Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/20/2014WO2014028542A1 Nanostructured cigs absorber surface for enhanced light trapping
02/20/2014WO2014028513A1 Automated inspection scenario generation
02/20/2014WO2014028483A1 Optical characterization systems employing compact synchrotron radiation sources
02/20/2014WO2014028433A1 Mos transistors having reduced leakage well-substrate junctions
02/20/2014WO2014028349A1 Bonding of thin lamina
02/20/2014WO2014028280A2 Conductive, metallic and semiconductor ink compositions
02/20/2014WO2014028268A2 Method of fabricating a gallium nitride merged p-i-n schottky (mps) diode by regrowth and etch back
02/20/2014WO2014028192A1 Methods for controlling defects for extreme ultraviolet lithography (euvl) photomask substrate
02/20/2014WO2014028140A1 Method of making a three-dimensional memory array with etch stop
02/20/2014WO2014028131A1 An integrated circuit having improved radiation immunity
02/20/2014WO2014028066A1 Flexible sized die for use in multi-die integrated circuit
02/20/2014WO2014027691A1 Semiconductor device and method for manufacturing same
02/20/2014WO2014027662A1 Semiconductor device
02/20/2014WO2014027618A1 Thin film transistor
02/20/2014WO2014027600A1 Diamond semiconductor device and method for manufacturing same
02/20/2014WO2014027566A1 Method of preventing oxidation and method of producing a semiconductor product
02/20/2014WO2014027520A1 Silicon carbide semiconductor device
02/20/2014WO2014027519A1 Method for manufacturing silicon-carbide semiconductor device
02/20/2014WO2014027518A1 Silicon-carbide semiconductor device and manufacturing method therefor
02/20/2014WO2014027517A1 Cleaning device using spin table
02/20/2014WO2014027516A1 Immersion-type cleaning device
02/20/2014WO2014027515A1 Cleaning device using mixing nozzle
02/20/2014WO2014027484A1 Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored
02/20/2014WO2014027483A1 Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored
02/20/2014WO2014027468A1 Semiconductor device having semiconductor pillar
02/20/2014WO2014027418A1 Electronic component, and method for producing electronic component
02/20/2014WO2014027380A1 Group iii nitride semiconductor element and method for manufacturing same
02/20/2014WO2014027376A1 Thermosetting resin sheet, semiconductor device, and method for manufacturing semiconductor device
02/20/2014WO2014026593A1 Plasma processing apparatus
02/20/2014WO2014026497A1 Anti-radiation complementary metal oxide semiconductor (cmos) device and preparation method thereof
02/20/2014WO2014026458A1 Six-transistor static random access memory unit and manufacturing method thereof
02/20/2014WO2014026307A1 Semiconductor device and manufacturing method thereof
02/20/2014WO2014026306A1 Semiconductor device and manufacturing method thereof
02/20/2014WO2014026304A1 Semiconductor device manufacturing method
02/20/2014WO2014026293A1 Built-in vertical doping structures for the monolithic integration of tunnel junctions in photovoltaic structures
02/20/2014WO2014004012A3 High voltage three-dimensional devices having dielectric liners
02/20/2014WO2013188410A3 N-channel and p-channel end-to-end finfet cell architecture
02/20/2014WO2013184638A3 Strain control for acceleration of epitaxial lift-off
02/20/2014WO2013184170A3 Semiconductor wafer isolated transfer chuck
02/20/2014WO2013176960A3 Multi-level contact to a 3d memory array and method of making
02/20/2014WO2013173743A3 Aqueous clean solution with low copper etch rate for organic residue removal improvement
02/20/2014WO2013163462A3 Compact tid hardening nmos device and fabrication process
02/20/2014WO2013102731A3 Method for the low-temperature production of radial-junction semiconductor nanostructures, radial junction device, and solar cell including radial-junction nanostructures
02/20/2014WO2013092759A3 Method for etching of sio2 layers on thin wafers
02/20/2014US20140052289 Mounting apparatus, method of disposing members, and method of manufacturing substrate
02/20/2014US20140051265 Apparatus and method for the thermal treatment of substrates
02/20/2014US20140051264 Flowable films using alternative silicon precursors
02/20/2014US20140051263 Film forming method
02/20/2014US20140051262 Methods for uv-assisted conformal film deposition
02/20/2014US20140051261 Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus
02/20/2014US20140051260 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
02/20/2014US20140051259 Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
02/20/2014US20140051258 Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
02/20/2014US20140051257 Etching Apparatus and Method
02/20/2014US20140051256 Etch with mixed mode pulsing
02/20/2014US20140051255 Copper discoloration prevention following bevel etch process
02/20/2014US20140051254 Movable chamber liner plasma confinement screen combination for plasma processing apparatuses
02/20/2014US20140051253 Plasma baffle ring for a plasma processing apparatus and method of use
02/20/2014US20140051252 Device manufacturing and cleaning method
02/20/2014US20140051251 Methods Of Forming a Pattern on a Substrate
02/20/2014US20140051250 Cmp polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
02/20/2014US20140051249 Substrate polishing apparatus
02/20/2014US20140051248 Inkjet printable etch resist
02/20/2014US20140051247 Fin structure formation including partial spacer removal
02/20/2014US20140051246 Methods of fabricating a semiconductor device
02/20/2014US20140051245 Device and method for knife coating an ink based on copper and indium
02/20/2014US20140051242 Conductive Metallic and Semiconductor Ink Composition
02/20/2014US20140051241 Method for manufacturing silicon carbide semiconductor device
02/20/2014US20140051240 Methods of forming a replacement gate structure having a gate electrode comprised of a deposited intermetallic compound material
02/20/2014US20140051239 Disposable carbon-based template layer for formation of borderless contact structures
02/20/2014US20140051238 Method for producing semiconductor device
02/20/2014US20140051237 Semiconductor Ink Composition
02/20/2014US20140051235 Method for producing single crystal sic substrate and single crystal sic substrate produced by the same
02/20/2014US20140051234 Hydrogen passivation of integrated circuits
02/20/2014US20140051233 Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon
02/20/2014US20140051232 Semiconductor die singulation method
02/20/2014US20140051230 Methods for Forming Semiconductor Device Structures
02/20/2014US20140051229 Sub-10 nm graphene nanoribbon lattices
02/20/2014US20140051228 Method for producing vias
02/20/2014US20140051227 Methods of forming isolation structures for semiconductor devices by performing a dry chemical removal process
02/20/2014US20140051226 Growth of multi-layer group iii-nitride buffers on large-area silicon substrates and other substrates
02/20/2014US20140051225 Techniques for gate workfunction engineering to reduce short channel effects in planar cmos devices
02/20/2014US20140051224 Method of back-side patterning
02/20/2014US20140051222 Method of manufacturing semiconductor device
02/20/2014US20140051221 Controlling lateral two-dimensional electron hole gas hemt in type iii nitride devices using ion implantation through gray scale mask
02/20/2014US20140051220 Method for fabricating semiconductor device with reduced miller capacitance
02/20/2014US20140051218 Thin film semiconductor device comprising a polycrystalline semiconductor layer formed on an insulation layer having different thickness
02/20/2014US20140051217 GRAPHENE NANORIBBONS AND CARBON NANOTUBES FABRICATED FROM SiC FINS OR NANOWIRE TEMPLATES
02/20/2014US20140051213 Techniques for Metal Gate Work Function Engineering to Enable Multiple Threshold Voltage Nanowire FET Devices
02/20/2014US20140051212 Method of fabricating a package substrate
02/20/2014US20140051211 Multichip electronic packages and methods of manufacture
02/20/2014US20140051209 Method for manufacturing semiconductor device
02/20/2014US20140051203 Manufacturing method of solid-state image sensor
02/20/2014US20140051191 Extremely non-degenerate two photon absorption optical sensing method, apparatus and applications
02/20/2014US20140051190 Method of large-area circuit layout recognition
02/20/2014US20140051189 Method for wafer-level testing diced multi-chip stacked packages
02/20/2014US20140051025 Negative resist composition and patterning process
02/20/2014US20140050552 Inline system
02/20/2014US20140050242 Optoelectric Integrated Circuit
02/20/2014US20140050029 Split-gate memory cells having select-gate sidewall metal silicide regions and related manufacturing methods
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