Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/17/2007US20070107843 Plasma processing apparatus
05/17/2007US20070107842 Corrosion-resistant member
05/17/2007US20070107756 Meniscus proximity system for cleaning semiconductor substrate surfaces
05/17/2007US20070107751 Ozone processing apparatus and ozone processing method
05/17/2007US20070107657 Device for spin-coating substrates
05/17/2007US20070107655 Sub-resolutional laser annealing mask
05/17/2007US20070107654 High-purity crystal growth
05/17/2007US20070107653 Vapor phase growth apparatus and method of fabricating epitaxial wafer
05/17/2007US20070107448 Helium management control system
05/17/2007US20070107317 Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
05/17/2007US20070107206 Spiral Inductor Formed in a Semiconductor Substrate and a Method for Forming the Inductor
05/16/2007EP1786037A2 Semiconductor device and method for fabricating the same
05/16/2007EP1786036A1 Floating gate non-volatile memory cell and process for manufacturing
05/16/2007EP1786034A2 Power semiconductor module
05/16/2007EP1786032A2 Embossing chuck enabling wafer to be easily detached therefrom
05/16/2007EP1786031A1 Vertical-gate mos transistor for high voltage applications with variable gate oxide thickness
05/16/2007EP1786030A1 Silicon oxide film forming method, semiconductor device manufacturing method and computer storage medium
05/16/2007EP1786029A1 Plasma film-forming method and apparatus therefor
05/16/2007EP1786028A1 Coating solution for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof
05/16/2007EP1786027A2 Plasma etching of tapered structures
05/16/2007EP1786026A1 Method of fabricating first and second separate active semiconductor zones and use for the fabrication of CMOS structures.
05/16/2007EP1786025A1 Process for forming relaxed layers
05/16/2007EP1786024A1 Method of optical lithography using phase shift masking
05/16/2007EP1786023A1 Simox substrate manufacturing method
05/16/2007EP1785736A2 Defect analysis device and method for printed circuit boards
05/16/2007EP1785735A1 Heavy object turning apparatus
05/16/2007EP1785512A1 Silicon carbide single crystal wafer and method for manufacturing the same
05/16/2007EP1785511A1 Silicon wafer, process for producing the same and method of growing silicon single crystal
05/16/2007EP1785459A1 Siliceous film with smaller flat band shift and method for producing same
05/16/2007EP1785230A2 Apparatus and method for slurry cleaning of etch chambers
05/16/2007EP1785228A1 Apparatus and method for polishing work using electrolytic reduced water
05/16/2007EP1785213A2 Ultrasonic bonding head
05/16/2007EP1784868A1 Lateral field effect transistor and its fabrication comprisng a spacer layer above and below the channel layer
05/16/2007EP1784862A2 Thermally controlled fluidic self-assembly method and support
05/16/2007EP1784861A1 Thermally controlled fluidic self-assembly
05/16/2007EP1784860A2 Thermally controlled self-assembly method and support
05/16/2007EP1784859A2 Semiconductor transistor having structural elements of differing materials and method of formation
05/16/2007EP1784858A2 Dram transistor with a gate buried in the substrate and method of forming thereof
05/16/2007EP1784857A1 Semiconductor device and method of manufacturing such a semiconductor device
05/16/2007EP1784856A1 Semiconductor device and method of manufacturing such a semiconductor device
05/16/2007EP1784855A1 Apparatus and method of determining characteristics of thin-layer structures using low-coherence interferometry
05/16/2007EP1784854A2 Method and apparatus for mobility enhancement in a semiconductor device
05/16/2007EP1784853A1 Structure formation
05/16/2007EP1784690A2 Plasma ashing process for increasing photoresist removal rate and plasma apparatus with cooling means
05/16/2007EP1784528A1 One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
05/16/2007EP1625615A4 Cmos-compatible integration of silicon-based optical devices with electronic devices
05/16/2007EP1497861B1 Semiconductor component having an integrated capacitance structure and method for producing the same
05/16/2007EP1493180B1 Variable temperature processes for tunable electrostatic chuck
05/16/2007EP1470264A4 Methods for silicon oxide and oxynitride deposition using single wafer low pressure cvd
05/16/2007EP1374286B1 Diffuser and rapid cycle chamber
05/16/2007EP1364408B1 Production method of an electrode arrangement for charge storage
05/16/2007EP1356522B1 Back illuminated imager with enhanced uv to near ir sensitivity
05/16/2007EP1269514B1 An enhanced resist strip in a dielectric etcher using downstream plasma and plasma apparatus used therefor
05/16/2007EP1149412B1 Dielectric films from organohydridosiloxane resins
05/16/2007DE202007001431U1 Halbleiteranordnung und Leistungshalbleiterbauelement Semiconductor device and power semiconductor component
05/16/2007CN2901575Y Linear moving buffer mechanism for welding head flexible hinge
05/16/2007CN2901376Y Manipulator device for even film developing machine
05/16/2007CN2901333Y Temperature rise and heat resistance detector of semiconductor PN junction diode device
05/16/2007CN1965459A Linear motor and stage device using the linear motor
05/16/2007CN1965418A Layered resistance variable memory device and method of fabrication
05/16/2007CN1965412A Complimentary nitride transistors vertical and common drain
05/16/2007CN1965408A Memory device and manufacturing method of the same
05/16/2007CN1965404A Semiconductor storage
05/16/2007CN1965403A Integrated circuit metal silicide method
05/16/2007CN1965402A Method for forming trench isolation structure
05/16/2007CN1965401A Component mounting method and component mounting apparatus
05/16/2007CN1965400A Field-effect transistor, semiconductor device, a method for manufacturing them, and a method of semiconductor crystal growth
05/16/2007CN1965399A High electron mobility transistor (hemt) made of layers of group xiii element nitrides and manufacturing method thereof
05/16/2007CN1965398A Heterojunction bipolar transistor
05/16/2007CN1965397A Reduction of cracking in low-k spin-on-dielectric films
05/16/2007CN1965396A Silicon electrode plate having excellent durability for plasma etching
05/16/2007CN1965395A Board cleaning apparatus, board cleaning method, and medium with recorded program to be used for the method
05/16/2007CN1965394A Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
05/16/2007CN1965393A Production method of compound semiconductor device wafer
05/16/2007CN1965392A Impurity introducing method and electronic element using it
05/16/2007CN1965391A Semiconductor device manufacturing method and manufacturing apparatus
05/16/2007CN1965390A Epitaxially growing equipment
05/16/2007CN1965389A Substrate holding device, exposure device having the same, exposure method, method for producing device, and liquid repellent plate
05/16/2007CN1965388A Apparatus and method for drying substrates
05/16/2007CN1965273A Method of controlling operation of a processing system
05/16/2007CN1965268A Antireflection film for semiconductor containing condensation type polymer
05/16/2007CN1965265A Chemically amplified resist composition and method for forming resist pattern
05/16/2007CN1965240A Wafer-level opto-electronic testing apparatus and method
05/16/2007CN1965105A Method and device for electroless deposition with temperature-controlled chuck
05/16/2007CN1965044A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
05/16/2007CN1965039A Block copolymerized polyimide ink composition for printing
05/16/2007CN1964923A Method for forming quartz glass
05/16/2007CN1964841A Sheet for suction and fixation, and method of producing the same
05/16/2007CN1964599A Manufacturing method of a three-dimensional circuit board
05/16/2007CN1964193A Logical circuit
05/16/2007CN1964094A Nitride semiconductor device
05/16/2007CN1964093A Nitride semiconductor device
05/16/2007CN1964090A Nitride-based semiconductor device and production method thereof
05/16/2007CN1964089A A method for packaging LED on transparent soft thin film substrate
05/16/2007CN1964088A Ⅲ族氮化物半导体基板 Ⅲ nitride semiconductor substrate
05/16/2007CN1964086A Surface adhesion type LED packaging structure
05/16/2007CN1964083A LED and formation method for electrode pad
05/16/2007CN1964077A Capacitor and manufacturing method thereof, semiconductor device containing the capacitor
05/16/2007CN1964076A Gate structure, semiconductor memory device having the gate structure and methods of fabricating the same
05/16/2007CN1964074A Complementary carbon nanotube and method for forming the same