Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/20/2014US20140050019 Multi-level memory cell using multiple magnetic tunnel junctions with varying mgo thickness
02/20/2014US20140049923 Thin film disposition
02/20/2014US20140049293 Three-Dimensional High Voltage Gate Driver Integrated Circuit
02/20/2014US20140049265 Device under test tester using redriver
02/20/2014US20140048994 Non-Contact Substrate Chuck and Vertical Type Substrate Supporting Apparatus Using the Same
02/20/2014US20140048960 Package substrate, manufacturing method thereof, and mold therefor
02/20/2014US20140048958 Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
02/20/2014US20140048950 Thermally enhanced semiconductor assembly with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048949 Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048948 Semiconductor memory device including alignment key structures
02/20/2014US20140048946 Sensor packages and method of packaging dies of various sizes
02/20/2014US20140048944 Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048941 Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers
02/20/2014US20140048940 Conductive Lines and Pads and Method of Manufacturing Thereof
02/20/2014US20140048939 Semiconductor device having metal plug and method of manufacturing the same
02/20/2014US20140048938 Semiconductor device and method for fabricating the same
02/20/2014US20140048937 Semiconductor device and method for manufacturing the same
02/20/2014US20140048934 Method to control underfill fillet width
02/20/2014US20140048932 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure
02/20/2014US20140048927 Method to improve fine cu line reliability in an integrated circuit device
02/20/2014US20140048926 Semiconductor package and method of manufacturing the same
02/20/2014US20140048922 Semiconductor device and method of manufacturing the same
02/20/2014US20140048921 Encapsulated arrays of electronic switching devices
02/20/2014US20140048920 Selective Leadframe Planishing
02/20/2014US20140048919 Integrated circuit packaging system with array contacts and method of manufacture thereof
02/20/2014US20140048912 Compressive stress transfer in an interlayer dielectric of a semiconductor device by providing a bi-layer of superior adhesion and internal stress
02/20/2014US20140048910 Substrate structure and method for manufacturing same
02/20/2014US20140048904 Semiconductor Device, Integrated Circuit and Manufacturing Method Thereof
02/20/2014US20140048903 Method and system for edge termination in gan materials by selective area implantation doping
02/20/2014US20140048902 Method of fabricating a gallium nitride merged p-i-n schottky (mps) diode by regrowth and etch back
02/20/2014US20140048890 Semiconductor memory device and method of manufacturing the same
02/20/2014US20140048888 Strained Structure of a Semiconductor Device
02/20/2014US20140048887 Integrated circuit having improved radiation immunity
02/20/2014US20140048886 Semiconductor device and method of forming the same
02/20/2014US20140048885 Dual workfunction semiconductor devices and methods for forming thereof
02/20/2014US20140048881 Method of Manufacturing a Body-Contacted SOI FINFET
02/20/2014US20140048874 Mos with recessed lightly-doped drain
02/20/2014US20140048870 Semiconductor device and method for forming the same
02/20/2014US20140048867 Multi-time programmable memory
02/20/2014US20140048866 Gate structure and method of manufacturing thereof
02/20/2014US20140048865 Novel compact charge trap multi-time programmable memory
02/20/2014US20140048862 Semiconductor device and method for fabricating semiconductor device
02/20/2014US20140048861 Semiconductor device, manufacturing method thereof, and display device
02/20/2014US20140048857 Bulk fin-field effect transistors with well defined isolation
02/20/2014US20140048855 Semiconductor device and fabrication method thereof
02/20/2014US20140048851 Substrate comprising si-base and inas-layer
02/20/2014US20140048850 Semiconductor devices and methods of manufacturing the semiconductor device
02/20/2014US20140048849 Package configurations for low emi circuits
02/20/2014US20140048848 Layered semiconductor substrate and method for manufacturing it
02/20/2014US20140048815 Schottky barrier diode and manufacturing method thereof
02/20/2014US20140048814 Film semiconductor device, display device using such thin film semiconductor device and manufacturing method thereof
02/20/2014US20140048811 Semiconductor device
02/20/2014US20140048806 Electronic device and its method of manufacture
02/20/2014US20140048805 Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
02/20/2014US20140048803 Semiconductor device capable of testing bonding of pad
02/20/2014US20140048457 Packaged chip detection and classification device
02/20/2014US20140048208 Apparatus for fabricating semiconductor devices
02/20/2014US20140048109 Liquid processing method, liquid processing apparatus and storage medium
02/20/2014US20140048100 Method for cleaning semiconductor wafer
02/20/2014DE112012002394T5 Sputtertarget, Verfahren zum Herstellen eines Sputtertargets und Verfahren zum Bilden eines Dünnfilmes Sputtering target, method of manufacturing a sputter target and method for forming a thin film
02/20/2014DE112012002072T5 Verfahren zur Herstellung eines epitaktischen Halbleiterwafers, epitaktischer Halbleiterwafer und Verfahren zur Herstellung einer Festkörperbildaufnahmevorrichtung A process for preparing an epitaxial semiconductor wafer, epitaxial semiconductor wafer and method for manufacturing a solid-state image pick-up device
02/20/2014DE112012001864T5 Halbleitersubstratbearbeitungssystem Semiconductor substrate processing system
02/20/2014DE112012001861T5 Chemikalienbereitstellungssystem Chemical delivery system
02/20/2014DE112012001486T5 Verfahren zur Herstellung eines Einkristallingots und hierdurch hergestellter Einkristallingot und Wafer A method for producing a single crystal ingot produced thereby single-crystal ingot and wafer
02/20/2014DE112010000717B4 Plasmaverarbeitungsvorrichtung Plasma processing apparatus
02/20/2014DE102013216121A1 Laserbearbeitungsvorrichtung Laser processing apparatus
02/20/2014DE102013216120A1 Inline-System Inline system
02/20/2014DE102013214483A1 Feldemissionsvorrichtungen und Verfahren zu ihrer Herstellung Field emission devices and methods for their preparation
02/20/2014DE102013210625A1 Übertragung von kompressiver Verspannung in einem Zwischenschichtdielektrikum einer Halbleitervorrichtung durch Bereitstellen einer Zweischicht mit verbesserter Haftung und innerer Verspannung Transmission of compressive stress in an interlayer of a semiconductor device by providing a two-layer with improved adhesion and internal stress
02/20/2014DE102013108813A1 Anschlussflächen mit Seitenwandabstandshaltern und Verfahren zum Herstellen von Anschlussflächen mit Seitenwandabstandshaltern Pads with sidewall spacers and method of manufacturing pads of sidewall spacers
02/20/2014DE102013108784A1 Ätzvorrichtung und Ätzverfahren Etching and etching
02/20/2014DE102013108586A1 Probenhalter eines Elektronenstrahlbestrahlungsgeräts und diesen verwendendes Elektronenstrahlbestrahlungsverfahren Sample holder of an electron beam irradiation apparatus and these-use electron beam irradiation method
02/20/2014DE102013108268A1 Pad-Seitenwand-Abstandshalter und Verfahren zur Herstellung von Pad-Seitenwand-Abstandshaltern Pad sidewall spacers and methods for the production of pad-side wall spacers
02/20/2014DE102013104397A1 Halbleiterpackage und Verfahren zur Herstellung desselben Semiconductor package and method for manufacturing the same
02/20/2014DE102012214647A1 Solar cell carriage assembly for current-induced regeneration of solar cells for standard oven, has fixing agents fixed to plates, where one of plates is arranged individually and/or jointly movable relative to another plate
02/20/2014DE102012214491A1 Leuchtmodul und Verfahren zur Herstellung eines derartigen Leuchtmoduls Light-emitting module and method of manufacturing such a light-emitting module
02/20/2014DE102012214487A1 Band-shaped light emitting module e.g. LED module has two portions that are formed separately and bonded directly, so that shining tape encapsulated into polymeric material of first portion is formed downstream to second portion
02/20/2014DE102012214428A1 Acid-treatment of silicon-containing substrate used for silicon solar cell, involves contacting silicon substrate with acidic solution containing nitric acid, hexafluorosilicic acid, hydrofluoric acid and water in process vessel
02/20/2014DE102012214411A1 Vorrichtung und verfahren zum herstellen hermetisch dichter kavitäten Cavities hermetically sealed device and process for the manufacture
02/20/2014DE102012213917A1 Bauelemente-Ummantelung für ein Elektronikmodul Components jacket for an electronics module
02/20/2014DE102010036217B4 Verfahren zur hermetischen Verkapselung eines Mikrosystems Process for hermetic encapsulation of a microsystem
02/20/2014DE102009044863B4 Halbleiter-Bauelement und Verfahren zum Herstellen eines Halbleiter-Bauelements A semiconductor device and method of manufacturing a semiconductor device
02/20/2014DE102009042319B4 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
02/20/2014DE102008064373B4 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
02/20/2014DE102008000141B4 Verfahren zur Herstellung eines rauscharmen Transistors A process for preparing a low-noise transistor
02/20/2014DE102006035668B4 Verfahren zum Herstellen einer Ätzindikator- und Ätzstoppschicht zur Reduzierung von Ätzungleichförmigkeiten A method of manufacturing a Ätzindikator- and etch stop layer to reduce etch non-uniformities
02/20/2014DE102006015142B4 Vorrichtung zum Brechen von Halbleiterscheiben A device for breaking semiconductor wafers
02/20/2014DE102004020173B4 Mikrostrukturiertes Bauelement und ein Verfahren zum Herstellen eines mikrostrukturierten Bauelements Microstructured component and a method for producing a microstructured component
02/19/2014EP2698827A1 Electrode paste composition, solar-cell element, and solar cell
02/19/2014EP2698823A1 Semiconductor device
02/19/2014EP2698822A1 Semiconductor device and method for manufacturing semiconductor device
02/19/2014EP2698818A2 Method and apparatus for processing a semiconductor workpiece
02/19/2014EP2698817A1 Semiconductor device and method for manufacturing semiconductor device
02/19/2014EP2698816A2 Method and apparatus for plasma dicing a semi-conductor wafer
02/19/2014EP2698815A2 Method and apparatus for plasma dicing a semi-conductor wafer
02/19/2014EP2698814A2 Method and apparatus for plasma dicing a semi-conductor wafer
02/19/2014EP2698813A2 Method and apparatus for plasma dicing a semi-conductor wafer
02/19/2014EP2698812A2 Method and apparatus for plasma dicing a semi-conductor wafer
02/19/2014EP2698811A1 Polishing pad and manufacturing method therefor
02/19/2014EP2698810A1 Polishing pad and manufacturing method therefor