Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/19/2014EP2698809A1 Polishing pad and manufacturing method therefor
02/19/2014EP2698808A1 Silicon carbide semiconductor device, and method for producing same
02/19/2014EP2698807A1 Method for producing silicon carbide semiconductor device
02/19/2014EP2698806A1 Method for producing a dopant profile in a semiconductor substrate
02/19/2014EP2698684A1 Semiconductor integrated circuit
02/19/2014EP2698455A1 Perovskite-type manganese oxide thin film
02/19/2014EP2697835A1 Method for producing a semiconductor body
02/19/2014EP2697826A1 Low temperature deposition of silicon oxide films
02/19/2014EP2697825A1 Method for manufacturing an opto-microelectronic device
02/19/2014EP2697824A1 Device and method for transferring electronic components from a first carrier to a second carrier
02/19/2014EP2697823A1 Bendable carrier mounting, device and method for releasing a carrier substrate
02/19/2014EP2697822A2 Selective laser-assisted transfer of discrete components
02/19/2014EP2697821A1 An electrical conductor
02/19/2014EP2697820A1 Wet-chemical systems and methods for producing black silicon substrates
02/19/2014EP2697689A1 Lithography process
02/19/2014EP2697632A1 Method for determining interstitial oxygen concentration
02/19/2014EP2697330A2 Compositions and methods for selective polishing of silicon nitride materials
02/19/2014EP2697158A1 Wafer with recessed plug
02/19/2014EP2697157A1 Wafer with spacer including horizontal member
02/19/2014CN203445132U Schottky device with simplified manufacturing process
02/19/2014CN203445120U Array substrate and display apparatus
02/19/2014CN203445112U Frame lead bonding tool
02/19/2014CN203445109U Thickened IC chip
02/19/2014CN203445105U Chip transmission protective device
02/19/2014CN203445104U Wafer support
02/19/2014CN203445103U High-reliability frame lead bonding tool
02/19/2014CN203445102U Double-track double-control diode consistent machine
02/19/2014CN203444014U Device for detecting resistivity
02/19/2014CN203437362U Cleaning device for wafers
02/19/2014CN1681365B Organic electroluminescence display device and method of fabricating the same
02/19/2014CN103597619A Method for manufacturing element
02/19/2014CN103597604A Method for manufacturing solar cell
02/19/2014CN103597602A Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
02/19/2014CN103597599A Spin torque transfer memory cell structures and methods
02/19/2014CN103597598A Interdigitated vertical native capacitor
02/19/2014CN103597596A Signal routing using through-substrate vias
02/19/2014CN103597590A 键合线及其制造方法 Bonding wire and manufacturing method thereof
02/19/2014CN103597589A Selective laser-assisted transfer of discrete components
02/19/2014CN103597588A Nitride semiconductor device
02/19/2014CN103597587A Novel thermal processing apparatus
02/19/2014CN103597586A Method for forming texture structure and method for manufacturing solar cell
02/19/2014CN103597585A Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor
02/19/2014CN103597584A Polishing pad and manufacturing method therefor
02/19/2014CN103597583A Method of washing semiconductor manufacturing apparatus component, apparatus for washing semiconductor manufacturing apparatus component, and vapor phase growth apparatus
02/19/2014CN103597582A Nitride semiconductor device and method for manufacturing same
02/19/2014CN103597581A Methods for cleaning a surface of a substrate using a hot wire chemical vapor deposition (HWCVD) chamber
02/19/2014CN103597580A Apparatus for deposition of materials on a substrate
02/19/2014CN103597579A EUV lithography flare calculation and compensation
02/19/2014CN103597578A Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
02/19/2014CN103597577A Device for treating surfaces of wafer-shaped articles
02/19/2014CN103597576A Vacuum seal arrangement useful in plasma processing chamber
02/19/2014CN103597115A Plasma film forming apparatus and plasma film forming method
02/19/2014CN103597013A Aromatic polyamide films for transparent flexible substrates
02/19/2014CN103597000A Resin composition for nano concave-convex structure, transparent member for cover of vehicle meter using same composition and transparent member for monitor of vehicle navigation device
02/19/2014CN103596875A Wafer with recessed plug
02/19/2014CN103596727A Abrasive and polishing composition
02/19/2014CN103596373A Integrated circuit plate manufacturing method based on copper nitride film
02/19/2014CN103594554A Process for manufacturing small solar assembly
02/19/2014CN103594553A Array type silicon wafer loading target disk
02/19/2014CN103594522A Thin film transistor, method of manufacturing the same, and display device including the same
02/19/2014CN103594520A Double-diffused metal oxide semiconductor and method of manufacturing same
02/19/2014CN103594519A Tunneling field effect floating gate transistor and manufacturing method thereof
02/19/2014CN103594518A Metal source-drain structure and forming method thereof
02/19/2014CN103594516A Semiconductor device and method of making the same
02/19/2014CN103594515A Semiconductor device and method of fabricating the same
02/19/2014CN103594514A Charge compensation MOS device and preparation method thereof
02/19/2014CN103594513A Semiconductor device and making method thereof
02/19/2014CN103594512A Semiconductor device and making method thereof
02/19/2014CN103594511A Semiconductor device and manufacture method thereof
02/19/2014CN103594509A GaN transistor with high electron mobility and manufacturing method thereof
02/19/2014CN103594507A High breakdown voltage III-nitride device
02/19/2014CN103594505A High-voltage IGBT module capable of weakening partial discharge and manufacturing method thereof
02/19/2014CN103594500A Preparation method for silicon-germanium heterojunction bipolar transistor (SiGe HBT)
02/19/2014CN103594497A Semiconductor device and making method thereof
02/19/2014CN103594496A Semiconductor device and making method thereof
02/19/2014CN103594495A semiconductor device and making method thereof
02/19/2014CN103594494A Charge-compensation schottky semiconductor device and manufacturing method thereof
02/19/2014CN103594493A Trench-structure charge compensation Schottky semiconductor device and preparation method thereof
02/19/2014CN103594492A A LDMOS transistor and a forming method thereof
02/19/2014CN103594491A CDMOS technology and a manufacturing method
02/19/2014CN103594487A Organic light-emitting display apparatus and method of manufacturing the same
02/19/2014CN103594477A Semiconductor photosensitive device and manufacturing method thereof
02/19/2014CN103594476A Thin film transistor substrate, method for manufacturing the same and organic light emitting device using the same
02/19/2014CN103594475A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/19/2014CN103594474A Semiconductor memory device and method of manufacturing the same
02/19/2014CN103594473A Nonvolatile memory device and method for fabricating the same
02/19/2014CN103594472A 非挥发性存储器单元及其制造方法 Non-volatile memory cell and its manufacturing method
02/19/2014CN103594471A Three-dimensional writable printed memory
02/19/2014CN103594470A Integrated circuit having a vertical power MOS transistor
02/19/2014CN103594469A Vertical power MOSFET and methods of forming the same
02/19/2014CN103594467A Power semiconductor device integrating fly-wheel diode and forming method thereof
02/19/2014CN103594466A Power semiconductor device integrating fly-wheel diode and forming method thereof
02/19/2014CN103594452A A semiconductor multilayer structure and a manufacturing method thereof
02/19/2014CN103594451A Multi-layer multi-chip fan-out structure and manufacturing method
02/19/2014CN103594447A IC chip stack packaged component large in packaging density and good in high frequency performance and manufacturing method thereof
02/19/2014CN103594445A W-wave-band IMPATT diode impedance matching pin and manufacturing method of W-wave-band IMPATT diode impedance matching pin
02/19/2014CN103594441A Semiconductor package and method of manufacturing the same
02/19/2014CN103594438A Fully-enclosed phase-change type radiator and manufacturing method and applications thereof
02/19/2014CN103594434A Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer
02/19/2014CN103594425A Packaging technology and structure of flexible substrate
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