Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/25/2014US8658529 Method for manufacturing semiconductor device
02/25/2014US8658528 Bumping process and structure thereof
02/25/2014US8658527 Method of manufacturing GaN-based film
02/25/2014US8658526 Methods for increased array feature density
02/25/2014US8658525 Methods for a gate replacement process
02/25/2014US8658524 On-gate contacts in a MOS device
02/25/2014US8658523 Method for making semiconductor insulated-gate field-effect transistor having multilayer deposited metal source(s) and/or drain(s)
02/25/2014US8658522 Methods and apparatus for incorporating nitrogen in oxide films
02/25/2014US8658521 Method and device for layer deposition
02/25/2014US8658520 Method of manufacturing semiconductor device
02/25/2014US8658519 Nanowires, nanowire networks and methods for their formation and use
02/25/2014US8658518 Techniques for metal gate work function engineering to enable multiple threshold voltage nanowire FET devices
02/25/2014US8658517 Method of manufacturing GaN-based film
02/25/2014US8658516 Method of producing silicon wafer, epitaxial wafer and solid state image sensor, and device for producing silicon wafer
02/25/2014US8658515 Method of manufacturing film for semiconductor device
02/25/2014US8658514 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure
02/25/2014US8658513 Isolation by implantation in LED array manufacturing
02/25/2014US8658512 Method for forming MEMS variable capacitors
02/25/2014US8658511 Etching resistive switching and electrode layers
02/25/2014US8658510 Processing phase change material to improve programming speed
02/25/2014US8658509 Semiconductor resistors formed at a lower height level in a semiconductor device comprising metal gates
02/25/2014US8658508 Method for manufacturing SOI substrate
02/25/2014US8658507 MOSFET structure and method of fabricating the same using replacement channel layer
02/25/2014US8658506 Method and apparatus for selectively improving integrated device performance
02/25/2014US8658505 Embedded stressors for multigate transistor devices
02/25/2014US8658504 Method for manufacturing semiconductor device
02/25/2014US8658503 Semiconductor device and method of fabricating the same
02/25/2014US8658502 Method for reducing morphological difference between N-doped and undoped polysilicon gates after etching
02/25/2014US8658501 Method and apparatus for flatband voltage tuning of high-k field effect transistors
02/25/2014US8658500 Single crystal U-MOS gates using microwave crystal regrowth
02/25/2014US8658499 Three dimensional NAND device and method of charge trap layer separation and floating gate formation in the NAND device
02/25/2014US8658498 Single mask spacer technique for semiconductor device features
02/25/2014US8658497 Non-volatile memory (NVM) and logic integration
02/25/2014US8658496 Etch stop layer for memory cell reliability improvement
02/25/2014US8658494 Dual contact metallization including electroless plating in a semiconductor device
02/25/2014US8658493 Manufacturing method of semiconductor device
02/25/2014US8658491 Manufacturing method of transistor structure having a recessed channel
02/25/2014US8658490 Passivating point defects in high-K gate dielectric layers during gate stack formation
02/25/2014US8658489 Method for dual work function metal gate CMOS with selective capping
02/25/2014US8658488 Method for forming semiconductor chip with graphene based devices in an interconnect structure of the chip
02/25/2014US8658487 Semiconductor device and fabrication method thereof
02/25/2014US8658486 Forming facet-less epitaxy with a cut mask
02/25/2014US8658485 Semiconductor device and method of fabricating the same
02/25/2014US8658484 Semiconductor carbon nanotubes fabricated by hydrogen functionalization and method for fabricating the same
02/25/2014US8658483 Method of fabricating an integrated circuit device having backside bevel protection
02/25/2014US8658482 Compound semiconductor device and method for fabricating the same
02/25/2014US8658481 Method for manufacturing semiconductor device
02/25/2014US8658480 Method for manufacturing active array substrate
02/25/2014US8658479 Method of forming transparent electrode and fabricating array substrate for liquid crystal display device
02/25/2014US8658478 Transistor structure for improved static control during formation of the transistor
02/25/2014US8658477 Method for manufacturing a semiconductor device
02/25/2014US8658476 Low temperature P+ polycrystalline silicon material for non-volatile memory device
02/25/2014US8658474 Contact and via interconnects using metal around dielectric pillars
02/25/2014US8658473 Ultrathin buried die module and method of manufacturing thereof
02/25/2014US8658472 Semiconductor device
02/25/2014US8658471 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
02/25/2014US8658470 Integrated circuit packaging system with formed interconnects and method of manufacture thereof
02/25/2014US8658468 Method for fabricating a semiconductor and semiconductor package
02/25/2014US8658467 Method of manufacturing stacked wafer level package
02/25/2014US8658466 Semiconductor package structure and method for making the same
02/25/2014US8658464 Mold chase design for package-on-package applications
02/25/2014US8658463 Memristor with embedded switching layer
02/25/2014US8658462 Method of forming TiO2 array using ZnO template
02/25/2014US8658460 Organic light-emitting display device and method of manufacturing the same
02/25/2014US8658458 Patterned doping for polysilicon emitter solar cells
02/25/2014US8658457 Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatus
02/25/2014US8658456 Micro-electro-mechanical system tiltable lens
02/25/2014US8658454 Method of fabricating a solar cell
02/25/2014US8658453 Capacitive micromachined ultrasonic transducer
02/25/2014US8658452 Low temperature ceramic microelectromechanical structures
02/25/2014US8658451 Activating GaN LEDs by laser spike annealing and flash annealing
02/25/2014US8658450 Crystal growth method and semiconductor light emitting device
02/25/2014US8658449 Semiconductor layer, method of manufacturing the same, laser diode, and method of manufacturing the same
02/25/2014US8658448 Display device and method for manufacturing the same
02/25/2014US8658447 Radiation-emitting body and method for producing a radiation-emitting body
02/25/2014US8658446 Method for fabricating semiconductor substrate for optoelectronic components
02/25/2014US8658445 Method for manufacturing phosphor film and method for making LED package having the phosphor film
02/25/2014US8658444 Semiconductor active matrix on buried insulator
02/25/2014US8658442 Method for producing an electronic component and electronic component
02/25/2014US8658441 Method of manufacturing nitride semiconductor light emitting element
02/25/2014US8658440 Nitride semiconductor crystal with surface texture
02/25/2014US8658439 Quantum dot phosphor for light emitting diode and method of preparing the same
02/25/2014US8658438 Measurement of lateral diffusion of implanted ions in doped well region of semiconductor devices
02/25/2014US8658437 Package method for electronic components by thin substrate
02/25/2014US8658436 Method for separating and transferring IC chips
02/25/2014US8658435 Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip
02/25/2014US8658051 Lithography resolution improving method
02/25/2014US8658050 Method to transfer lithographic patterns into inorganic substrates
02/25/2014US8657993 Articles such as safety laminates and solar cell modules containing high melt flow acid copolymer compositions
02/25/2014US8657959 Apparatus for atomic layer deposition on a moving substrate
02/25/2014US8657958 CVD-Siemens monosilane reactor process with complete utilization of feed gases and total recycle
02/25/2014US8657413 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
02/25/2014US8657352 Robotic device for substrate transfer applications
02/25/2014US8657181 Wedge bonder and a method of cleaning a wedge bonder
02/25/2014US8656858 Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
02/25/2014US8656582 Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
02/25/2014US8656545 Core for washing sponge roller
02/20/2014WO2014028637A1 Noble metal / non-noble metal electrode for rram applications
02/20/2014WO2014028603A1 Method and apparatus providing multi-step deposition of thin film layer
02/20/2014WO2014028567A1 Solder on trace technology for interconnect attachment