Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/13/2014WO2014038105A1 Epitaxial wafer and method for producing same
03/13/2014WO2014038015A1 Spin wave switch and fpga using same
03/13/2014WO2014037996A1 Semiconductor device and semiconductor device manufacturing method
03/13/2014WO2014037995A1 Semiconductor device and production method therefor
03/13/2014WO2014037793A1 Pseudo substrate with improved efficiency of usage of single crystal material
03/13/2014WO2014037792A2 Method for separating at least two substrates along a selected interface
03/13/2014WO2014037791A1 Device for separating two substrates
03/13/2014WO2014037784A1 Method for manufacturing a structure with a view to subsequent separation
03/13/2014WO2014037769A1 Method of detaching a layer
03/13/2014WO2014037628A1 Method of producing a junction field-effect transistor (jfet)
03/13/2014WO2014037446A1 A group iii-v substrate material with particular crystallographic features and methods of making
03/13/2014WO2014037410A1 Process for etching a crystalline semiconductor by ion implantation then hydrogen-chloride-based chemical etching
03/13/2014WO2014037380A1 Method and apparatus for the fabrication of nanostructures, network of interconnected nanostructures and nanostructure
03/13/2014WO2014037058A1 Substrate transfer device and method of moving substrates
03/13/2014WO2014037057A1 Substrate processing system and method of processing substrates
03/13/2014WO2014036884A1 Method for fabricating multi-groove structure
03/13/2014WO2014036872A1 Bipolar junction transistor and manufacturing method thereof
03/13/2014WO2014036855A1 Method for preparing finfet on germanium and iii-v semiconductor material substrate
03/13/2014WO2014036778A1 Organic light-emitting diode display panel and method of manufacturing same
03/13/2014WO2014036770A1 Micromechanical chip test probe card and method of fabricating same
03/13/2014WO2014036747A1 Oven and adjustable baking system
03/13/2014WO2014036677A1 Semiconductor device and manufacturing method therefor
03/13/2014WO2014036676A1 Multiple time programmable semiconductor device and manufacturing method thereof
03/13/2014WO2012109519A3 Magnetic element with improved out-of-plane anisotropy for spintronic applications
03/13/2014US20140073226 Polypyrrolidone polishing composition and method
03/13/2014US20140073224 Method for processing edge surface and edge surface processing apparatus
03/13/2014US20140073223 Method and apparatus for wafer backgrinding and edge trimming on one machine
03/13/2014US20140073146 Reaction Tube, Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
03/13/2014US20140073145 Pulse train annealing method and apparatus
03/13/2014US20140073144 Low cost flowable dielectric films
03/13/2014US20140073143 Process Gas Management for an Inductively-Coupled Plasma Deposition Reactor
03/13/2014US20140073142 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
03/13/2014US20140073141 Method for forming pattern and method for manufacturing semiconductor device
03/13/2014US20140073140 Etching Composition
03/13/2014US20140073139 Etching gas and etching method
03/13/2014US20140073138 Method for plasma etching and plasma etching apparatus thereof
03/13/2014US20140073137 Methods for single exposure - self-aligned double, triple, and quadruple patterning
03/13/2014US20140073136 Semiconductor device manufacturing method
03/13/2014US20140073135 Method for depositing tungsten film with low roughness and low resistivity
03/13/2014US20140073134 3-d integration using multi stage vias
03/13/2014US20140073133 Method to mitigate through-silicon via-induced substrate noise
03/13/2014US20140073132 Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
03/13/2014US20140073131 Method to improve semiconductor surfaces and polishing
03/13/2014US20140073130 Forming nickel-platinum alloy self-aligned silicide contacts
03/13/2014US20140073129 Semiconductor device including bottom surface wiring and manufacturing method of the semiconductor device
03/13/2014US20140073128 Manufacturing method for metal line
03/13/2014US20140073127 Semiconductor device and information processing system including the same
03/13/2014US20140073126 Method of manufacturing non-volatile memory
03/13/2014US20140073124 Edge devices layout for improved performance
03/13/2014US20140073123 Method for Producing a Controllable Semiconductor Component
03/13/2014US20140073122 Method for forming ultra-shallow boron doping regions by solid phase diffusion
03/13/2014US20140073121 Semiconductor device and method for manufacturing semiconductor device
03/13/2014US20140073119 Defect free strained silicon on insulator (ssoi) substrates
03/13/2014US20140073118 Nitride semiconductor
03/13/2014US20140073117 Growth reactor systems and methods for low-temperature synthesis of nanowires
03/13/2014US20140073116 Method for manufacturing silicon carbide semiconductor device
03/13/2014US20140073115 Method of manufacturing large area gallium nitride substrate
03/13/2014US20140073114 In-situ active wafer charge screening by conformal grounding
03/13/2014US20140073113 Plasma etching method and plasma etching apparatus
03/13/2014US20140073112 Method for permanently bonding wafers
03/13/2014US20140073111 Method of Forming Isolation Structure
03/13/2014US20140073110 Method for fabricating a trench structure, and a semiconductor arrangement comprising a trench structure
03/13/2014US20140073109 Fabricating method of shallow trench isolation structure
03/13/2014US20140073106 Lateral bipolar transistor and cmos hybrid technology
03/13/2014US20140073104 Manufacturing method of semiconductor device
03/13/2014US20140073098 Method for forming a schottky barrier diode integrated with a trench mosfet
03/13/2014US20140073097 Method of dual epi process for semicondcutor device
03/13/2014US20140073096 Method of dual epi process for semiconductor device
03/13/2014US20140073093 Self-aligned carbon nanostructure field effect transistors using selective dielectric deposition
03/13/2014US20140073091 Packages with Passive Devices and Methods of Forming the Same
03/13/2014US20140073090 Semiconductor device having low dielectric insulating film and manufacturing method of the same
03/13/2014US20140073087 Method of fabricating a semiconductor package
03/13/2014US20140073086 Method for manufacturing semiconductor device
03/13/2014US20140073085 Method for manufacturing semiconductor device
03/13/2014US20140073070 Manufacturing method of semiconductor device, supporting substrate, and semiconductor manufacturing apparatus
03/13/2014US20140073069 Etching method, etching apparatus and chemical solution
03/13/2014US20140073068 Method of manufacturing semiconductor device
03/13/2014US20140073067 Wafer processing method
03/13/2014US20140073066 Plasma etching apparatus and control method
03/13/2014US20140073065 Microwave annealing apparatus and method of manufacturing a semiconductor device
03/13/2014US20140073039 Direct sensing biofets and methods of manufacture
03/13/2014US20140072796 Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
03/13/2014US20140072759 Systems and methods for protection of cosmetic surfaces and overflow prevention on electronic devices
03/13/2014US20140072632 Methods for fabricating isolated micro- or nano-structures using soft or imprint lithography
03/13/2014US20140072397 Method and system related to semiconductor processing equipment
03/13/2014US20140071581 Portable electrostatic chuck carrier for thin substrates
03/13/2014US20140071366 Tft-lcd array substrate
03/13/2014US20140071364 Tft array substrate and method for manufacturing the same and display device
03/13/2014US20140071021 Hybrid on-chip and package antenna
03/13/2014US20140070999 Radiation efficient integrated antenna
03/13/2014US20140070428 Semiconductor device and method for manufacturing the same
03/13/2014US20140070426 Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure
03/13/2014US20140070425 Semiconductor device and manufacturing method thereof
03/13/2014US20140070424 Semiconductor package, method of fabricating the semiconductor package, and interposer structure of the semiconductor package
03/13/2014US20140070423 Tunable composite interposer
03/13/2014US20140070422 Semiconductor Device with Discrete Blocks
03/13/2014US20140070420 Chip To Package Interface
03/13/2014US20140070419 Platinum-Containing Constructions, and Methods of Forming Platinum-Containing Constructions
03/13/2014US20140070416 Guard ring structure and method for forming the same
03/13/2014US20140070415 Microelectronic packages having trench vias and methods for the manufacture thereof
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