Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/24/2006WO2005105158A3 Clean room guided conveyor
08/24/2006WO2005101100A3 Method and apparatus for in-situ film stack processing
08/24/2006WO2005052179A3 Method of making carbon nanotube arrays, and thermal interfaces using same
08/24/2006WO2005024972A3 Method for producing electronic components
08/24/2006WO2004110698A3 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
08/24/2006US20060190921 Manufacturing Method of Semiconductor Device
08/24/2006US20060190920 Optical proximity correction performed with respect to limited area
08/24/2006US20060190909 Method for designing a system LSI
08/24/2006US20060190897 Methods of routing an integrated circuit design
08/24/2006US20060190875 Pattern extracting system, method for extracting measuring points, method for extracting patterns, and computer program product for extracting patterns
08/24/2006US20060190860 Method and system for debugging using replicated logic and trigger logic
08/24/2006US20060190846 Building metal pillars in a chip for structure support
08/24/2006US20060190120 Semiconductor manufacturing apparatus, management apparatus therefor, component management apparatus therefor, and semiconductor wafer storage vessel transport apparatus
08/24/2006US20060189465 Roller that avoids substrate slippage
08/24/2006US20060189259 Polishing apparatus and related polishing methods
08/24/2006US20060189172 Method using specific contact angle for immersion lithography
08/24/2006US20060189171 Seasoning process for a deposition chamber
08/24/2006US20060189170 Plasma treatment apparatus and method for plasma treatment
08/24/2006US20060189169 Method for heat treatment of silicon wafers
08/24/2006US20060189168 Plasma generator, ozone generator, substrate processing apparatus and manufacturing method of semiconductor device
08/24/2006US20060189167 Method for fabricating silicon nitride film
08/24/2006US20060189166 Process for performing an isolated Pd(II)-mediated oxidation reaction
08/24/2006US20060189165 Method and apparatus for non-aggressive plasma-enhanced vapor deposition of dielectric films
08/24/2006US20060189164 Hafnium alloy target and process for producing the same
08/24/2006US20060189163 Method of forming thick silica-based film
08/24/2006US20060189162 Adhesion improvement for low k dielectrics
08/24/2006US20060189161 Method and apparatus for treating organosiloxane coating film
08/24/2006US20060189160 Method for producing a pattern formation mold
08/24/2006US20060189159 Methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and methods of forming trench isolation in the fabrication of integrated circuitry
08/24/2006US20060189158 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry
08/24/2006US20060189157 Method for forming an integrated circuit semiconductor substrate
08/24/2006US20060189156 Method for making a semiconductor device having a high-k gate dielectric
08/24/2006US20060189155 Method of Forming Semiconductor Compound Film For Fabrication of Electronic Device and Film Produced by Same
08/24/2006US20060189154 Atomic layer deposition of Hf3N4/HfO2 films as gate dielectrics
08/24/2006US20060189153 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same
08/24/2006US20060189152 Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition
08/24/2006US20060189151 Method for forming an infrared photodetector with a vertical optical path
08/24/2006US20060189150 Composition for an organic hard mask and method for forming a pattern on a semiconductor device using the same
08/24/2006US20060189149 Method of smoothening dielectric layer
08/24/2006US20060189148 Transistor having a metal nitride layer pattern, etchant and methods of forming the same
08/24/2006US20060189147 Pattern forming method and semiconductor device manufacturing method
08/24/2006US20060189146 Method for patterning micro features by using developable bottom anti-reflection coating
08/24/2006US20060189145 Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed
08/24/2006US20060189144 Multiple layer etch stop and etching method
08/24/2006US20060189143 Metal structure with sidewall passivation and method
08/24/2006US20060189142 Method for making a sub-micron solid oxide electrolyte membrane
08/24/2006US20060189141 Solution for etching copper surfaces and method of depositing metal on copper surfaces
08/24/2006US20060189140 Insulated pad conditioner and method of using same
08/24/2006US20060189139 Methods and apparatuses for electrochemical-mechanical polishing
08/24/2006US20060189138 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
08/24/2006US20060189137 Method of forming damascene filament wires and the structure so formed
08/24/2006US20060189136 Manufacturing method for non-active electrically structures in order to optimize the definition of active electrically structures in an electronic circuit integrated on a semiconductor substrate and corresponding circuit
08/24/2006US20060189135 Trench interconnect structure and formation method
08/24/2006US20060189134 Ta-TaN selective removal process for integrated device fabrication
08/24/2006US20060189133 Reliable BEOL integration process with direct CMP of porous SiCOH dielectric
08/24/2006US20060189132 Method for forming porous thin film
08/24/2006US20060189131 Composition and process for element displacement metal passivation
08/24/2006US20060189130 Method of forming metal line in semiconductor device
08/24/2006US20060189129 Method for applying metal features onto barrier layers using ion permeable barriers
08/24/2006US20060189128 Method of forming a conductive line and a method of forming a conductive contact adjacent to and insulated from a conductive line
08/24/2006US20060189127 Method to improve palanarity of electroplated copper
08/24/2006US20060189126 Method of forming semiconductor device having epitaxial contact plug connecting stacked transistors
08/24/2006US20060189125 Multilayer wiring substrate, and method of producing same
08/24/2006US20060189124 Semiconductor device having a through contact through a housing composition and method for producing the same
08/24/2006US20060189123 Etchant and method of etching
08/24/2006US20060189122 Method of forming isolated features of semiconductor devices
08/24/2006US20060189121 Thin silicon based substrate
08/24/2006US20060189120 Method of making reinforced semiconductor package
08/24/2006US20060189119 Encapsulation of circuit components to reduce thermal cycling stress
08/24/2006US20060189118 Microfeature devices and methods for manufacturing microfeature devices
08/24/2006US20060189117 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/24/2006US20060189116 Dual metal stud bumping for flip chip applications
08/24/2006US20060189115 Wiring structure forming method and semiconductor device
08/24/2006US20060189114 Method of manufacturing semiconductor device and semiconductor device
08/24/2006US20060189113 Metal nanoparticle compositions
08/24/2006US20060189112 Electronic devices fabricated by use of random connections
08/24/2006US20060189111 Method of making CMOS devices on strained silicon on glass
08/24/2006US20060189110 Body capacitor for SOI memory description
08/24/2006US20060189109 Methods of fabricating contact regions for FET incorporating SiGe
08/24/2006US20060189108 Suppressing formation of metal silicides on semiconductor surfaces
08/24/2006US20060189107 Merged P-i-N Schottky structure
08/24/2006US20060189106 Manufacture method for semiconductor device having field oxide film
08/24/2006US20060189105 Drive circuit of active matrix device and manufacturing method thereof
08/24/2006US20060189104 Method for forming a quantum dot pattern
08/24/2006US20060189103 Solution treatment apparatus and solution treatment method
08/24/2006US20060189102 Process for treating substrates for the microelectronics industry, and substrates obtained by this process
08/24/2006US20060189101 DBG system and method with adhesive layer severing
08/24/2006US20060189100 Method for cutting a wafer using a protection sheet
08/24/2006US20060189099 Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade
08/24/2006US20060189098 Substrate removal process for high light extraction LEDs
08/24/2006US20060189097 Method for manufacturing semiconductor device
08/24/2006US20060189096 Creation of high mobility channels in thin-body SOI devices
08/24/2006US20060189095 Semiconductor substrates having useful and transfer layers
08/24/2006US20060189094 Method for integrating an electronic component or similar into a substrate
08/24/2006US20060189093 Adhesive with differential optical properties and its application for substrate processing
08/24/2006US20060189092 Manufacturing method of semiconductor device with filling insulating film into trench
08/24/2006US20060189091 Method and system for laser hard marking
08/24/2006US20060189090 Method for fabricating a metal-insulator-metal capacitor
08/24/2006US20060189089 Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor
08/24/2006US20060189088 Semiconductor device having a merged region and method of fabrication