Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/08/2007WO2007015951A2 Semiconductor structures formed on substrates and methods of manufacturing the same
02/08/2007WO2007015938A2 Method for patterning an underbump metallizattion layer using a dry etc process
02/08/2007WO2007015930A1 Methods for fabricating a stressed mos device
02/08/2007WO2007015903A2 High voltage non punch through igbt for switch mode power supplies
02/08/2007WO2007015683A1 An integrated circuit package and a method for forming an integrated circuit package
02/08/2007WO2007015628A1 Method for patterning coatings
02/08/2007WO2007015507A1 Electronic circuit device and method for manufacturing same
02/08/2007WO2007015506A1 Minute structure inspection device, inspection method, and inspection program
02/08/2007WO2007015504A1 Plasma processing apparatus and gas permeable plate
02/08/2007WO2007015500A1 Trench type misfet
02/08/2007WO2007015474A1 Magnetic memory
02/08/2007WO2007015442A1 Semiconductor integrated circuit
02/08/2007WO2007015436A1 Metal-containing compound, process for producing the same, metal-containing thin film, and method of forming the same
02/08/2007WO2007015435A1 Semiconductor device
02/08/2007WO2007015433A1 Method for forming insulating film and insulating film
02/08/2007WO2007015431A1 Diamond uv-ray sensor
02/08/2007WO2007015404A1 PROCESS FOR PRODUCING AlN SEMICONDUCTOR AND APPARATUS FOR PRODUCING AlN SEMICONDUCTOR
02/08/2007WO2007015388A1 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
02/08/2007WO2007015385A1 Atmospheric pressure plasma processing system
02/08/2007WO2007015372A1 Anisotropic conductive film and method for producing same
02/08/2007WO2007015367A1 Process for producing junction structure
02/08/2007WO2007015364A1 Method for manufacturing thin film transistor
02/08/2007WO2007015358A1 Magnetic random access memory and operation method thereof
02/08/2007WO2007015355A1 Mram
02/08/2007WO2007015352A1 Resist composition and method of forming resist pattern
02/08/2007WO2007015350A1 Method for manufacturing thin film transistor
02/08/2007WO2007015314A1 Electric connection device
02/08/2007WO2007015306A1 Charged particle beam plotting device and method
02/08/2007WO2007015250A2 Method for production of nanoporous electrodes for photoelectrochemical applications
02/08/2007WO2007015050A1 A method of processing substrates
02/08/2007WO2007014880A1 Method for transferring and device for handling electronic components
02/08/2007WO2007014662A1 Optical system for creating a line focus scanning system using such optical system and method for laser processing of a substrate
02/08/2007WO2007014549A1 Process for producing a multilayer ceramic composite
02/08/2007WO2007014493A1 Aging room used for the last assembling process of lcd panel modules
02/08/2007WO2007014451A1 Method and system for vertically aligning tile images of an area of interest of an integrated circuit
02/08/2007WO2006138126A3 Antistiction mems substrate and method of manufacture
02/08/2007WO2006124201A3 Selective wet etching of oxides
02/08/2007WO2006121600B1 Process and composition for conductive material removal by electrochemical mechanical polishing
02/08/2007WO2006077216A3 Formation and treatment of a sige structure
02/08/2007WO2006075725A3 Manufacturing method for semiconductor chips and semiconductor wafer
02/08/2007WO2006071671A3 System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process
02/08/2007WO2006062952A3 Multiple angle of incidence spectroscopic scatterometer system
02/08/2007WO2006052472A3 Microelectromechanical (mem) device including a spring release bridge and method of making the same
02/08/2007US20070032676 Process for depositing low dielectric constant materials
02/08/2007US20070032675 Forming a dielectric layer using a hydrocarbon-containing precursor
02/08/2007US20070032182 Polishing pad and method of fabricating semiconductor substrate using the pad
02/08/2007US20070032175 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
02/08/2007US20070032174 Polishing apparatus
02/08/2007US20070032170 Polishing pad with built-in optical sensor
02/08/2007US20070032097 Method and apparatus for processing semiconductor work pieces
02/08/2007US20070032096 System and process for providing multiple beam sequential lateral solidification
02/08/2007US20070032095 Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer
02/08/2007US20070032094 Energy beam treatment to improve packaging reliability
02/08/2007US20070032093 Structure and method of forming a semiconductor material wafer
02/08/2007US20070032092 Method for manufacturing semiconductor device having trench
02/08/2007US20070032091 Methods and devices for forming nanostructure monolayers and devices including such monolayers
02/08/2007US20070032090 Plasma rapid thermal process apparatus in which supply part of radical source is improved
02/08/2007US20070032089 Printable Semiconductor Structures and Related Methods of Making and Assembling
02/08/2007US20070032088 Device and method for detecting foreign material on the surface of plasma processing apparatus
02/08/2007US20070032087 Damage-free ashing process and system for post low-k etch
02/08/2007US20070032086 Mehtod of manufacturing an electronic device
02/08/2007US20070032085 Method for forming recesses
02/08/2007US20070032084 Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
02/08/2007US20070032083 Planarization method for manufacturing semiconductor device
02/08/2007US20070032082 Semiconductor substrate process using an optically writable carbon-containing mask
02/08/2007US20070032081 Edge ring assembly with dielectric spacer ring
02/08/2007US20070032080 System and method for manufacturing flexible copper clad laminate film
02/08/2007US20070032079 Method for thin film deposition using multi-tray film precursor evaporation system
02/08/2007US20070032078 Suspension for filling via holes in silicon and method for making the same
02/08/2007US20070032077 Method of manufacturing metal plug and contact
02/08/2007US20070032076 Nanowire device and method of fabricating the same
02/08/2007US20070032075 Deposition method for wiring thin film
02/08/2007US20070032074 Method of fabricating semiconductor device
02/08/2007US20070032073 Method of substrate processing and apparatus for substrate processing
02/08/2007US20070032072 Nucleation layer deposition on semiconductor process equipment parts
02/08/2007US20070032071 Methods of forming CoSi2, methods of forming field effect transistors, and methods of forming conductive contacts
02/08/2007US20070032070 Semiconductor device and method for manufacturing same
02/08/2007US20070032069 Selective metal deposition over dielectric layers
02/08/2007US20070032068 Semiconductor device and method for fabricating the same
02/08/2007US20070032067 Semiconductor device and method of manufacturing the same
02/08/2007US20070032066 Semiconductor device and method of fabricating the same
02/08/2007US20070032065 Alpha-particle-tolerant semiconductor die systems, devices, components and methods for optimizing clock rates and minimizing die size
02/08/2007US20070032064 Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
02/08/2007US20070032063 Efficient transistor structure
02/08/2007US20070032062 Methods of Forming Dual-Damascene Metal Wiring Patterns for Integrated Circuit Devices and Wiring Patterns Formed Thereby
02/08/2007US20070032061 Methods of forming through-wafer interconnects and structures resulting therefrom
02/08/2007US20070032060 Method for forming conductive wiring and interconnects
02/08/2007US20070032059 Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure
02/08/2007US20070032058 Method of fabricating interconnect
02/08/2007US20070032057 Semiconductor device and method of fabricating the same
02/08/2007US20070032056 Manufacturing method of semiconductor device
02/08/2007US20070032055 Dry etchback of interconnect contacts
02/08/2007US20070032054 Semiconductor substrate process using a low temperature deposited carbon-containing hard mask
02/08/2007US20070032053 Method of producing silicon carbide semiconductor substrate, silicon carbide semiconductor substrate obtained thereby and silicon carbide semiconductor using the same
02/08/2007US20070032052 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
02/08/2007US20070032051 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
02/08/2007US20070032050 Mask for sequential lateral solidification and method of manufacturing the same
02/08/2007US20070032049 Process for manufacturing a semiconductor device
02/08/2007US20070032048 Method for depositing thin film by controlling effective distance between showerhead and susceptor
02/08/2007US20070032047 Thin dielectrical films containing silicon on a wafer target substrate by chemical vapor deposition; selectively supplying a purge gas, a first process gas of a silane, and a second process gas selected from a nitriding gas, an oxynitriding gas, and an oxidizing gas alternately