Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/29/2006US7098149 Mechanical enhancement of dense and porous organosilicate materials by UV exposure
08/29/2006US7098148 Method for heat treating a semiconductor wafer
08/29/2006US7098147 Semiconductor memory device and method for manufacturing semiconductor device
08/29/2006US7098146 Semiconductor device having patterned SOI structure and method for fabricating the same
08/29/2006US7098145 Fabrication of self-assembled monolayers
08/29/2006US7098144 Iridium oxide nanotubes and method for forming same
08/29/2006US7098143 Applying to remove metal shorts, smearing and eaves resulting from chemical mechanical polishing or in failure analysis for uniform removal of metal layer without damaging the vias, contact, or underlying structures; semiconductors
08/29/2006US7098142 Method of etching ferroelectric devices
08/29/2006US7098141 Use of silicon containing gas for CD and profile feature enhancements of gate and shallow trench structures
08/29/2006US7098140 Method of compensating for etch rate non-uniformities by ion implantation
08/29/2006US7098139 Method of manufacturing a semiconductor device with copper wiring treated in a plasma discharge
08/29/2006US7098138 Plasma processing method for working the surface of semiconductor devices
08/29/2006US7098137 Micro corner cube array, method of making the micro corner cube array, and display device
08/29/2006US7098136 Structure having flush circuit features and method of making
08/29/2006US7098135 Semiconductor device including bit line formed using damascene technique and method of fabricating the same
08/29/2006US7098134 Method for fabricating semiconductor device
08/29/2006US7098133 Method of forming copper wiring in a semiconductor device
08/29/2006US7098132 Method of manufacturing flexible wiring board
08/29/2006US7098131 Methods for forming atomic layers and thin films including tantalum nitride and devices including the same
08/29/2006US7098130 Method of forming dual damascene structure
08/29/2006US7098129 Interlayer insulation film used for multilayer interconnect of semiconductor integrated circuit and method of manufacturing the same
08/29/2006US7098128 Method for filling electrically different features
08/29/2006US7098127 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
08/29/2006US7098126 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints
08/29/2006US7098124 Method of forming contact hole and method of fabricating semiconductor device
08/29/2006US7098123 Methods of forming a semiconductor device having a metal gate electrode and associated devices
08/29/2006US7098122 Method of fabricating a vertically integrated memory cell
08/29/2006US7098121 Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device
08/29/2006US7098120 Method of manufacturing semiconductor devices
08/29/2006US7098119 Thermal anneal process for strained-Si devices
08/29/2006US7098118 Method and apparatus for machining substrate
08/29/2006US7098117 Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices
08/29/2006US7098116 Shallow trench isolation method for reducing oxide thickness variations at different pattern densities
08/29/2006US7098115 Semiconductor device and method of manufacturing the same
08/29/2006US7098114 Method for forming cmos device with self-aligned contacts and region formed using salicide process
08/29/2006US7098113 Method and system for providing a power lateral PNP transistor using a buried power buss
08/29/2006US7098112 Forming metal catalyst layer on substrate and then growing plurality of nanostructures; coating with metal, alloy, oxide, nitride, carbide, sulfide and/or chloride thereof; isolating and placing on patterned metal electrode; heating, adhesion
08/29/2006US7098111 Manufacturing method of semiconductor integrated circuit device
08/29/2006US7098110 Semiconductor device and method of manufacturing thereof
08/29/2006US7098109 Multi-level memory cell and fabricating method thereof
08/29/2006US7098108 Semiconductor device having reduced effective substrate resistivity and associated methods
08/29/2006US7098107 Protective layer in memory device and method therefor
08/29/2006US7098106 Method of making mirror image memory cell transistor pairs featuring poly floating spacers
08/29/2006US7098105 Methods for forming semiconductor structures
08/29/2006US7098104 Method of fabricating semiconductor memory device
08/29/2006US7098103 Method and structure for non-single-polycrystalline capacitor in an integrated circuit
08/29/2006US7098102 Shallow trench isolation structure and dynamic random access memory, and fabricating methods thereof
08/29/2006US7098101 Method of forming PrxCa1−xMnO3 thin films having a PrMnO3/CaMnO3 super lattice structure using metalorganic chemical vapor deposition
08/29/2006US7098100 Trench capacitor and method for preparing the same
08/29/2006US7098099 Semiconductor device having optimized shallow junction geometries and method for fabrication thereof
08/29/2006US7098098 Methods for transistors formation using selective gate implantation
08/29/2006US7098097 Mass-production packaging means and mass-production packaging method
08/29/2006US7098096 Method of fabricating multi-bit flash memory
08/29/2006US7098095 Method of forming a MOS transistor with a layer of silicon germanium carbon
08/29/2006US7098094 NiSi metal gate stacks using a boron-trap
08/29/2006US7098093 HEMT device and method of making
08/29/2006US7098092 Single electron device, method of manufacturing the same, and method of simultaneously manufacturing single electron device and MOS transistor
08/29/2006US7098091 Method for fabricating thin film transistors
08/29/2006US7098090 Method of forming a semiconductor device
08/29/2006US7098089 Method of fabricating poly-silicon thin film transistor using metal induced lateral crystallization
08/29/2006US7098088 Semiconductor device having semiconductor circuit formed by semiconductor elements and method for manufacturing the same
08/29/2006US7098087 Manufacturing method of semiconductor device
08/29/2006US7098086 Semiconductor device and method of manufacturing thereof
08/29/2006US7098085 Method and apparatus for forming a thin semiconductor film, method and apparatus for producing a semiconductor device, and electro-optical apparatus
08/29/2006US7098084 Semiconductor device and manufacturing method thereof
08/29/2006US7098083 High impedance antifuse
08/29/2006US7098082 Microelectronics package assembly tool and method of manufacture therewith
08/29/2006US7098081 Semiconductor device and method of manufacturing the device
08/29/2006US7098080 Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core
08/29/2006US7098079 Electronic assembly with high capacity thermal interface and methods of manufacture
08/29/2006US7098078 Microelectronic component and assembly having leads with offset portions
08/29/2006US7098077 Semiconductor chip singulation method
08/29/2006US7098076 Flip-chip attach structure and method
08/29/2006US7098075 Integrated circuit and method of producing a carrier wafer for an integrated circuit
08/29/2006US7098074 Microelectronic assemblies having low profile connections
08/29/2006US7098073 Method for stacking an integrated circuit on another integrated circuit
08/29/2006US7098072 Fluxless assembly of chip size semiconductor packages
08/29/2006US7098071 Method for flip chip bonding by utilizing an interposer with embedded bumps
08/29/2006US7098070 Device and method for fabricating double-sided SOI wafer scale package with through via connections
08/29/2006US7098068 Method of forming a chalcogenide material containing device
08/29/2006US7098067 Masked sidewall implant for image sensor
08/29/2006US7098066 Charge coupled device producing method
08/29/2006US7098065 Integrated lid formed on MEMS device
08/29/2006US7098064 Semiconductor laser device and its manufacturing method, and optical disc reproducing and recording apparatus
08/29/2006US7098063 Semiconductor laser device and method of manufacturing the same
08/29/2006US7098062 Manufacturing method of pixel structure of thin film transistor liquid crystal display
08/29/2006US7098061 Forming interconnects using locally deposited solvents
08/29/2006US7098060 Substrates comprise wells whose walls do not require surface treatment prior to deposition of electroluminescent material; subpixillated
08/29/2006US7098059 Surface emitting semiconductor laser and process for producing the same including forming an insulating layer on the lower reflector
08/29/2006US7098058 Photovoltaic healing of non-uniformities in semiconductor devices
08/29/2006US7098057 Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate
08/29/2006US7098056 Apparatus, materials, and methods for fabrication and catalysis
08/29/2006US7098055 Apparatus and method for testing defects
08/29/2006US7098054 Method and structure for determining thermal cycle reliability
08/29/2006US7098053 Method of producing semiconductor elements using a test structure
08/29/2006US7098052 Detection and classification of micro-defects in semi-conductors
08/29/2006US7098051 Structure and method of direct chip attach
08/29/2006US7098049 Shallow trench isolation void detecting method and structure for the same
08/29/2006US7098048 Method and apparatus for capturing fault state data
08/29/2006US7098047 Wafer reuse techniques