Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/12/2014CN103633098A Display device and method for manufacturing the same
03/12/2014CN103633094A Memory process and memory structure made thereby
03/12/2014CN103633093A Semiconductor devices including metal-silicon-nitride patterns and methods of forming the same
03/12/2014CN103633089A A polycrystalline silicon resistor and a manufacturing method thereof
03/12/2014CN103633088A Low forward voltage drop and fast recovery time power diode and manufacturing method
03/12/2014CN103633084A Electronic device including shallow trench isolation (sti) regions with bottom oxide linear and upper nitride liner and related methods
03/12/2014CN103633075A Package-on-package semiconductor device
03/12/2014CN103633072A Resistance structure, integrated circuit, and method of fabricating resistance structure
03/12/2014CN103633068A Flexible crss adjustment in a sgt mosfet to smooth waveforms and to avoid emi in dc-dc application
03/12/2014CN103633066A A double layer fuse and a manufacturing method thereof
03/12/2014CN103633065A Electric fuse and programming method of electric fuse
03/12/2014CN103633063A Semiconductor device, integrated circuit and manufacturing method thereof
03/12/2014CN103633059A Semiconductor package and method of manufacturing the same
03/12/2014CN103633058A Packaging assembly and manufacturing method thereof
03/12/2014CN103633056A Lead frame, packaging subassembly and manufacturing method for lead frame and packaging subassembly
03/12/2014CN103633053A Intelligent power module and manufacturing method thereof
03/12/2014CN103633052A Electronic assembly with three dimensional inkjet printed traces
03/12/2014CN103633051A Laminated chip wafer-level copper bump packaging structure
03/12/2014CN103633050A Chip, chip packaging structure and chip welding method
03/12/2014CN103633046A Semiconductor device and manufacturing method thereof
03/12/2014CN103633042A Semiconductor device package and methods of packaging thereof
03/12/2014CN103633041A Semiconductor device and method for fabricating the same
03/12/2014CN103633039A Semiconductor heat radiation structure and formation method thereof and semiconductor chip
03/12/2014CN103633038A Packaging structure and forming method thereof
03/12/2014CN103633037A Encapsulation structure and manufacturing method thereof
03/12/2014CN103633032A Method of forming semiconductor device, method of forming transistor
03/12/2014CN103633031A Forming method of semiconductor apparatus
03/12/2014CN103633030A Method for improving in-plane uniformity of reliability of SONOS flash device
03/12/2014CN103633029A Semiconductor structure and making method thereof
03/12/2014CN103633028A Semiconductor device and fabrication method therof
03/12/2014CN103633027A Method for forming double epitaxial layers of source-drain area
03/12/2014CN103633026A Semiconductor device structure and manufacturing method thereof
03/12/2014CN103633025A Method of forming a complementary metal-oxide semiconductor tube
03/12/2014CN103633024A Method for preparing h-BN medium graphene integrated circuits on large scale
03/12/2014CN103633023A Method of manufacturing a component comprising cutting a carrier
03/12/2014CN103633022A Semiconductor die singulation method
03/12/2014CN103633021A Method for manufacturing air gap copper interconnecting structure
03/12/2014CN103633020A Semiconductor device and method of forming rdl using uv-cured conductive ink over wafer level package
03/12/2014CN103633019A Multi-level vertical plug formation with stop layers of increasing thicknesses
03/12/2014CN103633018A Formation method of interconnection structure
03/12/2014CN103633017A Formation method for semiconductor structure
03/12/2014CN103633016A Semiconductor structure and manufacture method thereof
03/12/2014CN103633015A Manufacturing method for semiconductor device
03/12/2014CN103633014A Method of manufacturing semiconductor device
03/12/2014CN103633013A Method of forming through-silicon-via package structure
03/12/2014CN103633012A Method for improving silicon chip warping degree
03/12/2014CN103633011A Dishing-free gap-filling with multiple CMPs
03/12/2014CN103633010A Method for preparing ultrathin material on insulator by employing doped ultrathin layer absorption
03/12/2014CN103633009A Shallow trench isolation and manufacturing method thereof
03/12/2014CN103633008A Shallow trench isolation manufacturing method
03/12/2014CN103633007A Method for preventing electric leakage of shallow groove isolation edge silicon contact hole
03/12/2014CN103633006A Wafer chip jacking mechanism
03/12/2014CN103633005A Large-area special-shaped wafer glue coating uniformity control device
03/12/2014CN103633004A Method for photoetching and etching of membrane circuit patterns on ultra-thin quartz substrate
03/12/2014CN103633003A Static chuck
03/12/2014CN103633002A Physical design symmetry and integrated circuits enabling three dimentional (3d) yield optimization for wafer to wafer stacking
03/12/2014CN103633001A Method for calibrating silicon wafer position in CVD reaction cavity
03/12/2014CN103633000A Substrate processing device
03/12/2014CN103632999A Semiconductor component mounting apparatus
03/12/2014CN103632998A Plasma processing device
03/12/2014CN103632997A Lamination method and lamination system
03/12/2014CN103632996A Stitching device and die bonder
03/12/2014CN103632995A Film magazine monitoring system
03/12/2014CN103632994A Test positioning system of solar silicon cell sheet
03/12/2014CN103632993A A real time monitoring apparatus and a method
03/12/2014CN103632992A Method for detecting particles etched according to dry-etching method
03/12/2014CN103632991A Laminated chip wafer-level copper bump packaging method
03/12/2014CN103632990A Method for fusing a laser fuse and method for processing a wafer
03/12/2014CN103632989A Method for manufacturing an electronic module and an electronic module
03/12/2014CN103632988A Stacked encapsulation structure and manufacturing method thereof
03/12/2014CN103632987A Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
03/12/2014CN103632986A Device and method for assembling thyristor valve string
03/12/2014CN103632985A Method for manufacturing a metal pad structure of a die, a die arrangement and a chip arrangement
03/12/2014CN103632984A Integration method of leadless planar surface mounting type thick film hybrid integrated circuit
03/12/2014CN103632983A Ceramic support for pre-oxidating copper sheet
03/12/2014CN103632982A Wiring board and manufacturing method of wiring board
03/12/2014CN103632981A Wiring board and manufacturing method of wiring board
03/12/2014CN103632980A Method of fabricating a packaging substrate
03/12/2014CN103632979A Chip packaging substrate and structure, and manufacturing methods thereof
03/12/2014CN103632978A Formation method for semiconductor structure
03/12/2014CN103632977A Semiconductor structure and formation method
03/12/2014CN103632976A Formation method for transistor
03/12/2014CN103632975A Pmos transistor and manufacturing method thereof
03/12/2014CN103632974A Manufacturing method for improving in-plane uniformity of P type LDMOS surface channel device
03/12/2014CN103632973A Semiconductor device and manufacture method thereof
03/12/2014CN103632972A Semiconductor structure and manufacture method thereof
03/12/2014CN103632971A Manufacturing method of semiconductor device
03/12/2014CN103632970A Method for suppressing double-hump effect of NMOS device
03/12/2014CN103632969A Method of forming a transistor
03/12/2014CN103632968A Transistor and method of forming same
03/12/2014CN103632967A Method of forming a semiconductor structure
03/12/2014CN103632966A Method for forming MOS transistor
03/12/2014CN103632965A Method of preparing a groove grid-control power device
03/12/2014CN103632964A Method of preparing groove semiconductor power device
03/12/2014CN103632963A Method of preparing groove grid-control semiconductor power device
03/12/2014CN103632962A A manufacturing method for a DMOS pipe and an apparatus
03/12/2014CN103632961A Power MOSFET chip protection structure manufacturing method
03/12/2014CN103632960A RB-IGBT (reverse blocking-insulated gate bipolar transistor) preparation method
03/12/2014CN103632959A Grooved Schottky device structure and manufacturing method thereof
03/12/2014CN103632958A Method of forming group III nitride semiconductor, method of fabricating semiconductor device, group III nitride semiconductor device, method of performing thermal treatment
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