Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/26/2014CN102376619B Method for forming shallow groove structure with ONO as hard mask layer
02/26/2014CN102365303B Polymer, hydride of polymer, resin composition, resin film, and electronic component
02/26/2014CN102318051B Semiconductor chip with reinforcement layer
02/26/2014CN102312189B Film formation apparatus
02/26/2014CN102308362B Method and apparatus for minimizing contamination in semiconductor processing chamber
02/26/2014CN102290326B Jig for retaining lid
02/26/2014CN102280453B 半导体器件 Semiconductor devices
02/26/2014CN102263061B Self-aligned multiple gate transistor formed on bulk substrate and manufacture method thereof
02/26/2014CN102263058B Manufacturing method of semiconductor device
02/26/2014CN102263035B Method for forming oxide thin film transistor (OTFT)
02/26/2014CN102254826B Bi-grid oxide groove mosfet and three or four mask process with passage stop groove
02/26/2014CN102236227B Liquid crystal display device and method of fabricating the same
02/26/2014CN102222638B Method for removing copper residue between copper lead wires
02/26/2014CN102214585B Method of forming gate in metal-oxide semiconductor field-effect transistor
02/26/2014CN102208389B Semiconductor package, substrate and manufacturing method thereof
02/26/2014CN102194755B Fin field effect transistor and method of making the same
02/26/2014CN102194700B Manufacturing method of super-junction semiconductor device
02/26/2014CN102162139B Texturing semiconductor substrates
02/26/2014CN102153695B Photosensitive compositions
02/26/2014CN102148125B Plasma processing apparatus
02/26/2014CN102138198B Process kit shield and method of use thereof
02/26/2014CN102136459B Packaging structure and manufacture method thereof
02/26/2014CN102124819B A composite showerhead electrode assembly for a plasma processing apparatus
02/26/2014CN102112566B Chemical-mechanical polishing liquid
02/26/2014CN102104018B Method for reducing Schottky contact electric leakage formed in contact holes
02/26/2014CN102093929B Method for recycling solar polyethylene glycol (PEG)-based recycling cutting liquid and cutting liquid prepared on basis of method
02/26/2014CN102074462B Method for forming electronic device
02/26/2014CN102061132B Chemical mechanical polishing composition and methods relating thereto
02/26/2014CN102047179B Photosensitive resin composition, process for producing cured relief pattern, and semiconductor device
02/26/2014CN102034695B Enhanced method of forming nickel silicide
02/26/2014CN102024739B Production method for shallow trench isolation area
02/26/2014CN102012574B Manufacturing method of liquid crystal display panel and liquid crystal display substrate
02/26/2014CN101847599B Method of forming sensing circuit and structure therefor
02/26/2014CN101826447B Film deposition apparatus and film deposition method
02/26/2014CN101740612B Contact structure for semiconductor device having trench shield electrode and method
02/26/2014CN101684393B Chemical mechanical polishing sizing agent
02/26/2014CN101550317B Chemical mechanical polishing solution for polishing polysilicon
02/26/2014CN101507000B Method of texturing silicon wafer for fabricating solar cells
02/26/2014CN101398617B Replication and transfer of microstructures and nanostructures
02/26/2014CN101355056B Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate
02/25/2014US8660336 Defect inspection system
02/25/2014US8659532 Semiconductor device
02/25/2014US8659523 Element substrate and light-emitting device
02/25/2014US8659516 Display device
02/25/2014US8659170 Semiconductor device having conductive pads and a method of manufacturing the same
02/25/2014US8659166 Memory device, laminated semiconductor substrate and method of manufacturing the same
02/25/2014US8659157 Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device
02/25/2014US8659156 Interconnect structure with an electromigration and stress migration enhancement liner
02/25/2014US8659147 Power semiconductor circuit device and method for manufacturing the same
02/25/2014US8659143 Stub minimization for wirebond assemblies without windows
02/25/2014US8659142 Stub minimization for wirebond assemblies without windows
02/25/2014US8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
02/25/2014US8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659122 Semiconductor device and manufacturing method thereof
02/25/2014US8659118 Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
02/25/2014US8659117 Lateral power diode with self-biasing electrode
02/25/2014US8659116 Isolated transistor
02/25/2014US8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating
02/25/2014US8659114 Semiconductor device
02/25/2014US8659112 Carbon and nitrogen doping for selected PMOS transistor on an integrated circuit
02/25/2014US8659111 Semiconductor device and method for manufacturing the same
02/25/2014US8659110 Single-junction photovoltaic cell
02/25/2014US8659095 Semiconductor memory device and method of manufacturing the same
02/25/2014US8659093 Continuous metal semiconductor alloy via for interconnects
02/25/2014US8659090 Resistive memory and methods for forming the same
02/25/2014US8659089 Nitrogen passivation of source and drain recesses
02/25/2014US8659088 SRAM cell and SRAM device
02/25/2014US8659085 Lateral connection for a via-less thin film resistor
02/25/2014US8659060 Solid-state imaging device and manufacturing method thereof
02/25/2014US8659055 Semiconductor device, field-effect transistor, and electronic device
02/25/2014US8659054 Method and structure for pFET junction profile with SiGe channel
02/25/2014US8659053 Semiconductor light detecting element
02/25/2014US8659052 Semiconductor device and method for manufacturing the same
02/25/2014US8659035 Light-emitting device, light-emitting device array, optical recording head, image forming apparatus, and method of manufacturing light-emitting device
02/25/2014US8659026 Flat panel display
02/25/2014US8659025 Semiconductor device and method of manufacturing same
02/25/2014US8659024 Array substrate of TFT-LCD including a black matrix and method for manufacturing the same
02/25/2014US8659020 Epitaxial silicon wafer and method for manufacturing same
02/25/2014US8658994 Apparatus and method for controlled particle beam manufacturing
02/25/2014US8658945 Backside rapid thermal processing of patterned wafers
02/25/2014US8658937 Method and apparatus for processing substrate edges
02/25/2014US8658890 Solar cell and method of manufacturing solar cell
02/25/2014US8658887 Substrate provided with transparent conductive film for photoelectric conversion device, method for manufacturing the substrate, and photoelectric conversion device using the substrate
02/25/2014US8658546 Solution composition for forming oxide thin film and electronic device including the oxide thin film
02/25/2014US8658545 Vapor deposition device, vapor deposition method and organic EL display device
02/25/2014US8658544 Method for texturing silicon surfaces and wafers thereof
02/25/2014US8658543 Methods for pFET fabrication using APM solutions
02/25/2014US8658542 Coarse grid design methods and structures
02/25/2014US8658541 Method of controlling trench microloading using plasma pulsing
02/25/2014US8658540 Methods for low temperature conditioning of process chambers
02/25/2014US8658538 Method of fabricating memory device
02/25/2014US8658537 Mask manufacturing method for nanoimprinting
02/25/2014US8658536 Selective fin cut process
02/25/2014US8658535 Optimized annular copper TSV
02/25/2014US8658534 Method for producing a semiconductor component, and semiconductor component
02/25/2014US8658533 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration
02/25/2014US8658532 Method and material for forming a double exposure lithography pattern
02/25/2014US8658531 Method of forming connection holes
02/25/2014US8658530 Method of fabricating an epitaxial Ni silicide film