Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/10/2007WO2007051716A1 Semiconductor transistors with contact holes close to gates
05/10/2007WO2007051356A1 A method of processing silicon wafer used for solar cell
05/10/2007WO2007051336A1 Method for bonding electronic components
05/10/2007WO2007051313A1 Methods for performing circuit edit operations with low landing energy electron beams
05/10/2007WO2007035097A3 Device and method for separating electronic components
05/10/2007WO2007030258A3 Post deposition plasma treatment to increase tensile stress of a hdp-cvd si 02 layer
05/10/2007WO2007024614A3 Selection of wavelenghts for end point in a time division multiplexed process
05/10/2007WO2007020008A3 Motion device having a double-sided suction bar
05/10/2007WO2007019467A3 Semiconductor substrate process using a low temperature-deposited carbon-containing hard mask
05/10/2007WO2007016453A3 Systems and methods for capture substrates
05/10/2007WO2007001713A3 Ultra dense non-volatile memory array
05/10/2007WO2006127093A3 Methods of fabricating silicon carbide devices having a smooth surface of the channel regions
05/10/2007WO2006118994A3 Multi-chip module and method of manufacture
05/10/2007WO2006099171A3 NOVEL GeSiSn-BASED COMPOUNDS, TEMPLATES, AND SEMICONDUCTOR STRUCTURES
05/10/2007WO2006071535A3 Silicon electrode assembly surface decontamination by acidic solution
05/10/2007WO2006063353A3 Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step
05/10/2007WO2006033746A3 Method of forming a semiconductor device having a metal layer
05/10/2007WO2006028983A3 Megasonic processing system with gasified fluid
05/10/2007WO2005122236A3 Semiconductor device with reduced contact resistance
05/10/2007WO2005098910A8 The surface of treatment of nanoparticles to control interfacial properties and method of manufacture
05/10/2007WO2005057631A3 Planar substrate with selected semiconductor crystal orientations formed by localized amorphzation and recrystallization of stacked template layers
05/10/2007US20070106419 Method and system for video monitoring
05/10/2007US20070106220 Blood drawing device with flash detection
05/10/2007US20070106021 Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
05/10/2007US20070105735 Cleaner
05/10/2007US20070105523 Low noise amplifier
05/10/2007US20070105459 Joining method and joining device
05/10/2007US20070105402 Film-forming method, method of manufacturing semiconductor device, semiconductor device, method of manufacturing display device, and display device
05/10/2007US20070105401 Multi-step system and method for curing a dielectric film
05/10/2007US20070105400 Method and apparatus for control of layer thicknesses
05/10/2007US20070105399 Method for making a metal oxide semiconductor device
05/10/2007US20070105398 Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device
05/10/2007US20070105397 Method for removing hydrogen gas from a chamber
05/10/2007US20070105396 High resolution structures defined by brush painting fluid onto surface energy patterned substrates
05/10/2007US20070105395 Laser functionalization and patterning of thick-film inks
05/10/2007US20070105394 Method for coating a structure comprising semiconductor chips
05/10/2007US20070105393 Method for forming patterns and thin film transistors
05/10/2007US20070105392 Batch photoresist dry strip and ash system and process
05/10/2007US20070105391 Semiconductor device fabrication method and semiconductor device
05/10/2007US20070105390 Oxygen depleted etching process
05/10/2007US20070105389 Method and apparatus for manufacturing a semiconductor device, control program thereof and computer-readable storage medium storing the control program
05/10/2007US20070105388 Method for fabricating semiconductor device with recess gate
05/10/2007US20070105387 Gate critical dimension variation by use of ghost features
05/10/2007US20070105386 Method of etching a dielectric layer to form a contact hole and a via hole and damascene method
05/10/2007US20070105385 Method of fabricating suspended structure
05/10/2007US20070105384 Automated process and apparatus for planarization of topographical surfaces
05/10/2007US20070105383 Photoactive adhesion promoter in a slam
05/10/2007US20070105382 Fluid ejection device and method of fabricating the same
05/10/2007US20070105381 Process for etching a metal layer suitable for use in photomask fabrication
05/10/2007US20070105380 Substrate processing apparatus
05/10/2007US20070105379 Substrate processing apparatus
05/10/2007US20070105378 Method of manufacturing semiconductor device
05/10/2007US20070105377 Fabrication of semiconductor interconnect structure
05/10/2007US20070105376 Copper-based metal polishing solution and method for manufacturing semiconductor device
05/10/2007US20070105375 Catalytic nucleation monolayer for metal seed layers
05/10/2007US20070105374 Method for making a metal oxide semiconductor device
05/10/2007US20070105373 Method of direct deposition of polycrystalline silicon
05/10/2007US20070105372 Conductive material patterning methods
05/10/2007US20070105371 Forming method of silicide film
05/10/2007US20070105370 Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring
05/10/2007US20070105369 Semiconductor device and manufacturing method thereof
05/10/2007US20070105368 Method of fabricating a microelectronic device using electron beam treatment to induce stress
05/10/2007US20070105367 Method for forming barrier layer
05/10/2007US20070105366 Long-term heat-treated integrated circuit arrangements and methods for producing the same
05/10/2007US20070105365 Metal printing blanket
05/10/2007US20070105364 Method of forming interconnect having stacked alignment mark
05/10/2007US20070105363 Antireflective Hardmask and Uses Thereof
05/10/2007US20070105362 Methods of forming contact structures in low-k materials using dual damascene processes
05/10/2007US20070105361 Method for forming a joint
05/10/2007US20070105360 Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed
05/10/2007US20070105359 Electrical interconnection structure formation
05/10/2007US20070105358 Method for forming silicide contacts
05/10/2007US20070105357 Silicided recessed silicon
05/10/2007US20070105356 Method of controlling nanowire growth and device with controlled-growth nanowire
05/10/2007US20070105355 Method of implanting a substrate and an ion implanter for performing the method
05/10/2007US20070105354 Buried subcollector for high frequency passive devices
05/10/2007US20070105352 Uniform seeding to control grain and defect density of crystallized silicon for use in sub-micron thin film transistors
05/10/2007US20070105351 GaN single crystal substrate and method of making the same
05/10/2007US20070105350 Defect reduction by oxidation of silicon
05/10/2007US20070105349 Epitaxial semiconductor structures having reduced stacking fault nucleation sites
05/10/2007US20070105348 Wafer processing method
05/10/2007US20070105347 Method for separating parts from a substrate
05/10/2007US20070105346 Small chips with fan-out leads
05/10/2007US20070105345 Semiconductor wafer dividing method
05/10/2007US20070105344 Method for pre-treating epitaxial layer, method for evaluating epitaxial layer, and apparatus for evaluating epitaxial layer
05/10/2007US20070105343 Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
05/10/2007US20070105342 Method of fabricating microelectromechanical system structures
05/10/2007US20070105341 Bonding metals and non-metals using inductive heating
05/10/2007US20070105340 Interlayer bond to a substrate which, at least in regions on a surface, is provided with a coating of a metal, a method for production thereof and use
05/10/2007US20070105339 Method of fabricating multi layer MEMS and microfluidic devices
05/10/2007US20070105338 Trench insulation in substrate disks comprising logic semiconductors and power semiconductors
05/10/2007US20070105337 Selective nitride liner formation for shallow trench isolation
05/10/2007US20070105336 Semiconductor device and method for fabricating the same
05/10/2007US20070105335 Monolithically integrated silicon and III-V electronics
05/10/2007US20070105334 Methods of fabricating semiconductor devices having multiple channel transistors and semiconductor devices fabricated thereby
05/10/2007US20070105333 Vertical interconnect structure, memory device and associated production method
05/10/2007US20070105332 Integrated circuit capacitor having antireflective dielectric
05/10/2007US20070105331 CMOS transistor junction regions formed by a CVD etching and deposition sequence
05/10/2007US20070105330 Bandgap and recombination engineered emitter layers for SiGe HBT performance optimization
05/10/2007US20070105329 Semiconductor device and method of manufacturing the same