H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/24/2006	US20060189087 Semiconductor device and method for fabricating the same
08/24/2006	US20060189086 SON MOSFET using a beam structure and method for fabricating thereof
08/24/2006	US20060189085 Method of forming dual polysilicon gate of semiconductor device
08/24/2006	US20060189084 Memory element and memory device
08/24/2006	US20060189083 Field Effect Transistor With Etched-Back Gate Dielectric
08/24/2006	US20060189082 Standby current reduction over a process window with a trimmable well bias
08/24/2006	US20060189081 LDMOS device and method of fabrication of LDMOS device
08/24/2006	US20060189080 Method for fabricating semiconductor device
08/24/2006	US20060189079 Method of forming nanoclusters
08/24/2006	US20060189078 Semiconductor structures and memory device constructions
08/24/2006	US20060189077 Method for making high-density nonvolatile memory
08/24/2006	US20060189076 Semiconductor device and manufacturing method thereof
08/24/2006	US20060189075 Method of manufacturing semiconductor integrated circuit
08/24/2006	US20060189074 Structure containing self-aligned conductive lines and fabricating method thereof
08/24/2006	US20060189073 Control gate profile for flash technology
08/24/2006	US20060189072 Method and structure for metal-insulator-metal capacitor based memory device
08/24/2006	US20060189071 Integrated circuit capacitor and method of manufacturing same
08/24/2006	US20060189070 Semiconductor device and method of manufacturing the same
08/24/2006	US20060189069 Structure and method for integrating mim capacitor in beol wiring levels
08/24/2006	US20060189068 Integrated high voltage capacitor having a top-level dielectric layer and a method of manufacture therefor
08/24/2006	US20060189067 Power converter apparatus using silicon germanium bipolar transistor for power switching
08/24/2006	US20060189066 Semiconductor device having optimized shallow junction geometries and method for fabrication thereof
08/24/2006	US20060189065 Method of manufacturing metal-oxide-semiconductor transistor
08/24/2006	US20060189064 Method of manufacturing capacitor of semiconductor device
08/24/2006	US20060189063 Insulated gate power semiconductor devices
08/24/2006	US20060189062 Advance ridge structure for microlens gapless approach
08/24/2006	US20060189061 CMOS silicide metal gate integration
08/24/2006	US20060189060 HDP-CVD methodology for forming PMD layer
08/24/2006	US20060189059 Intrinsic decoupling capacitor
08/24/2006	US20060189058 Fin type field effect transistors and methods of manufacturing the same
08/24/2006	US20060189057 Integrated electronic circuit comprising superposed components
08/24/2006	US20060189056 Strained channel complementary field-effect transistors and methods of manufacture
08/24/2006	US20060189055 Method of forming a composite layer, method of manufacturing a gate structure by using the method of forming the composite layer and method of manufacturing a capacitor by using the method of forming the composite layer
08/24/2006	US20060189054 Thin film transistor array panel and manufacturing method thereof
08/24/2006	US20060189053 PMOS transistor with discontinuous CESL and method of fabrication
08/24/2006	US20060189052 Method of fabricating polycrystalline silicon thin film for improving crystallization characteristics and method of fabricating liquid crystal display device using the same
08/24/2006	US20060189051 Semiconductor memory device with high operating current and method of manufacturing the same
08/24/2006	US20060189050 Method of forming a semiconductor device and an optical device and structure thereof
08/24/2006	US20060189049 Four-transistor Schmitt trigger inverter
08/24/2006	US20060189048 Method to strain NMOS devices while mitigating dopant diffusion for PMOS using a capped poly layer
08/24/2006	US20060189047 Television, electronic apparatus, and method of fabricating semiconductor device
08/24/2006	US20060189046 Thin film forming method and forming device therefor
08/24/2006	US20060189045 Method for fabricating a sublithographic contact structure in a memory cell
08/24/2006	US20060189044 High reliability multilayer circuit substrates and methods for their formation
08/24/2006	US20060189043 Trench-gate electrode for FinFET device
08/24/2006	US20060189042 Semiconductor chip and method of fabricating the same
08/24/2006	US20060189041 Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign
08/24/2006	US20060189040 Method of manufacturing an electronic device
08/24/2006	US20060189039 Fabrication of parascan tunable dielectric chips
08/24/2006	US20060189038 Semiconductor component and method of manufacture
08/24/2006	US20060189037 Low cost method to produce high volume lead frames
08/24/2006	US20060189036 Methods and systems for adhering microfeature workpieces to support members
08/24/2006	US20060189035 Placement of Absorbing Material in a Semiconductor Device
08/24/2006	US20060189034 Thin film processing method and thin film processing apparatus
08/24/2006	US20060189033 Integrated circuit package-in-package system
08/24/2006	US20060189032 Process for assembling a double-sided circuit component
08/24/2006	US20060189031 Semiconductor device and manufacturing method thereof
08/24/2006	US20060189030 Heat shrinkable insulated packaging
08/24/2006	US20060189029 Method for efficient annealing of plated semiconductor package leads
08/24/2006	US20060189028 Wafer having alternating design structure and method for manufacturing semiconductor package using the same
08/24/2006	US20060189027 Method of fabricating avalanche photodiode
08/24/2006	US20060189026 Method for manufacturing a display device with low temperature diamond coatings
08/24/2006	US20060189025 Electro-optical device and manufacturing method thereoff
08/24/2006	US20060189024 Microlens structure for image sensors
08/24/2006	US20060189023 Three dimensional structure formed by using an adhesive silicon wafer process
08/24/2006	US20060189022 MEMS heat pumps for integrated circuit heat dissipation
08/24/2006	US20060189021 Sample support prepared by semiconductor silicon process technique
08/24/2006	US20060189020 Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based light emitting diode using the same
08/24/2006	US20060189019 Growth process of a crystalline gallium nitride based compound and semiconductor device including gallium nitride based compound
08/24/2006	US20060189018 P-n heterojuction structure of zinc oxide-based nanorod and semiconductor thin film, preparation thereof, and nano-device comprising same
08/24/2006	US20060189017 Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating apparatus used for the same
08/24/2006	US20060189016 Method of fabricating semiconductor optical device
08/24/2006	US20060189015 Liquid crystal display and fabrication method thereof
08/24/2006	US20060189014 High-luminescence silicon electroluminescence device
08/24/2006	US20060189013 Method of making LED encapsulant with undulating surface
08/24/2006	US20060189012 Nitride compound semiconductor light emitting device and method for producing the same
08/24/2006	US20060189011 Semiconductor device and control method
08/24/2006	US20060189010 Method of testing FPC bonding yield and FPC having testing pads thereon
08/24/2006	US20060189009 Apparatus for controlling semiconductor manufacturing process
08/24/2006	US20060189008 Method for monitoring implantation depth of impurity
08/24/2006	US20060189007 Wirebond crack sensor for low-k die
08/24/2006	US20060189006 Method and apparatus for detecting end point
08/24/2006	US20060189005 Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates
08/24/2006	US20060189004 Electronic and optoelectronic devices and methods for preparing same
08/24/2006	US20060189003 Temperature-compensated ferroelectric capacitor device, and its fabrication
08/24/2006	US20060189002 Biochip platform including dielectric particle layer and optical assay apparatus using the same
08/24/2006	US20060188907 Patterning method, substrate for biomolecule immobilization using the patterning method, and biochip employing the substrate
08/24/2006	US20060188827 Selective surface exposure, cleans and conditioning of the germanium film in a Ge photodetector
08/24/2006	US20060188360 Direct tool loading
08/24/2006	US20060188359 Fast swap dual substrate transport for load lock
08/24/2006	US20060188358 Direct tool loading
08/24/2006	US20060188240 Substrate processing apparatus and substrate processing method
08/24/2006	US20060187737 Pattern layout of word line transfer transistors in NAND flash memory which executes subblock erase
08/24/2006	US20060187714 Flash Memory Cell Arrays Having Dual Control Gates Per Memory Cell Charge Storage Element
08/24/2006	US20060187703 Magnetoresistive effect element, magentic memory device and manufacturing method of magnetoresistive effect element and magnetic memory device
08/24/2006	US20060187699 Semiconductor devcie with isolation layer
08/24/2006	US20060187549 Methods for reducing polarization aberration in optical systems
08/24/2006	US20060187524 Pattern generator diffractive mirror methods and systems
08/24/2006	US20060187468 Optical metrology of single features
08/24/2006	US20060187439 Stage system including fine-motion cable unit, exposure apparatus, and method of manufacturing device

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