US20060003105 Apparatus and method for drying under reduced pressure, and coating film forming apparatus
01/05/2006US20060003102 Atomic layer deposition method of forming an oxide comprising layer on a substrate
01/05/2006US20060003090 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
01/05/2006US20060002604 Method and apparatus for pattern inspection
01/05/2006US20060002510 Inspection method and system for and method of producing component mounting substrate
01/05/2006US20060002227 Fuse box, semiconductor memory device having the same and setting method thereof
01/05/2006US20060002216 Thin film magnetic memory device and semiconductor integrated circuit device including the same as one of circuit blocks
01/05/2006US20060002212 Semiconductor device
01/05/2006US20060002205 Semiconductor device having relief circuit for relieving defective portion
01/05/2006US20060002192 Integrated circuit memory device and method
01/05/2006US20060002187 Programmable fuse and antifuse and method therefor
01/05/2006US20060002166 Semiconductor memory device, electronic card and electronic device
01/05/2006US20060002164 Anti-parallel tab sensor fabrication
01/05/2006US20060002097 Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
01/05/2006US20060002053 Detachable electrostatic chuck for supporting a substrate in a process chamber
01/05/2006US20060001969 Gratings, related optical devices and systems, and methods of making such gratings
01/05/2006US20060001889 Positioning apparatus and photolithography apparatus including the same
01/05/2006US20060001854 Optical system having an optical element that can be brought into at least two positions
01/05/2006US20060001853 Exposure apparatus and method of cleaning optical element of the same
01/05/2006US20060001811 Polycrystalline liquid crystal display device having large width channel and method of fabricating the same
01/05/2006US20060001458 Semiconductor device having CMOS driver circuit
01/05/2006US20060001440 Method and system for compensating thermally induced motion of probe cards
01/05/2006US20060001354 Transparent electrode for plasma display panel
01/05/2006US20060001272 Wafer carrier door and spring biased latching mechanism
01/05/2006US20060001180 In-line wire bonding on a package, and method of assembling same
01/05/2006US20060001179 Interposer, method of fabricating the same, and semiconductor device using the same
01/05/2006US20060001178 Interconnect shunt used for current distribution and reliability redundancy
01/05/2006US20060001177 Semiconductor chip stack
01/05/2006US20060001175 Masking structure having multiple layers including an amorphous carbon layer
01/05/2006US20060001174 Semiconductor device and method for manufacturing the same
01/05/2006US20060001173 Through electrode and method for forming the same
01/05/2006US20060001172 Hermetic seal cover and manufacturing method thereof
01/05/2006US20060001171 Electrode contact structure and method for fabricating the same
01/05/2006US20060001170 Conductive compound cap layer
01/05/2006US20060001169 Semiconductor device
01/05/2006US20060001168 Technique for forming a dielectric interlayer above a structure including closely spaced lines
01/05/2006US20060001167 Semiconductor device
01/05/2006US20060001164 Phase-change random access memory device and method for manufacturing the same
01/05/2006US20060001163 Groundless flex circuit cable interconnect
01/05/2006US20060001162 Nitride and polysilicon interface with titanium layer
01/05/2006US20060001161 Electrical contact for high dielectric constant capacitors and method for fabricating the same
01/05/2006US20060001160 Surface treatment of metal interconnect lines
01/05/2006US20060001159 Electronic assembly having multi-material interconnects
01/05/2006US20060001158 Package stress management
01/05/2006US20060001154 Chip-to-chip trench circuit structure
01/05/2006US20060001153 Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
01/05/2006US20060001151 Atomic layer deposited dielectric layers
01/05/2006US20060001143 Castellation wafer level packaging of integrated circuit chips
01/05/2006US20060001142 Castellation wafer level packaging of integrated circuit chips
01/05/2006US20060001141 Multi-component integrated circuit contacts
01/05/2006US20060001139 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
01/05/2006US20060001138 IC-tag-bearing wiring board and method of fabricating the same
01/05/2006US20060001135 Electronic package and semiconductor device using the same
01/05/2006US20060001133 Optical sub-assembly for a transceiver
01/05/2006US20060001132 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
01/05/2006US20060001130 Taped lead frames and methods of making and using the same in semiconductor packaging
01/05/2006US20060001128 Glass substrate and capacitance-type pressure sensor using the same
01/05/2006US20060001127 Plasma enhanced deposited, fully oxidized PSG film
01/05/2006US20060001125 Semiconductor device and method of producing the same
01/05/2006US20060001121 Phototransistor of CMOS image sensor and method for fabricating the same