| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/10/2007 | US20070104892 Method for fixing metal particles and method for manufacturing substrate containing metal particles, method for manufacturing substrate containing carbon nanotube, and method for manufacturing substrate containing semiconductor-crystalline rod, employing thereof |
| 05/10/2007 | US20070104888 Method for the organised growth of nanostructures |
| 05/10/2007 | US20070104878 Precursor compositions for the deposition of passive electronic features |
| 05/10/2007 | US20070104877 Precursor compositions for the deposition of passive electronic features |
| 05/10/2007 | US20070104872 Method of sealing semiconductor element mounted on gold-plated printed circuit board |
| 05/10/2007 | US20070104605 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 05/10/2007 | US20070104559 End-effectors for handling microelectronic workpieces |
| 05/10/2007 | US20070104470 Backside rapid thermal processing of patterned wafers |
| 05/10/2007 | US20070104240 Methods for producing a semiconductor entity |
| 05/10/2007 | US20070103991 Integrated code and data flash memory |
| 05/10/2007 | US20070103983 Nonvolatile Semiconductor Memory |
| 05/10/2007 | US20070103970 Non-volatile ferromagnegtic memory having sensor circuitry shared with its state change circuitry |
| 05/10/2007 | US20070103958 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield |
| 05/10/2007 | US20070103893 Defect inspection device and substrate manufacturing system using the same |
| 05/10/2007 | US20070103191 Semiconductor-integrated circuit utilizing magnetoresistive effect elements |
| 05/10/2007 | US20070103190 Semiconductor device with bus terminating function |
| 05/10/2007 | US20070103184 TDDB test pattern and method for testing TDDB of MOS capacitor dielectric |
| 05/10/2007 | US20070103180 Universal wafer carrier for wafer level die burn-in |
| 05/10/2007 | US20070103150 Eddy current sensor |
| 05/10/2007 | US20070102834 Strain-compensated metastable compound base heterojunction bipolar transistor |
| 05/10/2007 | US20070102831 Device and method of manufacturing the same |
| 05/10/2007 | US20070102827 Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding |
| 05/10/2007 | US20070102826 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same |
| 05/10/2007 | US20070102823 Semiconductor device, electronic device and electronic apparatus |
| 05/10/2007 | US20070102819 Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement |
| 05/10/2007 | US20070102818 Wiring, TFT substrate using the same, manufacturing method of TFT substrate, and LCD. |
| 05/10/2007 | US20070102817 Method and apparatus for reducing electrical interconnection fatigue |
| 05/10/2007 | US20070102815 Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer |
| 05/10/2007 | US20070102809 Methods of fabricating a composite carbon nanotube thermal interface device |
| 05/10/2007 | US20070102802 Single chip and stack-type chip semiconductor package and method of manufacturing the same |
| 05/10/2007 | US20070102797 Electrode package for semiconductor device |
| 05/10/2007 | US20070102790 Process for deposition of semiconductor films |
| 05/10/2007 | US20070102783 Insultating structures |
| 05/10/2007 | US20070102776 Replacement metal gate transistors with reduced gate oxide leakage |
| 05/10/2007 | US20070102775 Methods of fabricating semiconductor devices and structures thereof |
| 05/10/2007 | US20070102774 Gate structure and method of fabricating the same |
| 05/10/2007 | US20070102772 Self-aligned nanometer-level transistor defined without lithography |
| 05/10/2007 | US20070102770 Thin film transistor array panel and manufacturing method thereof |
| 05/10/2007 | US20070102768 Semiconductor device and a method of manufacturing the same |
| 05/10/2007 | US20070102767 Method of forming dual gate dielectric layer |
| 05/10/2007 | US20070102766 Semiconductor transistors with contact holes close to gates |
| 05/10/2007 | US20070102759 Method for forming an integrated circuit with high voltage and low voltage devices |
| 05/10/2007 | US20070102757 Semiconductor device and a method of manufacturing the same |
| 05/10/2007 | US20070102753 Cross diffusion barrier layer in gate structure |
| 05/10/2007 | US20070102752 Flash memory device and method of fabricating the same |
| 05/10/2007 | US20070102748 Gate electrode and MOS transistor including gate and method of fabricating the same |
| 05/10/2007 | US20070102744 Semiconductor device and method of manufacturing the same |
| 05/10/2007 | US20070102736 Image sensor device and method for manufacturing the same |
| 05/10/2007 | US20070102735 Semiconductor device and method for manufacturing the semiconductor device |
| 05/10/2007 | US20070102730 Switching circuit and semicondcutor device |
| 05/10/2007 | US20070102729 Method and system for providing a heterojunction bipolar transistor having SiGe extensions |
| 05/10/2007 | US20070102728 Method and system for controlled oxygen incorporation in compound semiconductor films for device performance enhancement |
| 05/10/2007 | US20070102725 Insulated gate planar integrated power device with co-integrated Schottky diode and process |
| 05/10/2007 | US20070102713 Semiconductor device and manufacturing method thereof |
| 05/10/2007 | US20070102709 P-type group ii-vi semiconductor compounds |
| 05/10/2007 | US20070102708 Semiconductor device provided by silicon carbide substrate and method for manufacturing the same |
| 05/10/2007 | US20070102707 Array substrate for liquid crystal display device and method of fabricating the same |
| 05/10/2007 | US20070102705 Thin film transistors and semiconductor constructions |
| 05/10/2007 | US20070102704 Semiconductor Device and Manufacturing Method |
| 05/10/2007 | US20070102703 Semiconductor device and method of manufacturing the same |
| 05/10/2007 | US20070102702 Semiconductor device including active matrix circuit |
| 05/10/2007 | US20070102700 Electrical Open/Short Contact Alignment Structure for Active Region vs. Gate Region |
| 05/10/2007 | US20070102699 Organic thin film transistor, flat panel display apparatus having the same, and a method of manufacturing organic thin film transistor |
| 05/10/2007 | US20070102691 Silver-selenide/chalcogenide glass stack for resistance variable memory |
| 05/10/2007 | US20070102664 polish the polycrystalline silicon surface with a slurry comprising a non-ionic perfluoroalkyl sulfonyl surfactant; planarization of integrated circuit in semiconductor manufacturing processes; prevent the problem of dishing and improve the within-wafer-non-uniformity |
| 05/10/2007 | US20070102491 Flip chip dip coating encapsulant |
| 05/10/2007 | US20070102482 Assembly of a component mounted on a transfer surface |
| 05/10/2007 | US20070102399 Method and apparatus for manufacturing a semiconductor device, control program and computer-readable storage medium |
| 05/10/2007 | US20070102397 Method for printing contacts on a substrate |
| 05/10/2007 | US20070102396 Method of making a circuitized substrate |
| 05/10/2007 | US20070102287 Method and apparatus for an improved optical window deposition shield in a plasma processing system |
| 05/10/2007 | US20070102119 Plasma processing system and plasma processing method |
| 05/10/2007 | US20070102117 Substrate processing system and substrate processing method |
| 05/10/2007 | US20070102116 Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles |
| 05/10/2007 | US20070102105 Film-shaped adhesive application apparatus |
| 05/10/2007 | US20070101940 Vaporizer and semiconductor processing apparatus |
| 05/10/2007 | US20070101930 Feature forming methods to reduce stacking fault nucleation sites |
| 05/10/2007 | US20070101929 Methods for atomic-layer deposition |
| 05/10/2007 | US20070101928 Method of forming a layer of silicon carbide on a silicon wafer |
| 05/10/2007 | US20070101925 Silicon wafer and method for manufacturing the same |
| 05/10/2007 | US20070101924 Indium phosphide substrate and indium phosphide monocrystal and method of manufacturing thereof |
| 05/10/2007 | US20070101572 Component mounting apparatus and component mounting method |
| 05/10/2007 | US20070101565 Jig for producing capacitor, production method for capacitor and capacitor |
| 05/10/2007 | DE19848861B4 Herstellungsprozeß einer Halbleitervorrichtung durch Elektronenstrahllithographie Manufacturing process of a semiconductor device by electron beam lithography |
| 05/10/2007 | DE112005001787T5 Nutzen unterschiedlicher Gate-Dielektrika bei NMOS- und PMOS-Transistoren eines integrierten komplementären Metalloxidhalbleiter-Schaltkreises Use of different gate dielectrics for NMOS and PMOS transistors of an integrated complementary metal oxide semiconductor circuit |
| 05/10/2007 | DE10333841B4 Verfahren zur Herstellung eines Nutzens mit in Zeilen und Spalten angeordneten Halbleiterbauteilpositionen und Verfahren zur Herstellung eines Halbleiterbauteils A process for preparing a panel with arranged in rows and columns semiconductor device positions and processes for the manufacture of a semiconductor device |
| 05/10/2007 | DE10326317B4 Testsystem zum Testen von integrierten Bausteinen Test system for testing integrated ICs |
| 05/10/2007 | DE10229499B4 Verfahren zum Bearbeiten eines Wafers A method for processing a wafer |
| 05/10/2007 | DE10205559B4 Integrierte Schaltung und Verfahren und Vorrichtung zum Entwurf einer integrierten Schaltung Integrated circuit and method and apparatus for designing an integrated circuit |
| 05/10/2007 | DE102006045208A1 Verfahren zum Trennen von Paketen von WLP A method for separating packs of WLP |
| 05/10/2007 | DE102005052054A1 Technik zur Bereitstellung mehrerer Quellen für mechanische Spannungen in NMOS- und PMOS-Transistoren Technique for providing multiple sources of mechanical stresses in the NMOS and PMOS transistors |
| 05/10/2007 | DE102005051994A1 Verformungsverfahrenstechnik in Transistoren auf Siliziumbasis unter Anwendung eingebetteter Halbleiterschichten mit Atomen mit einem großen kovalenten Radius Deformation processing technology in silicon-based transistors by using semiconductor layers with embedded atoms with a large covalent radius |
| 05/10/2007 | DE102005051972A1 Forming very small semiconductor structures comprises first forming structure on prepared substrate by electron beam lithography, and subsequently forming second structure by optical lithography |
| 05/10/2007 | DE102004057775B4 Handhabungsvorrichtung zum Zuführen von elektronischen Bauelementen, insbesondere IC's, zu einer Testvorrichtung Handling device for feeding electronic components, in particular ICs, to a test device |
| 05/10/2007 | DE10144705B4 Vorrichtung zum Einstellen der Temperatur von Halbleiterbausteinen auf Testsystemen A device for adjusting the temperature of semiconductor devices on test systems |
| 05/10/2007 | DE10003282B4 Kontaktstruktur Contact structure |
| 05/10/2007 | CA2626706A1 Integrated circuit using complementary junction field effect transistor and mos transistor in silicon and silicon alloys |
| 05/09/2007 | EP1784065A1 Electrode substrate |
| 05/09/2007 | EP1784007A2 Cycling LED heat spreader |
| 05/09/2007 | EP1783835A2 Flat panel display apparatus |