Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/22/2005WO2005122281A2 Gate stack of nanocrystal memory and method for forming same
12/22/2005WO2005122280A1 Semiconductor device and communication system
12/22/2005WO2005122279A1 Field effect transistor and production process thereof
12/22/2005WO2005122276A1 Semiconductor device and manufacturing method thereof
12/22/2005WO2005122275A2 Semiconductor on insulator semiconductor device and method of manufacture
12/22/2005WO2005122274A1 Insulated gate semiconductor device and method for manufacturing same
12/22/2005WO2005122272A1 Mis field-effect transistor having strained silicon channel layer
12/22/2005WO2005122270A2 Gated field effect devices and methods of forming a gated field effect device
12/22/2005WO2005122267A2 Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy
12/22/2005WO2005122264A2 Method and process intermediate for electrostatic discharge protection in flat panel imaging detectors
12/22/2005WO2005122259A1 Magnetic memory
12/22/2005WO2005122257A1 Semiconductor device incorporating capacitor and process for manufacturing same
12/22/2005WO2005122254A2 Gate stack and gate stack etch sequence for metal gate integration
12/22/2005WO2005122253A2 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS
12/22/2005WO2005122251A1 Surface mounting electronic component and manufacturing method thereof
12/22/2005WO2005122250A2 High power mcm package with improved planarity and heat dissipation
12/22/2005WO2005122248A1 Semiconductor components having a plastic housing, and method for the production thereof
12/22/2005WO2005122246A1 Semiconductor device and semiconductor device manufacturing method
12/22/2005WO2005122245A2 Formation of metal-insulator metal capacitor using a hardmask
12/22/2005WO2005122244A1 Semiconductor storage
12/22/2005WO2005122243A2 Method and apparatus for cleaving brittle materials
12/22/2005WO2005122242A1 Stage apparatus, exposure apparatus, and exposure method
12/22/2005WO2005122241A1 Container opening and closing device and container mounting position adjusting method for the device
12/22/2005WO2005122240A1 Silicon wafer for probe bonding and probe bonding method using thereof
12/22/2005WO2005122239A1 Failure analysis system and failure area displaying method
12/22/2005WO2005122238A1 Process for fabricating semiconductor integrated circuit device
12/22/2005WO2005122237A1 Component mounting method and component mounting apparatus
12/22/2005WO2005122236A2 Semiconductor device with reduced contact resistance
12/22/2005WO2005122235A2 Methods and devices for forming nanostructure monolayers and devices including such monolayers
12/22/2005WO2005122234A1 Field-effect transistor, semiconductor device, a method for manufacturing them, and a method of semiconductor crystal growth
12/22/2005WO2005122233A1 Shot key gate organic field effect transistor and manufacturing method thereof
12/22/2005WO2005122232A1 High electron mobility transistor (hemt) made of layers of group xiii element nitrides and manufacturing method thereof.
12/22/2005WO2005122231A1 Heating furnace for manufacturing semiconductor device and method for manufacturing semiconductor device
12/22/2005WO2005122230A1 Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method
12/22/2005WO2005122229A1 Material for forming capacitor film
12/22/2005WO2005122228A1 Method for preparing a gap-filling dielectric film
12/22/2005WO2005122227A1 Reduction of cracking in low-k spin-on-dielectric films
12/22/2005WO2005122226A1 Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
12/22/2005WO2005122225A1 Silicon wafer manufacturing method
12/22/2005WO2005122224A2 Improved dual damascene integration structures and method of forming improved dual damascene integration structures
12/22/2005WO2005122223A1 Production method of compound semiconductor device wafer
12/22/2005WO2005122222A1 Laser irradiation method and apparatus, method for annealing non-single crystal, and method for manufacturing semiconductor device
12/22/2005WO2005122221A1 Exposure equipment, exposure method and device manufacturing method
12/22/2005WO2005122220A1 Exposure apparatus, exposure method, and device producing method
12/22/2005WO2005122219A1 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
12/22/2005WO2005122218A1 Exposure system and device production method
12/22/2005WO2005122217A1 Thermosetting polymer bonding for micro electro-mechanical systems
12/22/2005WO2005122216A1 Processing system and method for treating a substrate
12/22/2005WO2005122215A1 Method of operating a processing system for treating a substrate
12/22/2005WO2005122195A2 Fabrication of interconnect structures
12/22/2005WO2005122194A1 Microfabricated system for magnetic field generation and focusing
12/22/2005WO2005122177A1 Semiconductor integrated circuit
12/22/2005WO2005121912A1 Method of controlling operation of a processing system
12/22/2005WO2005121902A1 Electron beam position fluctuation measurement method, electron beam position fluctuation measurement device, and electron beam recording device
12/22/2005WO2005121895A1 Positive photosensitive resin composition
12/22/2005WO2005121884A1 Active matrix board and liquid crystal display device
12/22/2005WO2005121843A1 Transmissive element
12/22/2005WO2005121621A1 Locking device
12/22/2005WO2005121407A2 Method and system for supplying carbon dioxide
12/22/2005WO2005121400A1 Solution raw material for organic metal chemical vapor deposition and complex oxide dielectric thin film formed by using such raw material
12/22/2005WO2005121399A1 Precursors for deposition of silicon nitride, silicon oxynitride and metal silicon oxynitrides
12/22/2005WO2005121395A1 Methods of making gold nitride
12/22/2005WO2005121266A1 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
12/22/2005WO2005121193A1 Polymer, positive resist composition and method for forming resist pattern
12/22/2005WO2005121019A1 Method for manufacturing nanostructure and nanostructure
12/22/2005WO2005121018A1 Vent closing method and the use of an ultrasonic bonding machine for carrying out said method
12/22/2005WO2005120810A1 Nano imprint system
12/22/2005WO2005106940A3 High performance cmos transisitors using pmd linear stress
12/22/2005WO2005104814A3 Composite ground shield for passive components in a semiconductor die
12/22/2005WO2005104216A3 Processing system and method for treating a substrate
12/22/2005WO2005104215A3 Method and system for adjusting a chemical oxide removal process using partial pressure
12/22/2005WO2005101481A3 Power semiconductor
12/22/2005WO2005099028A3 Embedded capacitors using conductor filled vias
12/22/2005WO2005082774A3 Method for making a planar cantilever mems switch
12/22/2005WO2005081702A3 Integrated getter area for wafer level encapsulated microelectromechanical systems
12/22/2005WO2005079454A3 Polymer via etching process
12/22/2005WO2005076795A3 Method for forming a semiconductor device with local semiconductor-on- insulator (soi)
12/22/2005WO2005076679A3 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
12/22/2005WO2005052994A3 Protecting thin semiconductor wafers during back-grinding in high-volume production
12/22/2005WO2005050699A3 Method of forming a semiconductor package and structure thereof
12/22/2005WO2005047117A3 Front opening substrate container with bottom plate
12/22/2005WO2005043594B1 Method for forming photo-defined micro electrical contacts
12/22/2005WO2005029551A3 Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
12/22/2005WO2005028663A3 Operator independent programmable sample preparation and analysis system
12/22/2005WO2004109031B1 Surface-covering article and methods of installing the same
12/22/2005WO2004105117A8 Production of an optoelectronic component that is encapsulated in plastic, and corresponding methods
12/22/2005WO2004095567A8 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material
12/22/2005WO2004081258A3 Apparatus and method for non-contact cleaning of a surface
12/22/2005WO2004017379A3 Process and system for processing a thin film sample and thin film structure
12/22/2005WO2003080796A3 Ordered biological nanostructures formed from chaperonin polypeptides
12/22/2005US20050283743 Method for generating hardware information
12/22/2005US20050283668 Noise checking method and apparatus and computer-readable recording medium which records a noise checking program thereon
12/22/2005US20050283349 Design method, design program, and storage medium for semiconductor integrated device
12/22/2005US20050283335 Integrated circuit and methods of measurement and preparation of measurement structure
12/22/2005US20050283266 Method and system for providing unit level traceability of semiconductor die
12/22/2005US20050282987 Copolymerized high polymer film and method of manufacturing the same
12/22/2005US20050282975 Silicone epoxy formulations
12/22/2005US20050282924 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
12/22/2005US20050282476 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
12/22/2005US20050282475 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
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