Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/01/2007WO2007013189A1 Silicon wafer and process for producing the same
02/01/2007WO2007013170A1 Semiconductor device fabrication inspection device having self-diagnosis function
02/01/2007WO2007013162A1 Photomask, method for manufacturing such photomask and method for manufacturing electronic device
02/01/2007WO2007013155A1 Semiconductor device and method for manufacturing same
02/01/2007WO2007013145A1 Semiconductor integrated circuit
02/01/2007WO2007013140A1 Aligning method
02/01/2007WO2007013133A1 Semiconductor device and method for manufacturing same
02/01/2007WO2007013009A2 Thin film circuits having transistors comprising a light shield
02/01/2007WO2007012992A1 A package and manufacturing method for a microelectronic component
02/01/2007WO2007012991A1 Interconnection and packaging method for biomedical devices with electronic and fluid functions
02/01/2007WO2007012910A1 Method for reliably positioning solder on a die pad for attaching a semiconductor chip to the die pad and molding die for solder dispensing apparatus
02/01/2007WO2007012558A1 Arrangement of an electrical component and a film composite laminated on the component and method for production of the arrangement
02/01/2007WO2007012290A1 Method for manufacturing silicon on insulator
02/01/2007WO2007012187A1 System and method for assembling packaged integrated circuits using insulated wire bond
02/01/2007WO2006132903A3 Non-volatile memory cells without diffusion junctions
02/01/2007WO2006132698A3 System for inspecting wafers in a laser marking system with an illumination system illuminating a surface of the wafer at angle between 45° and 70° with respect to this surface
02/01/2007WO2006132697A3 System and method for aligning a wafer processing system in a laser marking system
02/01/2007WO2006127269A3 Semiconductor device including a superlattice having at least one group of substantially undoped layer
02/01/2007WO2006122957A3 Mos power device with high integration density and manufacturing process thereof
02/01/2007WO2006108827A3 Production of vdmos-transistors having optimised gate contact
02/01/2007WO2006104655A3 Etch with photoresist mask
02/01/2007WO2006083858A3 Plasma gate oxidation process using pulsed rf source power
02/01/2007WO2006081519A3 Methods and apparatus for operation of substrate carrier handlers
02/01/2007WO2006078074A3 Polishing composition and polishing method
02/01/2007WO2006058332A3 Reduced channel pitch in semiconductor device
02/01/2007WO2006054024A3 Semiconductor wafer thinning
02/01/2007WO2006049780A3 Magnetoresistive random access memory device structures and methods for fabricating the same
02/01/2007WO2006044791A3 Thermal management of dielectric components in a plasma discharge device
02/01/2007WO2006036821A3 Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
02/01/2007WO2006023873A3 Elevator-based tool loading and buffering system
02/01/2007WO2006010055A3 Drain extended mos transistors and methods for making the same
02/01/2007WO2005098910A3 The surface of treatment of nanoparticles to control interfacial properties and method of manufacture
02/01/2007WO2005089510A3 Method of forming one or more base structures on an ltcc cofired module
02/01/2007WO2005081750A3 Group iii-nitride based led having a transparent current spreading layer
02/01/2007WO2005065326A3 Optically controlled electrical switching device based on wide bandgap semiconductors
02/01/2007WO2005057247A3 Metallic nano-optic lenses and beam shaping devices
02/01/2007WO2004109764A3 Method of fabricating vertical structure compound semiconductor devices
02/01/2007WO2004036621A3 Method for improved alignment tolerance in a bipolar transistor and related structure
02/01/2007US20070028205 Data processing method in semiconductor device, program of the same, and manufacturing method of semiconductor device
02/01/2007US20070027575 Substrate transfer system
02/01/2007US20070027569 Semiconductor production system
02/01/2007US20070027287 Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same
02/01/2007US20070027231 Photosensitive insulating resin composition and cured product thereof
02/01/2007US20070027052 Cleaning liquid used in photolithography and a method for treating substrate therewith
02/01/2007US20070026834 High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
02/01/2007US20070026710 Electrical connection component
02/01/2007US20070026693 Method of Thermally Oxidizing Silicon Using Ozone
02/01/2007US20070026692 Method for applying a high temperature heat treatment to a semiconductor wafer
02/01/2007US20070026691 Low-field non-contact charging apparatus for testing substrates
02/01/2007US20070026690 Selective frequency UV heating of films
02/01/2007US20070026689 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same
02/01/2007US20070026688 Method of forming a ZrO2 thin film using plasma enhanced atomic layer deposition and method of fabricating a capacitor of a semiconductor memory device having the thin film
02/01/2007US20070026687 Oxygen-rich gas supplying apparatus provided with a condensate removal unit
02/01/2007US20070026686 Self-repair and enhancement of nanostructures by liquification under guiding conditions
02/01/2007US20070026685 Mask structure, method of forming the mask structure, method of forming a pattern using the mask structure and method of forming contacts in a semiconductor device using the mask structure
02/01/2007US20070026684 Method of producing pitch fractionizations in semiconductor technology
02/01/2007US20070026683 Method for reducing amine based contaminants
02/01/2007US20070026682 Method for advanced time-multiplexed etching
02/01/2007US20070026681 Dry etching process and method for manufacturing magnetic memory device
02/01/2007US20070026680 Method for manufacturing semiconductor device
02/01/2007US20070026679 Method and structure for aluminum chemical mechanical polishing and protective layer
02/01/2007US20070026678 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
02/01/2007US20070026677 Method for plasma etching performance enhancement
02/01/2007US20070026676 Via hole machining for microwave monolithic integrated circuits
02/01/2007US20070026675 System and method for improving mesa width in a semiconductor device
02/01/2007US20070026674 Method of protecting wafer front pattern and method of performing double-sided process
02/01/2007US20070026673 Semiconductor device having a multilayer interconnection structure and fabrication process thereof
02/01/2007US20070026672 Pitch doubled circuit layout
02/01/2007US20070026671 Method of forming low resistance tungsten films
02/01/2007US20070026670 Method of reducing contamination by removing an interlayer dielectric from the substrate edge
02/01/2007US20070026669 Semiconductor device and method of fabricating the same
02/01/2007US20070026668 Low k dielectric surface damage control
02/01/2007US20070026667 Composition for forming etching stopper layer
02/01/2007US20070026666 Method of forming metal line on semiconductor device
02/01/2007US20070026665 Method of fabricating a dual damascene interconnect structure
02/01/2007US20070026664 Semiconductor device and a method of manufacturing the same
02/01/2007US20070026663 A semiconductor device and method for manufacturing the semiconductor device
02/01/2007US20070026662 Semiconductor device and method of manufacturing the same
02/01/2007US20070026661 Method of manufacturing a semiconductor device
02/01/2007US20070026660 Method for manufacturing semiconductor device
02/01/2007US20070026659 Post last wiring level inductor using patterned plate process
02/01/2007US20070026658 Process of forming an as-grown active p-type III-V nitride compound
02/01/2007US20070026657 Methods of forming semiconductor devices with contact holes self-aligned in two directions and devices so formed
02/01/2007US20070026656 Method and structure for landing polysilicon contact
02/01/2007US20070026655 Method of manufacturing a semiconductor device
02/01/2007US20070026654 Systems and methods for avoiding base address collisions
02/01/2007US20070026653 Cap layer on doped dielectric
02/01/2007US20070026652 SOI device with reduced drain induced barrier lowering
02/01/2007US20070026651 Method of manufacturing a semiconductor device
02/01/2007US20070026650 Method of limiting vacancy diffusion in a heterostructure
02/01/2007US20070026649 Plasma Doping Method and Plasma Doping Apparatus
02/01/2007US20070026648 Sequential lateral solidification mask
02/01/2007US20070026647 Method for forming polycrystalline silicon thin film
02/01/2007US20070026646 Method for arraying nano material and method for fabricating liquid crystal display device using the same
02/01/2007US20070026645 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
02/01/2007US20070026644 Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
02/01/2007US20070026643 Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
02/01/2007US20070026642 Surface modification method and surface modification apparatus for interlayer insulating film
02/01/2007US20070026641 Film separation method and film separation apparatus
02/01/2007US20070026640 Method for adhering protecting tape of wafer and adhering apparatus