Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/06/2014US20140061716 Esd protection device
03/06/2014US20140061715 Zener diode device and fabrication
03/06/2014US20140061693 Nitride semiconductor wafer, nitride semiconductor device, and method for manufacturing nitride semiconductor wafer
03/06/2014US20140061674 SiC SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
03/06/2014US20140061669 Chip package and a method for manufacturing a chip package
03/06/2014US20140061663 Semiconductor buffer structure, semiconductor device including the same, and manufacturing method thereof
03/06/2014US20140061661 Sapphire substrate and method for manufacturing the same and nitride semiconductor light emitting element
03/06/2014US20140061659 GaN Dual Field Plate Device with Single Field Plate Metal
03/06/2014US20140061658 High Electron Mobility Transistor and Manufacturing Method Thereof
03/06/2014US20140061655 Method for extreme ultraviolet electrostatic chuck with reduced clamping effect
03/06/2014US20140061641 Metrology test structures in test dies
03/06/2014US20140061634 Thin film transistor, method for manufacturing the same, array substrate and display device
03/06/2014US20140061633 Oxide tft and manufacturing method thereof
03/06/2014US20140061590 Graphene device and method of manufacturing the same
03/06/2014US20140061582 Suspended nanowire structure
03/06/2014US20140061575 Three dimensional memory array architecture
03/06/2014US20140061574 Three dimensional memory array architecture
03/06/2014US20140061572 Semiconductor device and method of manufacturing the same
03/06/2014US20140061568 Resistive memory devices
03/06/2014US20140061338 Gas injection device and solar cell manufacturing method using the same
03/06/2014US20140061158 Reduced isotropic etchant material consumption and waste generation
03/06/2014US20140060751 Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method
03/06/2014US20140060740 Plasma processing device
03/06/2014US20140060737 Femtosecond Laser-Induced Formation Of Submicrometer Spikes On A Semiconductor Substrate
03/06/2014US20140060735 Substrate processing apparatus
03/06/2014US20140060728 Method of manufacturing display device
03/06/2014US20140060648 Inorganic multilayer stack and methods and compositions relating thereto
03/06/2014US20140060596 Partial solution replacement in recyclable persulfuric acid cleaning systems
03/06/2014US20140060575 Substrate treating method
03/06/2014US20140060573 Substrate treatment method and substrate treatment apparatus
03/06/2014US20140060572 Plasma processing apparatus and cleaning method for removing metal oxide film
03/06/2014US20140060433 Gas exhaust for high volume, low cost system for epitaxial silicon deposition
03/06/2014US20140060385 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
03/06/2014US20140059851 Circuit board structure and method for manufacturing a circuit board structure
03/06/2014US20140059836 Rotatable locating apparatus with dome carrier and operating method thereof
03/06/2014US20140059789 Apparatus for Cleaning a Semiconductor Substrate
03/06/2014DE112012002075T5 Laterale Halbleitervorrichtung Lateral semiconductor device
03/06/2014DE112010004330B4 Verfahren mit asymmetrischer Epitaxie zur Herstellung von Feldeffekttransistoren A process for the preparation of asymmetric epitaxial field effect transistors
03/06/2014DE112010000928B4 Schleifwerkzeug Grinding tool
03/06/2014DE102013217329A1 Übertragungsvorrichtung, Formmaterial und Übertragungsverfahren Transmission device, shape and material transfer process
03/06/2014DE102013217225A1 Halbleiterbauelement mit einer Passivierungsschicht und Verfahren zu dessen Herstellung A semiconductor device with a passivation layer and process for its preparation
03/06/2014DE102013217140A1 Ladungsträgerteilchenstrahl-Musterschreibverfahren und Ladungsträgerteilchenstrahl-Schreibvorrichtung Charged particle pattern writing method and charged particle-writer
03/06/2014DE102013216633A1 Vorgesinterte Halbleiterchip-Struktur Presintered semiconductor chip structure
03/06/2014DE102013214300A1 Verfahren zum Bilden einer Materialschicht in einer Halbleiterstruktur A method of forming a material layer in a semiconductor structure
03/06/2014DE102013213785A1 Verfahren und System zur Bestimmung von Überlappungsprozessfenstern in Halbleitern durch Inspektionstechniken Method and system for determining overlapping process windows in semiconductors by inspection techniques
03/06/2014DE102013109542A1 Chipbaugruppe und verfahren zur herstellung einer chipbaugruppe Chip module and method of producing a chip package
03/06/2014DE102013109375A1 Verfahren zum verarbeiten eines wafers und schichtanordnung A method for processing a wafer and layer arrangement
03/06/2014DE102013109285A1 Verfahren zur Herstellung einer Schichtanordnung, und Schichtanordnung A method for producing a layer arrangement and layer arrangement
03/06/2014DE102013109202A1 Verfahren zur Behandlung einer Halbleiterschicht A process for treating a semiconductor layer
03/06/2014DE102013108587A1 Elektronenstrahldetektor, Elektronenstrahlarbeitsgerät und Verfahren zur Herstellung eines Elektronenstrahldetektors Electron beam detector, electron work device and method for producing an electron beam detector
03/06/2014DE102013105520A1 Abdeckung zum Schützen von Solarzellen während deren Herstellung Cover for protecting solar cell during the preparation thereof
03/06/2014DE102013104112A1 Verbindungsstruktur und -verfahren Connection structure and procedures
03/06/2014DE102013101192A1 Dreidimensionales (3-D), aufgefächertes Gehäusebauteil Three-dimensional (3-D), fanned housing component
03/06/2014DE102013101162A1 System und verfahren für einen feldeffekttransistor mit einer angehobenen drain-struktur System and method for a field effect transistor with a raised drain structure
03/06/2014DE102013013767A1 Verfahren zur Herstellung von Silber-Minidrahtfilmen A process for the preparation of silver mini wire films
03/06/2014DE102013012548A1 Verfahren zur Herstellung von Silber-Nanodrähten mit hohem Seitenverhältnis A process for the production of silver nanowires with high aspect ratio
03/06/2014DE102012221080A1 Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements A method for producing a layer on a surface region of an electronic component
03/06/2014DE102012215705A1 Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe Housing for an optical component assembly, method for producing a casing and method for manufacturing an assembly
03/06/2014DE102012215676A1 Method for depositing layer on semiconductor wafer, involves depositing semiconductor wafer on carrier and performing relative movement between semiconductor wafer and carrier for depositing specific layer
03/06/2014DE102012215656A1 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
03/06/2014DE102012215513A1 Greifvorrichtung Gripping device
03/06/2014DE102012215285A1 Gehäuse, elektronische Baugruppe, Verfahren zum Herstellen eines Gehäuses und Verfahren zum Herstellen einer elektronischen Baugruppe Housing, electronic module, method for manufacturing a casing and method for manufacturing an electronic module,
03/06/2014DE102012215233A1 Semiconductor device equipped in sensor module e.g. differential pressure sensor integrated in diesel particulate filter, has separate metallization portions which are formed on contact surface of doped contact region
03/06/2014DE102012215220A1 Mehoden zur Farbortsteuerung von elektro-optischen Bauteilen mit Konversionselementen Mehoden for color local control of electro-optical components with conversion elements
03/06/2014DE102012111503A1 Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
03/06/2014DE102012108250A1 Verfahren zur Abscheidung von Siliciumschichten A process for the deposition of silicon layers
03/06/2014DE102012017564A1 Vorrichtung zur nicht-permanenten elektrischen Kontaktierung von Solarzellen zur Messung elektrischer Eigenschaften A device for non-permanent electrical contacting of solar cells for measuring electrical properties
03/06/2014DE102012017216A1 Verfahren zum Lokalisieren und Beheben von wenigstens einer Fehlstelle A method for locating and correcting at least one defect
03/06/2014DE102011003439B4 Verfahren zur Durchlassstromerhöhung in Feldeffekttransistoren durch asymmetrische Konzentrationsprofile von Legierungssubstanzen einer Kanalhalbleiterlegierung und Halbleiterbauelement A method for forward current increase in field-effect transistors by asymmetric concentration profiles of alloy substances of a channel semiconductor alloy and semiconductor device
03/06/2014DE102006060734B4 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production
03/05/2014EP2704536A1 Method for producing a circuit board system
03/05/2014EP2704333A2 Wireless power transfer - near field communication enabled communication device
03/05/2014EP2704220A1 Method and apparatus for manufacturing optical device
03/05/2014EP2704214A2 Method for manufacturing solar cell
03/05/2014EP2704199A1 Semiconductor device and method of manufacturing thereof
03/05/2014EP2704188A2 Semiconductor device and method of fabricating the same
03/05/2014EP2704187A1 Method for producing electrical through hole interconnects and corresponding devices
03/05/2014EP2704186A1 Method for laying a wire conductor onto a substrate and for connecting it to a chip
03/05/2014EP2704185A1 Method for producing electronic component module and electronic component module
03/05/2014EP2704184A1 Semiconductor buffer structure, semiconductor device including the same, and manufacturing method thereof
03/05/2014EP2704183A2 Method for manufacturing silicon carbide semiconductor device
03/05/2014EP2704182A1 Substrate bonding device, substrate holding device, substrate bonding method, substrate holding method, multilayered semiconductor device, and overlapped substrate
03/05/2014EP2702610A2 Semiconductor apparatus with multiple tiers, and methods
03/05/2014EP2702609A1 Method and device for applying a printing substance
03/05/2014EP2702608A1 Substrate treatment installation
03/05/2014EP2702607A2 Cleaning lead-frames to improve wirebonding process
03/05/2014EP2702606A2 Substrate comprising si-base and inas-layer
03/05/2014EP2702399A1 Methods of inspecting and manufacturing semiconductor wafers
03/05/2014CN203466197U Semiconductor structure
03/05/2014CN203466173U Integrated-circuit bearing braiding disc
03/05/2014CN203466172U Wafer carrier gas filling device with flow control function
03/05/2014CN203466171U Installation tool for pressure control plate of etching-machine reaction chamber
03/05/2014CN203466170U Die bonding ejector pin cap for die bonder
03/05/2014CN203466169U Battery silicon wafer automatic dust removing device
03/05/2014CN203466168U Bearing platform for compatibility test of semiconductor wafer
03/05/2014CN103620789A 3D vertical NAND and method of making thereof by front and back side processing
03/05/2014CN103620788A Method of IGZO and ZNO TFT fabrication with PECVD SiO2 passivation
03/05/2014CN103620787A Integrated circuit comprising a mosfet having ballast resistors and corresponding manufacturing method
03/05/2014CN103620786A DMOS transistor with a slanted super junction drift structure
03/05/2014CN103620783A Solid-state imaging device
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