| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/31/2006 | US20060192254 Semiconductor memory device |
| 08/31/2006 | US20060192252 Semiconductor device allowing modulation of a gain coefficient and a logic circuit provided with the same |
| 08/31/2006 | US20060192250 Complementary metal-oxide-semiconductor image sensor and method for fabricating the same |
| 08/31/2006 | US20060192241 Non-volatile memory and manufacturing method thereof |
| 08/31/2006 | US20060192239 Permeable capacitor electrode |
| 08/31/2006 | US20060192238 Intermediate semiconductor device structure including multiple photoresist layers |
| 08/31/2006 | US20060192237 Magnetic elements with ballistic magnetoresistance utilizing spin-transfer and an MRAM device using such magnetic elements |
| 08/31/2006 | US20060192236 Semiconductor device |
| 08/31/2006 | US20060192235 System and method for reducing shorting in memory cells |
| 08/31/2006 | US20060192228 Compound semiconductor epitaxial substrate and method for manufacturing same |
| 08/31/2006 | US20060192209 Optical integrated semiconductor light emitting device |
| 08/31/2006 | US20060192205 Electro-optical device and electronic device |
| 08/31/2006 | US20060192202 Semiconductor device forming method |
| 08/31/2006 | US20060192158 Device, EUV lithographic device and method for preventing and cleaning contamination on optical elements |
| 08/31/2006 | US20060192156 Light source apparatus and exposure apparatus having the same |
| 08/31/2006 | US20060192147 Multilayer mirror, method for manufacturing the same, and exposure equipment |
| 08/31/2006 | US20060192117 Inspection method and apparatus using an electron beam |
| 08/31/2006 | US20060192004 Stylized method of using and distributing consumer electronic devices |
| 08/31/2006 | US20060191882 Systems and methods for forming apertures in microfeature workpieces |
| 08/31/2006 | US20060191871 Cmp slurry delivery system and method of mixing slurry thereof |
| 08/31/2006 | US20060191870 Extended kalman filter incorporating offline metrology |
| 08/31/2006 | US20060191868 Concept for the wet-chemical removal of a sacrificial material in a material structure |
| 08/31/2006 | US20060191867 Ionization; deuterium compounds; lamination |
| 08/31/2006 | US20060191866 Microfeature workpiece processing system for, e.g., semiconductor wafer analysis |
| 08/31/2006 | US20060191865 Method of processing substrate, method of manufacturing solid-state imaging device, method of manufacturing thin film device, and programs for implementing the methods |
| 08/31/2006 | US20060191800 Positioning microelectronic between electrodes; polishing; removal electrochemical material by moving between electrodes; detecting signals |
| 08/31/2006 | US20060191639 Substrate holding structure and substrate processing device |
| 08/31/2006 | US20060191636 Valve assembly, semiconductor device manufacturing apparatus comprising the same, and method of cleaning a trap of a semiconductor device manufactuing apparatus |
| 08/31/2006 | US20060191635 Wafer treating apparatus |
| 08/31/2006 | US20060191634 Apparatus for wafer patterning to reduce edge exclusion zone |
| 08/31/2006 | US20060191629 Anodically bonding a stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed |
| 08/31/2006 | US20060191627 Process for cutting out a block of material and formation of a thin film |
| 08/31/2006 | US20060191556 Substrate processing apparatus and substrate processing method |
| 08/31/2006 | US20060191481 Apparatus for the formation of a metal film |
| 08/31/2006 | US20060191479 Surface treatment apparatus |
| 08/31/2006 | US20060191477 Apparatus for the formation of a metal film |
| 08/31/2006 | US20060191475 Apparatus for spin coating semiconductor substrates |
| 08/31/2006 | US20060191467 Group iii nitride based semiconductor substrate and process for manufacture thereof |
| 08/31/2006 | US20060191131 Electronic part mounting apparatus |
| 08/31/2006 | US20060191125 Self-assembled electrical networks |
| 08/31/2006 | DE19928225B4 Verfahren zur Herstellung von Mehrlagen-Hybriden A process for producing multi-layer hybrids |
| 08/31/2006 | DE19908979B4 Anschlusssockel mit darin eingeschobenem Halbleiterbauteil für photoelektrische Elemente Terminal block with inserted therein semiconductor device for photoelectric elements |
| 08/31/2006 | DE19750167B4 Verfahren zur Herstellung integrierter Schaltkreise A process for the production of integrated circuits |
| 08/31/2006 | DE19651811B4 Vorrichtung zum Belegen eines Substrats mit dünnen Schichten Device to occupy a substrate with thin layers |
| 08/31/2006 | DE19520053B4 Bestückungsvorrichtung für Halbleiterelemente Mounting apparatus for semiconductor elements |
| 08/31/2006 | DE112004002017T5 Epitaktisches Abscheiden von Source/Drain Epitaxial deposition of the source / drain |
| 08/31/2006 | DE10345476B4 Lithographische Maske und Verfahren zum Bedecken einer Maskenschicht Lithographic mask and method for covering a mask layer |
| 08/31/2006 | DE10310128B4 Verfahren zum Erzeugen von Halbleiterzonen mit n-Leitfähigkeit in einem Halbleiterkörper A method for producing semiconductor regions with n-type conductivity in a semiconductor body |
| 08/31/2006 | DE10249869B4 Magnetische Dünnfilmspeichervorrichtung zum Durchführen eines Datenschreibvorgangs durch Anlegen eines Magnetfelds Thin film magnetic memory device for performing a data write operation by applying a magnetic field |
| 08/31/2006 | DE10239306B4 Verfahren zum selektiven Verbinden von Substraten A method of selectively bonding substrates |
| 08/31/2006 | DE10208714B4 Herstellungsverfahren für einen Kontakt für eine integrierte Schaltung Manufacturing method of a contact for an integrated circuit |
| 08/31/2006 | DE102006007431A1 Durch Halbleitersilizium-Verfahrenstechnik gebildeter Probenträger By semiconductor silicon process technology educated sample carrier |
| 08/31/2006 | DE102005028644A1 Line forming method for semiconductor NAND flash memory device, involves forming a glue layer and lower barrier metal film on entire surface including trench and forming upper barrier metal film at bottom of trench |
| 08/31/2006 | DE102005012112A1 Ladungsgfangendes Speicherbauelement und Verfahren zur Herstellung Ladungsgfangendes memory device and methods for preparing |
| 08/31/2006 | DE102005009020A1 N-doped semiconductor layer producing method for e.g. vertical field plate trench transistor, involves irradiating part of upper surface of semiconductor body of power transistor with protons, and annealing semiconductor body |
| 08/31/2006 | DE102005008600A1 Chip carrier used as heat sink for semiconductor chips, comprises two recesses in respective surface of chip carrier, and dimensioned to receive two semiconductor chips |
| 08/31/2006 | DE102005008336A1 Unipolar three-layered electrostatic semiconductor wafer arrangement for integrated circuit, has wafer layer and carrier layer from semiconducting material e.g. silicon, where wafer layer is arranged adjacent to side of isolating layer |
| 08/31/2006 | DE102005007643A1 Verfahren und Anordnung zum Kontaktieren von Halbleiterchips auf einem metallischen Substrat Method and apparatus for bonding semiconductor chips on a metallic substrate |
| 08/31/2006 | DE102005007486A1 Halbleiterbauteil mit oberflächenmontierbarem Gehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device with oberflächenmontierbarem housing and methods for preparing |
| 08/31/2006 | DE102005006333A1 Halbleiterbauteil mit mehreren Bondanschlüssen und Verfahren zur Herstellung desselben Of the same semiconductor device having a plurality of bonding pads and methods for preparing |
| 08/31/2006 | DE102004044686B4 Integrierte Schaltungsanordnung mit Vias, die zwei Abschnitte haben, und Herstellungsverfahren An integrated circuit device with vias, which have two portions, and manufacturing processes |
| 08/31/2006 | DE102004044678B4 Verfahren zum Herstellen eines Kondensators A method for manufacturing a capacitor |
| 08/31/2006 | DE102004040414B4 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte Process for the preparation of a wiring substrate of a semiconductor device with external contact pads for external contacts |
| 08/31/2006 | DE102004033645B4 Herstellungswerkzeug für eine Waferebene-Packung und Verfahren zum Anordnen von Chips Production tool for a wafer level package and method for disposing of chips |
| 08/31/2006 | DE10158809B4 Herstellungsverfahren für eine Leiterbahn auf einem Substrat und eine entsprechende Leiterbahn Manufacturing method of a conductor track on a substrate and a corresponding conductor track |
| 08/31/2006 | DE10138142B4 Verfahren zur Analyse einer integrierten elektrischen Schaltung A method for analyzing an integrated electrical circuit |
| 08/31/2006 | DE10129346B4 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device |
| 08/30/2006 | EP1696567A1 Level shift circuit, actuator apparatus using the same, and optical switch system |
| 08/30/2006 | EP1696485A1 Process for manufacturing semiconductor devices in a SOI substrate with alignment marks |
| 08/30/2006 | EP1696484A1 Process for assembling a double-sided circuit component |
| 08/30/2006 | EP1696481A2 Method of integrating an electronic component into a substrate cavity |
| 08/30/2006 | EP1696480A2 Free-standing electrostatically-doped carbon nanotube device and method for making same |
| 08/30/2006 | EP1696479A1 Contactor for reliability evaluation tester |
| 08/30/2006 | EP1696478A1 Insulating film, method for forming same and composition for forming film |
| 08/30/2006 | EP1696477A2 Process of fabrication of sub-lithographic structures |
| 08/30/2006 | EP1696476A2 Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods |
| 08/30/2006 | EP1696475A1 Substrate treatment device and substrate treatment method |
| 08/30/2006 | EP1696474A1 Method of removing deposit from substrate and method of drying substrate, and device for removing deposit from substrate and device of drying substrate using these methods |
| 08/30/2006 | EP1696473A2 Silicon nano wires, semiconductor device including the same, and method of manufacturing the silicon nano wires |
| 08/30/2006 | EP1696472A1 A patterning method for fabricating high resolution structures |
| 08/30/2006 | EP1696471A1 Pattern-forming process utilizing nanoimprint and apparatus for performing such process |
| 08/30/2006 | EP1696470A2 Wafer holder and method of holding a wafer |
| 08/30/2006 | EP1696253A2 Accurate relative alignment and epoxy-free attachment of optical elements |
| 08/30/2006 | EP1696053A1 Nano-array electrode manufacturing method and photoelectric converter using same |
| 08/30/2006 | EP1696011A1 Chemical mechanical polishing method |
| 08/30/2006 | EP1695937A2 Integrated micro electro-mechanical system and manufacturing method thereof |
| 08/30/2006 | EP1695387A2 Low crosstalk substrate for mixed-signal integrated circuits |
| 08/30/2006 | EP1695384A2 Wire-bonded semiconductor component with reinforced inner connection metallization |
| 08/30/2006 | EP1695383A1 Bipolar and cmos integration with reduced contact height |
| 08/30/2006 | EP1695381A1 Method for forming non-amorphous, ultra-thin semiconductor devices using sacrificial implantation layer |
| 08/30/2006 | EP1695380A1 Method to reduce seedlayer topography in bicmos process |
| 08/30/2006 | EP1695379A1 Contoured insulator layer of silicon-on-onsulator wafers and process of manufacture |
| 08/30/2006 | EP1695378A1 Method for production of semiconductor chip and semiconductor chip |
| 08/30/2006 | EP1695377A2 Method of fabricating a strained semiconductor-on-insulator substrate |
| 08/30/2006 | EP1695376A1 Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials |
| 08/30/2006 | EP1695375A2 Synthetic quartz glass for optical member and its production method |
| 08/30/2006 | EP1695145A2 Method for repairing errors of patterns embodied in thin layers |
| 08/30/2006 | EP1695128A2 Optical waveguides and methods thereof |
| 08/30/2006 | EP1695123A2 Laser and detector device |
| 08/30/2006 | EP1694887A2 Controlled growth of gallium nitride nanostructures |