Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/22/2005US20050282306 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
12/22/2005US20050282305 Semiconductor element and display device using the same
12/22/2005US20050282303 Liquid crystal display and method of manufacturing the same
12/22/2005US20050282301 Structure and method for field emitter tips
12/22/2005US20050282300 Back-end-of-line metallization inspection and metrology microscopy system and method using x-ray fluorescence
12/22/2005US20050282299 Wafer inspection system and method thereof
12/22/2005US20050282298 Transport speed monitoring apparatus and semiconductor processing system utilizing the same
12/22/2005US20050282297 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids
12/22/2005US20050282296 Asymmetrical programming ferroelectric memory transistor
12/22/2005US20050282295 Mtj stack with crystallization inhibiting layer
12/22/2005US20050282151 Method and apparatus for sorting particles with a MEMS device
12/22/2005US20050282101 Heat treatment jig for silicon semiconductor substrate
12/22/2005US20050282092 Etching photomasks, photoresists; photolithography; depth of focus
12/22/2005US20050282074 Method of manufacturing a semiconductor device
12/22/2005US20050282019 Method for manufacturing semiconductor substrate and semiconductor substrate
12/22/2005US20050282015 Composition for low dielectric material, low dielectric material and method for production thereof
12/22/2005US20050281983 Polishing pad having a pressure relief channel
12/22/2005US20050281981 Fixtures and methods for facilitating the fabrication of devices having thin film materials
12/22/2005US20050281954 Method for producing a pellicle for lithography
12/22/2005US20050281951 Dielectric barrier discharge method for depositing film on substrates
12/22/2005US20050281947 Substrate processing unit and substrate processing apparatus
12/22/2005US20050281658 Method for conveying and apparatus using the same
12/22/2005US20050281639 Transport apparatus
12/22/2005US20050281638 Insertion device, lithographic apparatus with said insertion device and device manufacturing method
12/22/2005US20050281125 Split gate type flash memory device and method for manufacturing same
12/22/2005US20050281119 Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device
12/22/2005US20050281118 Integrated semiconductor memory comprising at least one word line and comprising a multiplicity of memory cells
12/22/2005US20050281117 Nonvolatile semiconductor memory device
12/22/2005US20050281110 Semiconductor integrated circuit device
12/22/2005US20050281107 Semiconductor memory
12/22/2005US20050281092 Nand memory arrays
12/22/2005US20050281087 Non-volatile semiconductor memory device
12/22/2005US20050281086 Non-volatile semiconductor memory
12/22/2005US20050281084 Methods of making electromechanical three-trace junction devices
12/22/2005US20050281079 Magnetic random access memory and method of manufacturing the same
12/22/2005US20050281078 Method and system for data communication on a chip
12/22/2005US20050281077 Semiconductor memory device
12/22/2005US20050281069 Computer systems, processes for turning a SRAM cell off, and processes for writing a SRAM cell
12/22/2005US20050280910 Method for the targeted deformation of an optical element
12/22/2005US20050280893 Surface protective member for transmission screen
12/22/2005US20050280879 Method and apparatus for scanning a beam of light
12/22/2005US20050280832 Database interpolation method for optical measurement of diffractive microstructures
12/22/2005US20050280807 Method and system for inspecting a wafer
12/22/2005US20050280805 Mura defect inspection mask, apparatus and method of inspecting the mura defect, and method of producing a photomask
12/22/2005US20050280800 Optical proximity correction using chamfers and rounding at corners
12/22/2005US20050280799 Moving mechanism and stage system in exposure apparatus
12/22/2005US20050280796 Illumination optical system and method, and exposure apparatus
12/22/2005US20050280795 Lithographic apparatus and device manufacturing method
12/22/2005US20050280790 Processing apparatus for processing object in vessel
12/22/2005US20050280789 Lithographic apparatus, device manufacturing method, and mask having a pellicle attached hereto
12/22/2005US20050280764 Liquid crystal display and fabricating method thereof
12/22/2005US20050280681 Heat treatment apparatus
12/22/2005US20050280503 Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit
12/22/2005US20050280486 Transmission line and semiconductor integrated circuit device
12/22/2005US20050280431 Transporting mechanism, movable probe card transporting apparatus using transporting mechanism, and prober
12/22/2005US20050280428 Probe card and the production method
12/22/2005US20050280164 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
12/22/2005US20050280161 Unmolded package for a semiconductor device
12/22/2005US20050280160 Method for manufacturing wafer level chip stack package
12/22/2005US20050280159 Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device
12/22/2005US20050280158 Prefabricated semiconductor chip carrier
12/22/2005US20050280156 Semiconductor device with base support structure
12/22/2005US20050280155 Semiconductor bonding and layer transfer method
12/22/2005US20050280154 Semiconductor memory device
12/22/2005US20050280153 Wired circuit forming board, wired circuit board, and thin metal layer forming method
12/22/2005US20050280152 Interlayer connector for preventing delamination of semiconductor device and methods of forming same
12/22/2005US20050280151 Methods for forming openings in doped silicon dioxide
12/22/2005US20050280146 Interposer containing bypass capacitors for reducing voltage noise in an IC device
12/22/2005US20050280145 Semiconductor die package with internal bypass capacitors
12/22/2005US20050280143 Apparatus for molding a semiconductor die package with enhanced thermal conductivity
12/22/2005US20050280141 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
12/22/2005US20050280140 Packaging for enhanced thermal and structural performance of electronic chip modules
12/22/2005US20050280139 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
12/22/2005US20050280137 Method and apparatus for providing wafer-level capacitive decoupling
12/22/2005US20050280136 Method for producing Z-axis interconnection assembly of printed wiring board elements
12/22/2005US20050280135 Stacking system and method
12/22/2005US20050280133 Multiple device package
12/22/2005US20050280130 Printed wiring board and production method for printed wiring board
12/22/2005US20050280129 Semiconductor device and manufacturing method therefor
12/22/2005US20050280126 Flip chip in leaded molded package and method of manufacture thereof
12/22/2005US20050280125 Co-packaged control circuit, transistor and inverted diode
12/22/2005US20050280123 Semiconductor devices and methods of manufacturing the same
12/22/2005US20050280122 Semiconductor device, and fabrication method of semiconductor device
12/22/2005US20050280121 Hybrid substrate technology for high-mobility planar and multiple-gate MOSFETs
12/22/2005US20050280119 Integrated circuit chip manufacturing method and semiconductor device
12/22/2005US20050280118 Methods of manufacturing metal-silicide features
12/22/2005US20050280117 Vertical diode structures
12/22/2005US20050280115 Trench isolation structure having an implanted buffer layer and a method of manufacture therefor
12/22/2005US20050280113 Semiconductor device capable of threshold voltage adjustment by applying an external voltage
12/22/2005US20050280112 Semiconductor assembly having substrate with electroplated contact pads
12/22/2005US20050280106 MEMS structure and method for fabricating the same
12/22/2005US20050280105 Method of forming metal/high-k gate stacks with high mobility
12/22/2005US20050280104 CMOS transistor with dual high-k gate dielectric and method of manufacture thereof
12/22/2005US20050280103 Strained-semiconductor-on-insulator finFET device structures
12/22/2005US20050280102 Field effect transistor and method for manufacturing the same
12/22/2005US20050280101 Laterally diffused MOS transistor having N+ source contact to N-doped substrate
12/22/2005US20050280100 Laterally diffused MOS device
12/22/2005US20050280099 Temperature stable metal nitride gate electrode
12/22/2005US20050280098 Method of fabricating CMOS transistor and CMOS transistor fabricated thereby
12/22/2005US20050280097 Dual gate dielectric thickness devices
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