Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/24/2006US20060187438 Temperature adjustment apparatus, exposure apparatus having the temperature adjustment apparatus, and semiconductor device manufacturing method
08/24/2006US20060187437 Alignment apparatus and exposure apparatus
08/24/2006US20060187436 Method and system for improving focus accuracy in a lithography system
08/24/2006US20060187431 Exposure method and exposure apparatus, stage unit, and device manufacturing method
08/24/2006US20060187330 CMOS APS with stacked avalanche multiplication layer and low voltage readout electronics
08/24/2006US20060186576 Resin sealing method for electronic part and mold used for the method
08/24/2006US20060186560 Back-illuminated imaging device and method of fabricating same
08/24/2006US20060186559 Semiconductor device, and method for manufacturing the same
08/24/2006US20060186558 Methods of fabricating scalable two transistor memory devices
08/24/2006US20060186556 Semiconductor-on-diamond devices and methods of forming
08/24/2006US20060186553 Semiconductor device
08/24/2006US20060186550 Semiconductor device and manufacturing method thereof
08/24/2006US20060186549 Semiconductor device and method of manufacturing the same
08/24/2006US20060186546 Nonvolatile semiconductor memory device
08/24/2006US20060186543 Semiconductor devices having plated contacts, and methods of manufacturing the same
08/24/2006US20060186541 Method and system for bonding a semiconductor chip onto a carrier using micro-pins
08/24/2006US20060186533 Chip scale package with heat spreader
08/24/2006US20060186526 Semiconductor device and its wiring method
08/24/2006US20060186521 Semiconductor packages and methods for making and using same
08/24/2006US20060186517 Semiconductor package having improved adhesiveness and ground bonding
08/24/2006US20060186515 Dual row leadframe and fabrication method
08/24/2006US20060186512 Flexible device and method of manufacturing the same
08/24/2006US20060186510 Strained-semiconductor-on-insulator bipolar device structures
08/24/2006US20060186509 Shallow trench isolation structure with active edge isolation
08/24/2006US20060186506 Schottky barrier diode and manufacturing method thereof
08/24/2006US20060186499 Solid-state imaging device and method of manufacturing said solid-state imaging device
08/24/2006US20060186498 Microminiature moving device and method of making the same
08/24/2006US20060186493 Laminated structure, method of manufacturing the same and ultrasonic transducer array
08/24/2006US20060186492 Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
08/24/2006US20060186491 Methods of forming semiconductor devices having metal gate electrodes and related devices
08/24/2006US20060186490 Metal carbide gate structure and method of fabrication
08/24/2006US20060186489 Semiconductor device and method of manufacturing semiconductor device
08/24/2006US20060186488 Semiconductor device and method of manufacturing semiconductor device
08/24/2006US20060186484 Field effect transistor with narrow bandgap source and drain regions and method of fabrication
08/24/2006US20060186480 Charge-trapping memory device and method for production
08/24/2006US20060186479 Semiconductor memory device having local etch stopper and method of manufacturing the same
08/24/2006US20060186476 Method of manufacturing thin film transistor
08/24/2006US20060186475 Thin film transistor having high mobility and high on-current and method for manufacturing the same
08/24/2006US20060186474 Semiconductor device and method of manufacturing the same
08/24/2006US20060186473 Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers
08/24/2006US20060186471 Manufacturing method for semiconductor device
08/24/2006US20060186466 Vertical gate semiconductor device and method for fabricating the same
08/24/2006US20060186465 DMOS device having a trenched bus structure
08/24/2006US20060186463 Nonvolatile semiconductor memory devices and the fabrication process of them
08/24/2006US20060186460 Split gate flash memory device having self-aligned control gate and method of manufacturing the same
08/24/2006US20060186459 Non-volatile memory and manufacturing method thereof
08/24/2006US20060186451 Memory device for storing electric charge, and method for fabricating it
08/24/2006US20060186448 Semiconductor device memory cell
08/24/2006US20060186441 Light-emitting device, liquid-crystal display device and method for manufacturing same
08/24/2006US20060186439 Semiconductor device, a manufacturing method thereof, and a camera
08/24/2006US20060186434 Vertical-conduction and planar-structure mos device with a double thickness of gate oxide and method for realizing power vertical mos transistors with improved static and dynamic performance and high scaling down density
08/24/2006US20060186428 Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device
08/24/2006US20060186426 Optical device, surface emitting type device and method for manufacturing the same
08/24/2006US20060186422 Etching a nitride-based heterostructure
08/24/2006US20060186414 Array substrate, display apparatus having an array substrate, and method for manufacturing an array substrate
08/24/2006US20060186412 Crystallization method, crystallization apparatus, processed substrate, thin film transistor and display apparatus
08/24/2006US20060186411 Thin film transistor array substrate, manufacturing method thereof, and mask
08/24/2006US20060186410 Thin film transistor and flat panel display device including the same
08/24/2006US20060186406 Method and system for qualifying a semiconductor etch process
08/24/2006US20060186404 Dummy wafer
08/24/2006US20060186403 Semiconductor device
08/24/2006US20060186399 Semiconductor apparatus and fabrication method of the same
08/24/2006US20060186397 Semiconductor substrates having useful and transfer layers
08/24/2006US20060186395 Thin-film capacitative element and electronic circuit and electronic equipment including the same
08/24/2006US20060186373 Polishing medium for chemical-mechanical polishing, and polishing method
08/24/2006US20060186372 For planarizing the surface of a substrate, storage stability
08/24/2006US20060186354 Apparatus and method for thermal processing
08/24/2006US20060186181 Ball mounting method
08/24/2006US20060186097 Systems and methods for forming apertures in microfeature workpieces
08/24/2006US20060186096 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
08/24/2006US20060186087 Etchant and method of use
08/24/2006US20060186084 Patterning nanoline arrays with spatially varying pitch
08/24/2006US20060185976 Plating apparatus and method
08/24/2006US20060185795 Anodized substrate support
08/24/2006US20060185794 Porous films and bodies with enhanced mechanical strength
08/24/2006US20060185793 Substrate processing system
08/24/2006US20060185784 Apparatus, system and method to reduce wafer warpage
08/24/2006US20060185696 Substrate cleaning apparatus
08/24/2006US20060185692 Method and apparatus for cleaning articles used in the production of semiconductors
08/24/2006US20060185579 Free-standing diamond structures and methods
08/24/2006US20060185577 Single crystal of highly purified hexagonal boron nitride capable of far ultraviolet high-luminance light emission, process for producing the same, far ultraviolet high-luminance light emitting device including the single crystal, and utilizing the device, solid laser and solid light emitting unit
08/24/2006US20060185546 System and method for vacuum generated imprinting
08/24/2006US20060185424 Integrated measuring instrument
08/24/2006US20060185394 Renewability and shortened renewing time, preventing elements in a substrate thereof from diffusing into the surface of diamond-like carbon (DLC), heat resistance of the molding die and adhesion between the DLC layer and substrate
08/24/2006US20060185157 Parts packaging device and parts packaging method
08/24/2006DE4310915B4 Festkörperbildsensor mit hohem Signal-Rauschverhältnis Solid-state image sensor with high signal-to-noise ratio
08/24/2006DE19929656B4 Nichtflüchtiger ferroelektrischer Speicher und Verfahren zu seiner Herstellung A non-volatile ferroelectric memory and method for its preparation
08/24/2006DE19926711B4 Verfahren zur Herstellung eines ferroelektrischen Speicherbauelements A process for producing a ferroelectric memory device
08/24/2006DE19831578B4 Positioniergerät und Positionierverfahren The positioning and positioning process
08/24/2006DE19781675B4 Speicherzellengestaltung mit vertikal gestapelten Überkeuzungen Memory cell design with vertically stacked Überkeuzungen
08/24/2006DE19606105B4 Back-Source-MOSFET Back-source MOSFET
08/24/2006DE19540140B4 Substrat, Modul und Verfahren zum Befestigen von Komponenten des Moduls auf dem Substrat Substrate module and method for attaching components of the module on the substrate
08/24/2006DE112004002023T5 Flüssigkeitszusammensetzung, Herstellungsverfahren dafür, Filme mit niedriger Dielektrizitätskonstante, abrasive Materialien und elektronische Komponenten Liquid composition, preparation method therefor, low dielectric constant films, abrasive materials and electronic components
08/24/2006DE112004001776T5 Ein Bauelement und ein Verfahren zum Ausbilden eines ferroelektrischen Kondensatorbauelements A device and a method for forming a ferroelectric capacitor device
08/24/2006DE10349764B4 Hartmaske zur Strukturierung einer Schicht und Verfahren zur Generierung einer Hartmaske für die Strukturierung einer Schicht Hard mask for patterning a layer and method for generating a hard mask for patterning a layer
08/24/2006DE10336876B4 Speicherzelle mit Nanokristallen oder Nanodots und Verfahren zu deren Herstellung Memory cell with nanocrystals or nanodots and processes for their preparation
08/24/2006DE10315086B4 Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung Method and apparatus for aligning the semiconductor wafers in the semiconductor manufacturing
08/24/2006DE10218512B4 Lichtempfindliches Polymer und Resist-Zusammensetzungen The light-sensitive polymer and resist compositions
08/24/2006DE102006005679A1 Semiconductor device e.g. flash memory, has active pattern disposed in region of substrate, and source/drain electrodes formed in regions of pattern, where impurity region that forms electrodes is shared by four transistors
08/24/2006DE102006000719A1 Waferunterteilungsverfahren Wafer dividing method