Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/26/2014CN103608916A Semiconductor device and method for manufacturing semiconductor device
02/26/2014CN103608914A 碳化硅半导体器件 Silicon carbide semiconductor device
02/26/2014CN103608913A Vias in porous substrates
02/26/2014CN103608912A Buffer sheet used in vacuum chuck that adsorbs object to be processed
02/26/2014CN103608911A Device for static charge reduction
02/26/2014CN103608910A Copper strand for bonding wire and method for producing copper strand for bonding wire
02/26/2014CN103608909A Substrate conveyance method and substrate conveyance device
02/26/2014CN103608908A Bonding method and production method
02/26/2014CN103608907A 半导体装置 Semiconductor device
02/26/2014CN103608906A Method for producing amorphous oxide thin film and thin film transistor
02/26/2014CN103608905A Method for manufacturing semiconductor device
02/26/2014CN103608904A Method for cleaning semiconductor wafer
02/26/2014CN103608903A Polishing pad and manufacturing method therefor
02/26/2014CN103608902A 粘合片 Adhesive sheet
02/26/2014CN103608901A Adhesive tape for semiconductor device dicing
02/26/2014CN103608900A In-situ deposited mask layer for device singulation by laser scribing and plasma etch
02/26/2014CN103608899A Substrate, semiconductor device, method for producing substrate, and method for manufacturing semiconductor device
02/26/2014CN103608898A Dielectric recovery of plasma damaged low-k films by UV-assisted photochemical deposition
02/26/2014CN103608897A Semiconductor thin film structure and method for forming same
02/26/2014CN103608896A Method for producing semiconductor device
02/26/2014CN103608890A Stage device and control method for stage device
02/26/2014CN103608728A Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern
02/26/2014CN103608498A Silicon carbide substrate, semiconductor device, method for producing silicon carbide substrate, and method for manufacturing semiconductor device
02/26/2014CN103608310A Electrically conductive oxide and method for producing same, and oxide semiconductor film
02/26/2014CN103608140A Bonding material and bonded object produced using same
02/26/2014CN103606616A LED packaging process
02/26/2014CN103606602A Method for manufacturing semiconductor chip
02/26/2014CN103606592A A same-side material loading and blanking method and an automatic material loading and blanking mechanism for realizing the above method
02/26/2014CN103606566A Trench Schottky diode structure and manufacturing method thereof
02/26/2014CN103606564A Electrical programming-ultraviolet light erasing memory device structure and preparation method thereof
02/26/2014CN103606563A Junctionless tunneling field effect transistor and formation method thereof
02/26/2014CN103606561A 功率mos管及其制造方法 Power mos tube and its manufacturing method
02/26/2014CN103606554A A bipolar transistor which raises a BVceo and a production technique thereof
02/26/2014CN103606551A Silicon carbide channel-type semiconductor device and manufacturing method thereof
02/26/2014CN103606543A Rewiring metal layer and manufacturing method thereof
02/26/2014CN103606542A TSV metal interconnection structure and manufacturing method thereof
02/26/2014CN103606540A Frame-based small-distance multi-device SMT package and manufacturing process thereof
02/26/2014CN103606539A Frame-based flat package adopting opening-optimization technology and manufacturing process thereof
02/26/2014CN103606538A Semiconductor lamination packaging method
02/26/2014CN103606537A Manufacturing method of bipolar component in BICMOS (bipolar compIementary metal oxide semiconductor) integrated circuit
02/26/2014CN103606536A Method for improving write margin of static random access memory
02/26/2014CN103606535A Flexible display module manufacturing method and flexible display module through method
02/26/2014CN103606534A Semiconductor structure forming method
02/26/2014CN103606533A Manufacturing method for through-hole-priority copper interconnection structure
02/26/2014CN103606532A Method for improving filling capability of copper interconnection trench
02/26/2014CN103606531A Basket special for soaking chip in acid solution
02/26/2014CN103606530A Method for fault detection in plasma etching process of fusion function data description
02/26/2014CN103606529A Method and device for improving defect classification accuracy
02/26/2014CN103606528A Pre-tungsten-growth silicon detection device and method
02/26/2014CN103606527A Semi-automatic wafer ball mounting device
02/26/2014CN103606526A Fastening device for high-power semiconductor device and fastening method thereof
02/26/2014CN103606525A Processing method for improving connection quality of gold wire and copper foil
02/26/2014CN103606524A 一种mosfet结构及其制造方法 One kind of structure and manufacturing method mosfet
02/26/2014CN103606523A GPP diode chip production process
02/26/2014CN103606522A GPP diode chip production process
02/26/2014CN103606521A Manufacturing process of transient voltage suppression diode chip
02/26/2014CN103606520A Method for manufacturing metal protective film used for film circuit test
02/26/2014CN103606519A Method for preparing multilayer composite contact hole etching barrier layer
02/26/2014CN103606518A A wet etching method and a wet etching apparatus
02/26/2014CN103606517A Silicon chip thinning method
02/26/2014CN103606516A Manufacturing method of low-temperature non-gold ohmic contact of GaN-based high-electronic-mobility transistor
02/26/2014CN103606515A Manufacturing method for field plate of wide bandgap power device
02/26/2014CN103606514A Chemical corrosion transfer method based on GaN substrate CVD epitaxial growth graphene
02/26/2014CN103606513A Manufacturing method for semiconductor capacitor
02/26/2014CN103605388A Method for detecting temperature of temperature field of epitaxial furnace platform through ion-implanted chip and method for correcting temperature field of epitaxial furnace platform through ion-implanted chip
02/26/2014CN103605267A Isolation structure for remote radio-frequency plasma source
02/26/2014CN103605262A Exposure apparatus and device production method
02/26/2014CN103604372A Product full range observation and measurement method based on multiple cameras and device thereof
02/26/2014CN103603051A Diffusion chamber and diffusion method used in process of producing semiconductor
02/26/2014CN103603018A Pulse electroplating method and application thereof
02/26/2014CN103598893A System and sensor used for measuring volume of urinary bladder and sensor encapsulating method
02/26/2014CN102723284B Method for manufacturing front-mounted three-dimensional line on single side of chip by using first etching and later packaging and packaging structure of three-dimensional line
02/26/2014CN102637638B Thin-film transistor array substrate and manufacturing method thereof
02/26/2014CN102637634B Array substrate, manufacturing method of array substrate and display device
02/26/2014CN102593052B Manufacture method of pixel structure
02/26/2014CN102591160B Rinse solution for lithography
02/26/2014CN102543864B Thin film transistor array substrate and manufacturing method thereof
02/26/2014CN102543840B Self-aligned contact etch method
02/26/2014CN102543774B Method for packaging chip based on epoxy resin type adhesive
02/26/2014CN102543727B Silicon-germanium heterojunction bipolar transistor (SiGe HBT) structure, pseudo buried layer structure and manufacturing method for SiGe HBT
02/26/2014CN102543697B Method for manufacturing tunnel oxide layer window in electrically erasable programmable read only memory (EEPROM)
02/26/2014CN102543667B Forming method of graph of aligned layer on silicon chip
02/26/2014CN102487077B Vertical parasitic PNP device in BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor) process and preparation method thereof
02/26/2014CN102487027B Method for determining wet etching process window
02/26/2014CN102487011B Low voltage inverted well implantation method of laterally diffused metal oxide semiconductor device
02/26/2014CN102486997B Method for preparing PN (Positive-Negative) junctions by utilizing solid-state phosphorus source for assisting dispersion of phosphorus source gas
02/26/2014CN102479744B Aluminum pore-filling connection process
02/26/2014CN102478762B Photoetching method
02/26/2014CN102456627B Manufacturing method of semiconductor device
02/26/2014CN102446900B Electromigration reliability test structure for multilayer of metal interconnected metal wires
02/26/2014CN102446881B Universal packaging substrate and packaging method thereof
02/26/2014CN102446782B Method for measuring critical dimension by using overlay (OVL) machine table
02/26/2014CN102446758B Asymmetric rapid thermal annealing to reduce pattern effect
02/26/2014CN102437156B Ultralow capacitance transient voltage suppression device and manufacturing method thereof
02/26/2014CN102412296B Super junction semiconductor device structure and manufacturing method thereof
02/26/2014CN102412274B Vertically parasitic PNP device in germanium-silicon HBT (heterojunction bipolar transistor) process and fabrication method thereof
02/26/2014CN102403364B Thin film transistor for display panel and method for making the same
02/26/2014CN102403257B Method for improving deep groove etching boundary profile of super-junction device
02/26/2014CN102403256B Buried layer and manufacturing method, long hole contact and triode
02/26/2014CN102376758B Insulated gate bipolar transistor, manufacturing method thereof and trench gate structure manufacturing method
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