Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/29/2006US7098046 Alignment method and exposure apparatus using the method
08/29/2006US7098045 Processing method utilizing an apparatus to be sealed against workpiece
08/29/2006US7098044 Method of forming an etched metal trace with reduced RF impedance resulting from the skin effect
08/29/2006US7098043 PCMO spin-coat deposition
08/29/2006US7097960 Dissolving gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution; semiconductor manufacturing; reducing solution is an aqueous solution containing at least one of hydrogen, hydrogen sulfide, nitric acid, and sulfurous acid
08/29/2006US7097949 Phase edge phase shift mask enforcing a width of a field gate image and fabrication method thereof
08/29/2006US7097946 For use insemiconductor manufacturing; lithography
08/29/2006US7097945 by forming the virtual pattern around the isolation pattern, the flare effect of the isolation pattern is close to that of the dense pattern, thus the CD bias between a dense pattern and an isolation pattern is reduced, and the process windows of both patterns are not reduced
08/29/2006US7097923 Method for forming thin film heads using a tri-layer anti-reflection coating for photolithographic applications and a structure thereof
08/29/2006US7097920 Group III nitride based semiconductor substrate and process for manufacture thereof
08/29/2006US7097886 Deposition process for high aspect ratio trenches
08/29/2006US7097784 Etching method and apparatus for semiconductor wafers
08/29/2006US7097782 Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly
08/29/2006US7097781 Method for manufacturing porous structure and method for forming pattern
08/29/2006US7097779 Processing system and method for chemically treating a TERA layer
08/29/2006US7097755 Electrochemical mechanical processing with advancible sweeper
08/29/2006US7097735 Plasma processing device
08/29/2006US7097718 Single crystal silicon wafer having an epitaxial layer substantially free from grown-in defects
08/29/2006US7097714 Particulate removal from an electrostatic chuck
08/29/2006US7097712 Apparatus for processing a semiconductor
08/29/2006US7097708 Substituted donor atoms in silicon crystal for quantum computer
08/29/2006US7097707 GaN boule grown from liquid melt using GaN seed wafers
08/29/2006US7097686 Generating an aerosol including a liquid comprising a nickel precursor and a reducing agent and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy
08/29/2006US7097550 Chemical mechanical polishing pad
08/29/2006US7097549 Polishing pad
08/29/2006US7097544 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/29/2006US7097541 CMP method for noble metals
08/29/2006US7097535 Method and configuration for conditioning a polishing pad surface
08/29/2006US7097410 Methods and apparatus for controlled-angle wafer positioning
08/29/2006US7097091 Friction stir welding method and component part welded by the method
08/29/2006US7097090 Solder ball
08/29/2006US7096914 Apparatus for bonding a chip using an insulating adhesive tape
08/29/2006US7096912 Bonding apparatus
08/29/2006US7096873 Method for manufacturing a group III nitride compound semiconductor device
08/29/2006US7096819 Inductive plasma processor having coil with plural windings and method of controlling plasma density
08/29/2006US7096716 Integration of thermal regulation and electronic fluid sensing
08/29/2006US7096581 Method for providing a redistribution metal layer in an integrated circuit
08/29/2006US7096548 Manufacturing method of integrated capacitor
08/29/2006CA2295248C Power devices in wide bandgap semiconductor
08/29/2006CA2212751C Bandgap tuning of semiconductor well structure
08/24/2006WO2006089296A2 Low cost, high volume lead frame production
08/24/2006WO2006089291A1 Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing
08/24/2006WO2006089134A2 Apparatus and method for surface preparation using energetic and reactive cluster beams
08/24/2006WO2006089072A2 Generation and applications of negative dielectric constant material
08/24/2006WO2006088881A2 Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
08/24/2006WO2006088766A2 Highly conductive shallow junction formation
08/24/2006WO2006088713A2 Enhanced wafer cleaning method
08/24/2006WO2006088689A2 Method for patterning submicron pillars
08/24/2006WO2006088564A1 Flexible active matrix display backplane and method
08/24/2006WO2006088534A1 Interconnect structures with encasing cap and methods of making thereof
08/24/2006WO2006088527A2 A semiconductor substrate processing method
08/24/2006WO2006088448A1 Wafer carrier for growing gan wafers
08/24/2006WO2006088261A1 METHOD FOR FORMING InGaN LAYER AND SEMICONDUCTOR DEVICE
08/24/2006WO2006088228A1 Semiconductor luminous element and method for manufacture thereof
08/24/2006WO2006088180A1 Semiconductor device manufacturing method
08/24/2006WO2006088166A1 Semiconductor oxidation apparatus and method of producing semiconductor element
08/24/2006WO2006088141A1 Electron beam device
08/24/2006WO2006088114A1 Plasma treatment apparatus
08/24/2006WO2006088098A1 Xy stage
08/24/2006WO2006088074A1 Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
08/24/2006WO2006088062A1 Production method for semiconductor device and substrate processing device
08/24/2006WO2006088036A1 Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film
08/24/2006WO2006088015A1 Method for forming organosilicon film, semiconductor device having such organosilicon film and method for manufacturing same
08/24/2006WO2006088005A1 Semiconductor device
08/24/2006WO2006087990A1 Gas type precise silicon wafer cleaning and drying apparatus
08/24/2006WO2006087978A1 Projection optical system, exposure equipment and device manufacturing method
08/24/2006WO2006087966A1 Method of removing organic coating and photolithographic process
08/24/2006WO2006087958A1 Nitride semiconductor material and method for manufacturing nitride semiconductor crystal
08/24/2006WO2006087957A1 Semiconductor device manufacturing method and semiconductor device
08/24/2006WO2006087955A1 Temperature setting method for heat treating plate, temperature setting device for heat treating plate, program and computer-readable recording medium recording program
08/24/2006WO2006087942A1 Seal material for semiconductor production apparatus
08/24/2006WO2006087938A1 Temperature setting method for heat treating plate, temperature setting device for heat treating plate, program and computer-readable recording medium recording program
08/24/2006WO2006087894A1 Fixation carrier, production method of fixation carrier, use method of fixation carrier, and substrate reception container
08/24/2006WO2006087893A1 Substrate processing method and substrate processing apparatus
08/24/2006WO2006087873A1 Barrier film for flexible copper substrate and sputtering target for barrier film formation
08/24/2006WO2006087865A1 Positive resist composition and method of forming resist pattern
08/24/2006WO2006087833A1 Hydrogen atom generation source in vacuum treatment apparatus, and hydrogen atom transportation method
08/24/2006WO2006087822A1 Electronic tag chip
08/24/2006WO2006087798A1 Storage element matrix, method for manufacturing such storage element matrix and semiconductor storage device using such storage element matrix
08/24/2006WO2006087796A1 Nonvolatile semiconductor storage device
08/24/2006WO2006087777A1 Pressurizing type lamp annealing device, pressurizing type lamp annealing method, thin-film, and electronic component
08/24/2006WO2006087679A2 Embedded dram with increased capacitance and method of manufacturing same
08/24/2006WO2006087381A1 Trench-gate electrode for finfet device
08/24/2006WO2006087044A1 Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
08/24/2006WO2006086996A1 Wafer cleaning after via-etching
08/24/2006WO2006079104A3 Encapsulation of circuit components to reduce thermal cycling stress
08/24/2006WO2006072238A3 Electrical determination of the connection quality of a bonded wafer connection
08/24/2006WO2006068805A9 Method and apparatus for controlling spatial temperature distribution
08/24/2006WO2006055984A3 Substrate processing apparatus using a batch processing chamber
08/24/2006WO2006049853A3 Method of connecting a semiconductor package to a printed wiring board
08/24/2006WO2006039633A3 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
08/24/2006WO2006036644A3 Lamp array for thermal processing exhibiting improved radial uniformity
08/24/2006WO2006034683A3 Method for separating surface-mountable semiconductor components and for fitting external contacts to said components
08/24/2006WO2006032963A3 Methods for producing noble metal films, noble metal oxide films, and noble metal silicide films
08/24/2006WO2006025035A3 Vertical semiconductor devices and methods of manufacturing such devices
08/24/2006WO2006022780A3 Method for fabricating crystalline silicon
08/24/2006WO2006017009A3 Surface lubrication microstructures
08/24/2006WO2006011991A3 Apparatus for an optimized plasma chamber top piece
08/24/2006WO2005122284A3 Semiconductor-on-diamond devices and methods of forming
08/24/2006WO2005112100A3 Stacked module systems and methods