Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/17/2006US20060180856 Semicondutor device and a method of manufacturing the same
08/17/2006US20060180853 SONOS memory device having side gate stacks and method of manufacturing the same
08/17/2006US20060180850 Process for manufacturing a memory with local electrical contact between the source line and the well
08/17/2006US20060180848 Wing gate transistor for integrated circuits
08/17/2006US20060180845 Memory device with silicon rich silicon oxide layer and method of manufacturing the same
08/17/2006US20060180844 Integrated circuitry and method of forming a capacitor
08/17/2006US20060180843 Methods of forming electronic devices including electrodes with insulating spacers thereon
08/17/2006US20060180842 Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same
08/17/2006US20060180840 Switched capacitor circuit and semiconductor integrated circuit thereof
08/17/2006US20060180837 TFT substrate for display device and manufacturing method of the same
08/17/2006US20060180836 Semiconductor device and manufacturing method thereof
08/17/2006US20060180833 Semiconductor material having bipolar transistor structure and semiconductor device using same
08/17/2006US20060180829 Tunneling gap diodes
08/17/2006US20060180815 Flexible active matrix display backplane and method
08/17/2006US20060180814 Thin film transistor-liquid crystal display and manufacturing method therefor
08/17/2006US20060180804 Thin-film semiconductor component and production method for said component
08/17/2006US20060180788 an aqueous fluid comprising an oxidizer that produces oxygen-containing free radicals when contacted with an activator comprising oxides of iron or copper coated with tin, and abrasive particles comprising alumina or alumina-coated silica, used for chemical mechanical polishing (cmp)
08/17/2006US20060180787 Cerium oxide abrasive and method of polishing substrates
08/17/2006US20060180595 Method and system for transferring dies between surfaces
08/17/2006US20060180580 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
08/17/2006US20060180573 Placing substrate having an open metal surface thereon into a high pressure processing chamber and onto a platen configured to support substrate; introducing supercritical carbon dioxide fluid to high pressure processing chamber; introducing fluorosilicic acid and butyrolactone
08/17/2006US20060180572 Removal of post etch residue for a substrate with open metal surfaces
08/17/2006US20060180571 Plasma etching method and apparatus, control program for performing the etching method, and storage medium storing the control program
08/17/2006US20060180499 Wafer box with radially pivoting latch elements
08/17/2006US20060180461 Stable electroless fine pitch interconnect plating
08/17/2006US20060180343 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same
08/17/2006US20060180341 Multilayer printed wiring board and method of manufacturing the same
08/17/2006US20060180338 Electrical connection component
08/17/2006US20060180200 Thin-film solar cell
08/17/2006US20060180186 Transducer assembly for megasonic processing of an article
08/17/2006US20060180180 System and method for cleaning semiconductor fabrication equipment parts
08/17/2006US20060180177 Semiconductor substrate cleaning system
08/17/2006US20060180173 System and method for removal of materials from an article
08/17/2006US20060180136 Tape expansion apparatus
08/17/2006US20060180087 Substrate susceptor for receiving a substrate to be deposited upon
08/17/2006US20060180086 Susceptor and vapor growth device
08/17/2006US20060180083 Positioning board for positioning heater lines during plasma enhanced CVD (PECVD)
08/17/2006US20060180082 Film formation apparatus
08/17/2006US20060180078 Gas reaction system and semiconductor processing apparatus
08/17/2006US20060180077 Method of growing semiconductor crystal
08/17/2006US20060180076 Vapor deposition apparatus and vapor deposition method
08/17/2006US20060179916 Frequency characteristics measuring method and device for acceleration sensor
08/17/2006US20060179632 Support system for semiconductor wafers
08/17/2006US20060179626 Method and apparatus for a partially etched capacitor layer including a connection member
08/17/2006US20060179625 Solid electrolytic capacitor and method of manufacturing the same
08/17/2006DE202006005238U1 Device for breaking of semiconductor disks has two counter holder which are facing upper side of semiconductor disk, which with one another is positioned, vertical and horizontal, at two opposite side of breaking line
08/17/2006DE19549628B4 Washing appts. for cleaning of semiconductor substrate surface - has jet nozzle with mixer to mix fluid and gas before guiding droplets toward substrate surface
08/17/2006DE112004001230T5 Züchtungsverfahren für Nitridhalbleiter-Epitaxieschichten The growth method of nitride semiconductor epitaxial layers
08/17/2006DE10330571B4 Vertikales Leistungshalbleiterbauelemente mit Injektionsdämpfungsmittel im Randbereich und Herstellungsverfahren dafür Vertical power semiconductor components with injection damping means in the edge area and production method thereof
08/17/2006DE10301496B4 Halbleiteranordnung mit p- und n-Kanal-Transistoren sowie Verfahren zu deren Herstellung A semiconductor device having p- and n-channel transistors as well as processes for their preparation
08/17/2006DE10239312B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Driftzone und einer Feldstoppzone und Halbleiterbauelement mit einer Driftzone und einer Feldstoppzone A process for producing a semiconductor device having a drift region and a field stop zone and the semiconductor device having a drift region and a field stop zone
08/17/2006DE10230891B4 Photolithographisches System und photolithographes Verfahren zur Erfassung von Verunreinigungen aufder Oberfläche von Wafern Photolithography system and method for detecting photolithographes of impurities on the surface of wafers
08/17/2006DE102006005875A1 Epitaxial semiconductor substrate manufacturing method involves forming epitaxial layer over gettering layer
08/17/2006DE102006003591A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine
08/17/2006DE102006003102A1 Halbleiterbauelement, Bipolartransistor und Herstellungsverfahren A semiconductor device manufacturing method bipolar transistor and
08/17/2006DE102006003100A1 Device forming apparatus for fabricating a semiconductor device comprises reaction chamber, first processing gas supply pipe, four-way valve, second processing gas supply pipe and bypass, and gate valve
08/17/2006DE102006002240A1 Protection film coating method for wafer e.g. sapphire wafer involves blowing liquid resin on center of processing surface of wafer towards outer periphery of wafer as spinning table turns
08/17/2006DE102006000613A1 DRAM mit High-K-Dielektrikum-Speicherkondensator und Verfahren zum Herstellen desselben DRAM of the same with high-K dielectric storage capacitor and methods for producing
08/17/2006DE102005056703A1 TFT-Arraysubstrat und zugehöriges Herstellverfahren TFT array substrate manufacturing process and related
08/17/2006DE102005054353A1 Electronic component, especially multi chip as in ball grid array, has one chip above another with spacers between them and bond wire to inner conductive surface of lower chip
08/17/2006DE102005005709A1 Verfahren und Einrichtung zur Bearbeitung von Materialoberflächen Method and apparatus for processing of material surfaces
08/17/2006DE102005005622A1 Safety-semiconductor chip stack, has connecting units provided in chips to provide mechanical connection between chips, where units and functional layers are made from copper, and units stand in direct contact with layers
08/17/2006DE102005005101A1 Integrated circuit`s semiconductor components testing system, has control unit that switches switching device based on power consumption information to connect or separate integrated circuits with or from supply unit
08/17/2006DE102005004795A1 Reactive material wet-chemical removal method for e.g. bulk acoustic wave filter, involves bringing material in contact with wet-chemical treatment unit through access opening in structure for removing material from structure
08/17/2006DE102005004360A1 Effizientes Verfahren zum Herstellen und Zusammenfügen eines mikroelektronischen Chips mit Lothöckern Efficient process for producing and assembling a microelectronic chips with solder bumps
08/17/2006DE102005002837A1 Transparent electrode manufacturing method, e.g. for organic light emitting diode, involves providing data set that contains data representing structure of conductive paths to be manufactured, where paths form structured electrode layer
08/17/2006DE102004062214B4 Halbleitervorrichtung mit Temperaturerfassungsfunktion A semiconductor device comprising temperature detection function
08/17/2006DE102004059599B3 Verfahren zum Aufbringen einer Klebstoffschicht auf dünngeschliffene Halbleiterchips eines Halbleiterwafers A method of applying an adhesive layer on thin ground semiconductor chips of a semiconductor wafer
08/17/2006DE102004059506B3 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe einer separaten Versorgungsspannung An arrangement for embedded test circuits by means of a separate supply voltage
08/17/2006DE102004058411B3 Halbleiterwafer mit einer Teststruktur und Verfahren Semiconductor wafer having a test structure and method
08/17/2006DE102004025974B4 Programmierbares Speicherbauelement, integrierter Schaltkreis und Verfahren zur Herstellung desselben Programmable memory device, integrated circuit and methods for manufacturing the same
08/17/2006DE10200279B4 Gasinjektor-Anordnung mit Gasinjektoren aus einem Keramikmaterialblock mit Gasinjektorlöchern, die sich durch diesen erstrecken, und ein die Gasinjektor-Anordnung enthaltenes Ätzgerät Gas injector assembly with gas injectors of a ceramic block with Gasinjektorlöchern extending therethrough, and the gas injector arrangement contained etcher
08/17/2006DE10194958B4 Verfahren zur Herstellung einer Sperr-/ Haftschicht und einer Kristallkeimschicht in einer integrierten Schaltkreisanordnung und zugehörige integrierte Schaltkreisanordnung A method for producing a barrier / adhesion layer and a seed layer in an integrated circuit array and associated integrated circuitry
08/17/2006DE10133959B4 Elektronisches Bauteil mit Halbleiterchip Electronic component with semiconductor chip
08/17/2006DE10116529B4 Verfahren zur Herstellung von Kondensatoren mit tiefen Gräben für Drams mit verringerter Facettierung an der Substratkante, und zur Bereitstellung einer gleichförmigeren Anschlussflächenschicht aus SI3N4 über das Substrat A process for the production of capacitors with deep trenches for DRAM having reduced faceting at the substrate edge, and to provide a more uniform connector surface layer of the substrate over SI3N4
08/17/2006DE10110151B4 Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet Wiring substrate, process for producing the same and electronic apparatus using the same
08/17/2006CA2597289A1 Method of manufacturing a hermetic chamber with electrical feedthroughs
08/17/2006CA2592029A1 Target design for high-power laser accelerated ions
08/16/2006EP1691424A2 Method and device for fabrication of silicon solar cells
08/16/2006EP1691419A2 Field-effect transistor and method of manufacturing a field-effect transistor
08/16/2006EP1691412A2 Semiconductor heatsink and process for producing the same
08/16/2006EP1691411A2 Circuit member for semiconductor device, semiconductor device using the same, and process for producing said circuit member and said semiconductor device
08/16/2006EP1691410A2 Method for defining a feature on a substrate
08/16/2006EP1691409A1 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
08/16/2006EP1691408A2 Method of and program for manufacturing an electronic device
08/16/2006EP1691407A1 Integrated circuit having a Schottky diode with a self-aligned floating guard ring and method for fabricating such a diode
08/16/2006EP1691406A1 Semiconductor manufacturing equipment and semiconductor manufacturing method
08/16/2006EP1691405A2 Package or pre-applied foamable underfill for lead-free process
08/16/2006EP1691404A2 Amorphous high-k thin film and manufacturing thereof
08/16/2006EP1691403A1 Method of cleaning semiconductor substrate conductive layer surface
08/16/2006EP1691402A1 Plasma etching method
08/16/2006EP1691401A2 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
08/16/2006EP1691400A1 Preparation of metal silicon nitride films via cyclic deposition
08/16/2006EP1691399A2 Semiconductor device with capacitor structure for improving area utilization
08/16/2006EP1691398A1 Ceramic heater unit
08/16/2006EP1691383A1 Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same
08/16/2006EP1691373A1 ROM-device and programming method
08/16/2006EP1691340A1 Thin film transistor integrated circuit device, active matrix display device, and manufacturing method of the same
08/16/2006EP1691206A2 Method and apparatus for testing semiconductor dice
08/16/2006EP1691202A1 Vibration piezoelectric acceleration sensor