Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/22/2006US7095083 Methods for making semiconductor structures having high-speed areas and high-density areas
08/22/2006US7095081 Semiconductor device and manufacturing method thereof
08/22/2006US7095078 Charge trapping memory cell
08/22/2006US7095077 Semiconductor memory having two charge storage sections
08/22/2006US7095076 Electrically-alterable non-volatile memory cell
08/22/2006US7095075 Apparatus and method for split transistor memory having improved endurance
08/22/2006US7095074 Semiconductor device with reduced memory leakage current
08/22/2006US7095073 High K artificial lattices for capacitor applications to use in Cu or Al BEOL
08/22/2006US7095072 Semiconductor device with wiring layers forming a capacitor
08/22/2006US7095071 Magnetic random access memory
08/22/2006US7095070 Method for fabricating Bi thin film and device using the same
08/22/2006US7095069 Magnetoresistive random access memory, and manufacturing method thereof
08/22/2006US7095068 Semiconductor memory device having ferroelectric capacitor and method of manufacturing the same
08/22/2006US7095067 Oxidation-resistant conducting perovskites
08/22/2006US7095065 Varying carrier mobility in semiconductor devices to achieve overall design goals
08/22/2006US7095062 Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby
08/22/2006US7095061 Contacting scheme for large and small area semiconductor light emitting flip chip devices
08/22/2006US7095059 Group III nitride compound semiconductor device
08/22/2006US7095057 Semiconductor laser and method for manufacturing the same
08/22/2006US7095054 Semiconductor package having light sensitive chips
08/22/2006US7095051 Nitride semiconductor element
08/22/2006US7095048 Semiconductor device, electronic circuit array substrate provided with the same and method of manufacturing the electronic circuit array substrate
08/22/2006US7095047 Semiconductor device and method of manufacturing the same
08/22/2006US7095046 Semiconductor device
08/22/2006US7095045 Semiconductor device and manufacturing method thereof
08/22/2006US7095044 Field effect transistors and materials and methods for their manufacture
08/22/2006US7095043 Semiconductor device, semiconductor circuit module and manufacturing method of the same
08/22/2006US7095038 EUV source
08/22/2006US7095036 Electron beam lithography apparatus using a patterned emitter and method of fabricating the patterned emitter
08/22/2006US7095035 Demagnification measurement method for charged particle beam exposure apparatus, stage phase measurement method for charged particle beam exposure apparatus, control method for charged particle beam exposure apparatus, and charged particle beam exposure apparatus
08/22/2006US7095023 Charged particle beam apparatus, charged particle detection method, and method of manufacturing semiconductor device
08/22/2006US7095021 Method, apparatus and system for specimen fabrication by using an ion beam
08/22/2006US7094994 Heat treatment apparatus and method of semiconductor wafer
08/22/2006US7094993 Apparatus and method for heating and cooling an article
08/22/2006US7094966 Packaging integrated circuits with adhesive posts
08/22/2006US7094924 Method for decreasing surface defects of patterned resist layer
08/22/2006US7094844 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips
08/22/2006US7094713 Methods for improving the cracking resistance of low-k dielectric materials
08/22/2006US7094712 High performance MIS capacitor with HfO2 dielectric
08/22/2006US7094711 Micro pipe manufacturing method
08/22/2006US7094710 Very low dielectric constant plasma-enhanced CVD films
08/22/2006US7094709 Method of synthesizing hybrid metal oxide materials and applications thereof
08/22/2006US7094708 Method of CVD for forming silicon nitride film on substrate
08/22/2006US7094706 Device and method for etching a substrate by using an inductively coupled plasma
08/22/2006US7094705 Multi-step plasma treatment method to improve CU interconnect electrical performance
08/22/2006US7094704 Method of plasma etching of high-K dielectric materials
08/22/2006US7094703 Method and apparatus for surface treatment
08/22/2006US7094702 Layer-by-layer etching apparatus using neutral beam and method of etching using the same
08/22/2006US7094701 Manufacturing method of semiconductor device
08/22/2006US7094700 forming a sidewall mask over a GexSey chalcogenide layer; plasma etching the chalcogenide layer in the presence of an NH3, N2H4, or CxHy etching gas; layer may be exposed to a fluorine material prior to etching
08/22/2006US7094699 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device
08/22/2006US7094698 Method for dry etching a semiconductor wafer
08/22/2006US7094697 Method for preparing a deep trench and an etching mixture for the same
08/22/2006US7094696 Method for TMAH etching of CMOS integrated circuits
08/22/2006US7094695 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
08/22/2006US7094694 Semiconductor device having MOS varactor and methods for fabricating the same
08/22/2006US7094693 Method of manufacturing semiconductor device and semiconductor device
08/22/2006US7094692 Semiconductor device and method of manufacturing the same
08/22/2006US7094691 MOCVD of tungsten nitride thin films using W(CO)6 and NH3 for copper barrier applications
08/22/2006US7094690 Deposition methods and apparatuses providing surface activation
08/22/2006US7094689 Air gap interconnect structure and method thereof
08/22/2006US7094688 Method for manufacturing semiconductor device
08/22/2006US7094687 Reduced dry etching lag
08/22/2006US7094686 Contact hole printing by packing and unpacking
08/22/2006US7094685 Integration of titanium and titanium nitride layers
08/22/2006US7094684 Manufacturing method of semiconductor device
08/22/2006US7094683 Dual damascene method for ultra low K dielectrics
08/22/2006US7094682 Coating of copper and silver air bridge structures to improve electromigration resistance and other applications
08/22/2006US7094681 Semiconductor device fabrication method
08/22/2006US7094680 Formation of a tantalum-nitride layer
08/22/2006US7094679 Carbon nanotube interconnect
08/22/2006US7094678 Electrostatic discharge protection of thin-film resonators
08/22/2006US7094677 Method of forming a penetration electrode and substrate having a penetration electrode
08/22/2006US7094676 Semiconductor chip assembly with embedded metal pillar
08/22/2006US7094675 Structure having spatially separated photo-excitable electron-hole pairs and method of manufacturing same
08/22/2006US7094674 Method for production of contacts on a wafer
08/22/2006US7094673 Etch stop layer in poly-metal structures
08/22/2006US7094672 Method for forming self-aligned contact in semiconductor device
08/22/2006US7094671 Transistor with shallow germanium implantation region in channel
08/22/2006US7094670 doping film comprising semiconductors, by placing electrostatic chuck in reactors, charging doping precursors into the reactor and applying radio frequency power to generate gases, and applying voltage to an electrode of the electrostatic chuck
08/22/2006US7094669 Structure and method of liner air gap formation
08/22/2006US7094668 Annealing process and device of semiconductor wafer
08/22/2006US7094667 Smooth thin film layers produced by low temperature hydrogen ion cut
08/22/2006US7094666 Method and system for fabricating strained layers for the manufacture of integrated circuits
08/22/2006US7094665 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
08/22/2006US7094664 Method for fabricating semiconductor photodetector
08/22/2006US7094663 Semiconductor device and method of manufacturing the same
08/22/2006US7094662 Overlay mark and method of fabricating the same
08/22/2006US7094661 Single and dual damascene techniques utilizing composite polymer dielectric film
08/22/2006US7094660 Method of manufacturing trench capacitor utilizing stabilizing member to support adjacent storage electrodes
08/22/2006US7094659 Method of forming deep trench capacitors
08/22/2006US7094658 3-stage method for forming deep trench structure and deep trench capacitor
08/22/2006US7094657 Method for protecting against oxidation of a conductive layer in said device
08/22/2006US7094656 Method of forming poly-silicon thin film transistors
08/22/2006US7094655 Method of fabricating semiconductor device
08/22/2006US7094654 Manufacture of electronic devices comprising thin-film transistors
08/22/2006US7094653 Method for forming STI structures with controlled step height
08/22/2006US7094652 Semiconductor device and method of manufacturing the same
08/22/2006US7094651 Hydrazine-free solution deposition of chalcogenide films
08/22/2006US7094650 Gate electrode for FinFET device