Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/18/2014US8652859 Method for manufacturing light-emitting device and manufacturing apparatus of light-emitting device
02/18/2014US8652858 Chip testing method
02/18/2014US8652857 Test apparatus, test method and manufacturing method for testing a device under test packaged in a test package
02/18/2014US8652856 Method for use in making electronic devices having thin-film magnetic components
02/18/2014US8652855 Low resistance stacked annular contact
02/18/2014US8652854 Manufacturing method of a semiconductor device
02/18/2014US8652762 Organic graded spin on BARC compositions for high NA lithography
02/18/2014US8652755 Positive photosensitive resin composition and lyophobic film
02/18/2014US8652344 Liquid treatment method and storage system
02/18/2014US8652343 Method for selectively removing material from the surface of a substrate, masking material for a wafer, and wafer with masking material
02/18/2014US8652306 Method for manufacturing mask blank, method for manufacturing transfer mask, sputtering target for manufacturing mask blank
02/18/2014US8652297 Symmetric VHF plasma power coupler with active uniformity steering
02/18/2014US8652296 Side gas injector for plasma reaction chamber
02/18/2014US8652295 CMP tool implementing cyclic self-limiting CM process
02/18/2014US8652260 Apparatus for holding semiconductor wafers
02/18/2014US8652258 Substrate treatment device
02/18/2014US8651789 Substrate processing apparatus
02/18/2014US8651363 Joining method and device produced by this method and joining unit
02/18/2014US8651049 Plasma processing apparatus
02/18/2014CA2630885C Apparatus and method for wet-chemical processing of flat, thin substrates in a continuous method
02/13/2014WO2014026034A1 Methods of making packages using thin cu foil supported by carrier cu foil
02/13/2014WO2014026018A1 Iii-nitride enhancement mode transistors with tunable and high gate-source voltage rating
02/13/2014WO2014026011A1 A reliable physical unclonable function for device authentication
02/13/2014WO2014025937A1 Ultra-high purity storage and dispensing of liquid reagents
02/13/2014WO2014025918A1 Linked vacuum processing tools and methods of using the same
02/13/2014WO2014025722A2 Method and system for gallium nitride electronic devices using engineered substrates
02/13/2014WO2014025637A1 Apparatus and methods for handling workpieces of different sizes
02/13/2014WO2014025603A1 Universal fixture for machining a flat substrate
02/13/2014WO2014025508A1 Method and apparatus deposition process synchronization
02/13/2014WO2014025507A1 Flowable carbon for semiconductor processing
02/13/2014WO2014025487A1 Method for vacuum assisted underfilling of an electronic device
02/13/2014WO2014025442A1 Laser sustained plasma bulb including water
02/13/2014WO2014025164A1 Printed matter and method for manufacturing such printed matter
02/13/2014WO2014025002A1 Semiconductor device and method for fabricating the same
02/13/2014WO2014024958A1 Production method for minute convex-shaped pattern structure and minute convex-shaped pattern structure production system
02/13/2014WO2014024930A1 Polishing composition, method for producing said polishing composition, and method for producing semiconductor substrate using said polishing composition
02/13/2014WO2014024865A1 Target supply apparatus and extreme ultraviolet light generating apparatus
02/13/2014WO2014024861A1 Wafer processing method
02/13/2014WO2014024849A1 Method for manufacturing semiconductor device and adhesive for mounting flip chip
02/13/2014WO2014024836A1 Composition for forming resist underlayer film
02/13/2014WO2014024833A1 Plasma etching method and plasma etching apparatus
02/13/2014WO2014024829A1 Processing method for wafer
02/13/2014WO2014024808A1 Semiconductor device and manufacturing method thereof
02/13/2014WO2014024796A1 Semiconductor device and method for producing same
02/13/2014WO2014024738A1 Substrate processing device, data collection method, and program
02/13/2014WO2014024737A1 Method of producing semiconductor substrate product and etching liquid
02/13/2014WO2014024733A1 Multi-layer film etching method and plasma processing apparatus
02/13/2014WO2014024726A1 Electronic apparatus and method for manufacturing electronic apparatus
02/13/2014WO2014024695A1 Piezoelectric element, piezoelectric device, ink-jet head, and ink-jet printer
02/13/2014WO2014024690A1 Industrial robot
02/13/2014WO2014024611A1 Method for producing semiconductor device
02/13/2014WO2014024589A1 Semiconductor device producing method
02/13/2014WO2014024583A1 Air bearing device and coating device
02/13/2014WO2014024568A1 Silicon-carbide semiconductor device and manufacturing method therefor
02/13/2014WO2014024546A1 Plasma processing apparatus and high frequency generator
02/13/2014WO2014024483A1 Object-swapping method, object-swapping system, exposure apparatus, method for manufacturing flat-panel display, and method for manufacturing device
02/13/2014WO2014024469A1 Silicon carbide semiconductor device and method for producing same
02/13/2014WO2014024465A1 Exposure method, method for manufacturing flat-panel display, and method for manufacturing device
02/13/2014WO2014024423A1 Mold manufacturing method and mold manufactured using same
02/13/2014WO2014024414A1 Etching fluid for forming texture and texture-forming method using same
02/13/2014WO2014024404A1 Production method for epitaxial silicon wafer and epitaxial silicon wafer
02/13/2014WO2014024343A1 Mounting method
02/13/2014WO2014024310A1 Semiconductor element, hemt element, and method for manufacturing semiconductor element
02/13/2014WO2014024266A1 Semiconductor device producing method and semiconductor device
02/13/2014WO2014024216A1 Dry etching device and dry etching method
02/13/2014WO2014024178A1 Method of improving wafer yield
02/13/2014WO2014024108A1 Led package and manufacturing method
02/13/2014WO2014023633A1 Mounting for a plurality of disk-shaped workpieces
02/13/2014WO2014023413A1 Terminal for mechanical support of a heating element
02/13/2014WO2014023320A1 Method for producing a hermetically sealed housing
02/13/2014WO2014023113A1 Quad flat non-leaded package and packaging method thereof
02/13/2014WO2014023047A1 Finfet and method for manufacture thereof
02/13/2014WO2014022953A1 Semiconductor device manufacturing method
02/13/2014WO2013192615A3 Primed edge sealing tape for photovoltaic module
02/13/2014US20140045411 Methods of and apparatus for producing wafers
02/13/2014US20140045347 Systems and methods for processing a film, and thin films
02/13/2014US20140045346 Systems and methods for preparation of epitaxially textured thick films
02/13/2014US20140045345 Semiconductor device and manufacturing method of the same
02/13/2014US20140045344 Coater apparatus and coating method
02/13/2014US20140045343 Thin film deposition apparatus
02/13/2014US20140045342 Flowable carbon for semiconductor processing
02/13/2014US20140045341 Pattern forming method
02/13/2014US20140045340 Method and apparatus for processing a semiconductor workpiece
02/13/2014US20140045339 Substrate treatment apparatus and substrate treatment method
02/13/2014US20140045338 Plasma etching method
02/13/2014US20140045337 Heating plate with planar heater zones for semiconductor processing
02/13/2014US20140045336 Method of manufacturing a semiconductor device
02/13/2014US20140045335 Photo lithographic rinse solution and method of manufacturing a semiconductor device using the same
02/13/2014US20140045334 Methods of Providing Photolithography Patterns Using Feature Parameters, Systems and Computer Program Products Implementing the Same
02/13/2014US20140045333 Double contacts for carbon nanotubes thin film devices
02/13/2014US20140045332 Through Silicon Via Keep Out Zone Formation Method and System
02/13/2014US20140045331 Self-aligned barrier and capping layers for interconnects
02/13/2014US20140045330 Methods of in-situ vapor phase deposition of self-assembled monolayers as copper adhesion promoters and diffusion barriers
02/13/2014US20140045329 Method for forming cu wiring
02/13/2014US20140045328 Interconnection structure for n/p metal gates
02/13/2014US20140045326 Method of making a semiconductor device having a post-passivation interconnect structure
02/13/2014US20140045325 Method for fabricating an inter dielectric layer in semiconductor device
02/13/2014US20140045324 Low temperature epitaxy of a semiconductor alloy including silicon and germanium employing a high order silane precursor
02/13/2014US20140045323 Synthesis, capping and dispersion of nanocrystals
02/13/2014US20140045322 Method for manufacturing silicon carbide semiconductor device