| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/30/2006 | EP1694885A2 Multi-chemistry plating system |
| 08/30/2006 | EP1694769A1 Dual-stage wafer applied underfills |
| 08/30/2006 | EP1694615A2 Method and apparatus for forming an soi body-contacted transistor |
| 08/30/2006 | EP1694597A1 Microcomponent comprising a hermetic microcavity and method for production of such a microcomponent |
| 08/30/2006 | EP1694585A2 Wafer container with door actuated wafer restraint |
| 08/30/2006 | EP1694506A1 Method and apparatus for printing a patterned layer on a flat substrate with a flat-type-bed |
| 08/30/2006 | EP1694467A1 Flexible formed sheets for treating surfaces |
| 08/30/2006 | EP1627425B1 Method for the production of a chip arrangement and varnish for carrying out said method |
| 08/30/2006 | EP1554747B1 Plasma system and method for anisotropically etching structures into a substrate |
| 08/30/2006 | EP1335801B1 Apparatus and method for removing particles from solid-state surfaces |
| 08/30/2006 | EP1328966A4 System and method to control radial delta temperature |
| 08/30/2006 | EP1252966B1 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| 08/30/2006 | EP1232519B1 Method for forming decoupling capacitors using lithographic dummy fillers |
| 08/30/2006 | EP1224696B1 Solid-source doping for source/drain of flash memory |
| 08/30/2006 | EP1218729A4 Apparatus and method for texture analysis on semiconductor wafers |
| 08/30/2006 | EP1200532B1 Cmp composition containing silane modified abrasive particles |
| 08/30/2006 | EP1138088A4 Melt through contact formation method |
| 08/30/2006 | EP1083219B1 Cleaning fluid and cleaning method for component of semiconductor-treating apparatus |
| 08/30/2006 | EP1078402B1 Semiconductor system with trenches for separating doped areas |
| 08/30/2006 | EP1064338B1 Chemical mechanical polishing slurry useful for copper substrates |
| 08/30/2006 | EP1035568B1 Method of plasma processing |
| 08/30/2006 | EP1000363B1 Spreading resistance profiling system |
| 08/30/2006 | EP0993039B1 Substrate for mounting semiconductor chips |
| 08/30/2006 | EP0979414B1 Multi-probe test head and test method |
| 08/30/2006 | EP0910125B1 Method and device for sealing ic chip |
| 08/30/2006 | EP0749632B1 Electrostatic discharge protection of isfet sensors |
| 08/30/2006 | CN2812302Y Thin film transistor structure capable of reducing starting voltage excursion |
| 08/30/2006 | CN2812294Y Synchronous adjusting mechanism for crystal grain tray bearing device |
| 08/30/2006 | CN2812293Y Memory module with its chips being connected by holddown piece and conducting terminals |
| 08/30/2006 | CN2812292Y Surface defect detector for silicon slice with scattered light intensity multiplication system |
| 08/30/2006 | CN2812291Y A heating device for wafer-fixing bonding wire |
| 08/30/2006 | CN2812290Y Protection structure for wafer mill |
| 08/30/2006 | CN2812289Y 芯片盒 Chip Box |
| 08/30/2006 | CN2812052Y Structure of photoresist coating developing equipment |
| 08/30/2006 | CN1826844A Solder ball loading method and solder ball loading unit |
| 08/30/2006 | CN1826843A Plasma treating apparatus and its electrode structure |
| 08/30/2006 | CN1826696A Varying carrier mobility in semiconductor devices to achieve overall design goals |
| 08/30/2006 | CN1826695A Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same |
| 08/30/2006 | CN1826694A Nanowhiskers with PN junctions and methods of fabricating thereof |
| 08/30/2006 | CN1826692A Method for reducing short channel effects in memory cells and related structure |
| 08/30/2006 | CN1826691A Multi-power source voltage semiconductor device |
| 08/30/2006 | CN1826690A Fet channel having a strained lattice structure along multiple surfaces |
| 08/30/2006 | CN1826687A Wiring structure and method for producing same |
| 08/30/2006 | CN1826686A 集成传感器芯片单元 Integrated sensor chip unit |
| 08/30/2006 | CN1826685A Method and system for electronic spatial filtering of spectral reflectometer optical signals |
| 08/30/2006 | CN1826684A Method for polishing wafer |
| 08/30/2006 | CN1826683A Silicon crystallization using self-assembled monolayers |
| 08/30/2006 | CN1826682A Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
| 08/30/2006 | CN1826679A RF current return path for a large area substrate plasma reactor |
| 08/30/2006 | CN1826664A Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 08/30/2006 | CN1826434A Method of fabricating an epitaxially grown layer |
| 08/30/2006 | CN1826433A Method of fabricating an epitaxially grown layer |
| 08/30/2006 | CN1826428A Method of forming thin film, thin film forming apparatus, program and computer-readable information recording medium |
| 08/30/2006 | CN1826426A Method for forming copper film |
| 08/30/2006 | CN1826424A Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
| 08/30/2006 | CN1826397A Ceria abrasive for cmp |
| 08/30/2006 | CN1826286A Method for fixing metal particle, and method for producing metal particle-containing substrate, method for producing carbon nanotube-containing substrate and method for producing semiconductor crystal |
| 08/30/2006 | CN1826285A Stacked structure and production method thereof |
| 08/30/2006 | CN1826210A Method of preparing a surface of a semiconductor wafer to make it epiready |
| 08/30/2006 | CN1826207A Laser machining method and device, and machined product |
| 08/30/2006 | CN1826206A Focusing an optical beam to two foci |
| 08/30/2006 | CN1826185A Edge bead control method and apparatus |
| 08/30/2006 | CN1825784A Communication method and apparatus |
| 08/30/2006 | CN1825731A Apparatus and method for operating controlling of multi-electric power usage system, program and storage medium |
| 08/30/2006 | CN1825645A Led housing and fabrication method thereof |
| 08/30/2006 | CN1825644A High power led housing and fabrication method thereof |
| 08/30/2006 | CN1825638A Mould and method for packing LED |
| 08/30/2006 | CN1825636A Carrier structure of luminescent wafer |
| 08/30/2006 | CN1825633A Sealing technique for solar photo voltaic battery plate |
| 08/30/2006 | CN1825629A Top gate type thin film transistor |
| 08/30/2006 | CN1825628A Semiconductor device including high-k insulating layer and method of manufacturing the same |
| 08/30/2006 | CN1825627A Semiconductor element and method of forming the same |
| 08/30/2006 | CN1825625A Strained transistor with hybrid-strain inducing layer and method of forming the same |
| 08/30/2006 | CN1825624A Charge coupled device and solid-state imaging apparatus |
| 08/30/2006 | CN1825623A Bi-carrier scr circuit and method of forming the same |
| 08/30/2006 | CN1825620A Light emitting device |
| 08/30/2006 | CN1825618A 有机el面板及其制造方法 Organic el panel and manufacturing method |
| 08/30/2006 | CN1825616A Display device, electronic equipment, and manufacturing method of display device |
| 08/30/2006 | CN1825614A Organic electroluminescence display device having auxiliary electrode line and method of manufacturing the same |
| 08/30/2006 | CN1825612A Phase-change ram and method for fabricating the same |
| 08/30/2006 | CN1825611A Semiconductor device, its manufacturing method, and liquid discharging device using it |
| 08/30/2006 | CN1825608A Solid state imaging device and method for producing the same |
| 08/30/2006 | CN1825607A Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device |
| 08/30/2006 | CN1825606A Image sensor and method for fabricating the same |
| 08/30/2006 | CN1825604A Sensor packing structure, sensor packing process, sensor module and mfg. method thereof |
| 08/30/2006 | CN1825603A Methods to improve photonic performances of photo-sensitive integrated circuits |
| 08/30/2006 | CN1825600A Semiconductor device |
| 08/30/2006 | CN1825598A Semiconductor device and method of manufacturing the same |
| 08/30/2006 | CN1825597A Storage element, semiconductor element and method of manufacture the same |
| 08/30/2006 | CN1825596A 薄膜晶体管阵列面板及其制造方法 The thin film transistor array panel and manufacturing method thereof |
| 08/30/2006 | CN1825593A Semiconductor thin film and its manufacturing method and semiconductor device and its manufacturing method |
| 08/30/2006 | CN1825592A NAND-type flash memory devices and fabrication methods thereof |
| 08/30/2006 | CN1825590A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/30/2006 | CN1825589A Semiconductor device and inspection method of the same and electromagnetic detection equipment |
| 08/30/2006 | CN1825586A Led assembly and method of making the same |
| 08/30/2006 | CN1825583A Multistage interconnection structure and method of forming cu interconnection on IC wafer |
| 08/30/2006 | CN1825582A Multilayer inner-dielectric-ayer of semiconductor component and manufacture method of the same |
| 08/30/2006 | CN1825581A Printed circuit board, flip chip ball grid array board and method of fabricating the same |
| 08/30/2006 | CN1825578A Semiconductor device manufacturing method |
| 08/30/2006 | CN1825571A Thin film transistor array panel and method of manufacturing the same |