Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/17/2007US20070111135 Positive resist composition and method of forming resist pattern using same
05/17/2007US20070111114 Silicon thin film in which an opening for selectively irradiating charged particles to a semiconductor substrate is provided and whose irradiation surface on which the charged particles are irradiated is implanted with an impurity, and selectively irradiating charged particles to semiconductor substrate
05/17/2007US20070111033 Zinc oxide-based multilayer structural body and its producing method
05/17/2007US20070110975 Carrier for receiving an object and method for the production of a carrier
05/17/2007US20070110971 Carbon nanotube growth method
05/17/2007US20070110955 Water-permeable adhesive tape
05/17/2007US20070110947 Method and Apparatus for Forming a DMD Window Frame with Molded Glass
05/17/2007US20070110921 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
05/17/2007US20070110918 improved chemical vapor deposition process which can suppress the backward flow of the deposition material gas, such as monosilane gas
05/17/2007US20070110917 Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit
05/17/2007US20070110916 Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method
05/17/2007US20070110898 Method and apparatus for providing precursor gas to a processing chamber
05/17/2007US20070110548 Processing apparatus
05/17/2007US20070110547 Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists
05/17/2007US20070109898 Semiconductor device
05/17/2007US20070109871 NROM flash memory with self-aligned structural charge separation
05/17/2007US20070109864 Selective Operation of a Multi-State Non-Volatile Memory System in a Binary Mode
05/17/2007US20070109851 Method of manufacturing non-volatile memory and method of operating non-volatile memory array
05/17/2007US20070109735 Semiconductor device
05/17/2007US20070109699 Semiconductor integrated circuit
05/17/2007US20070109534 Systems for managing production information
05/17/2007US20070109525 Exposure apparatus and method
05/17/2007US20070109524 Exposure method and device manufacturing method, exposure apparatus, and program
05/17/2007US20070109523 Reticle cassette and exposure apparatus using reticle cassette
05/17/2007US20070109517 Exposure apparatus and device manufacturing method
05/17/2007US20070109515 Exposure apparatus and an exposure method
05/17/2007US20070109478 Method of fabricating an array substrate
05/17/2007US20070109467 Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
05/17/2007US20070109458 Liquid crystal display device with double metal layer source and drain electrodes and fabricating method thereof
05/17/2007US20070109345 Nozzle arrangement for an inkjet printhead with associated actuator drive ciircuitry
05/17/2007US20070109034 Semiconductor device
05/17/2007US20070109008 Novel test structure for speeding a stress-induced voiding test and method of using the same
05/17/2007US20070109001 System for evaluating probing networks
05/17/2007US20070108649 Foamed mechanical planarization pads made with supercritical fluid
05/17/2007US20070108639 Semiconductor device and method for fabricating the same
05/17/2007US20070108638 Alignment mark with improved resistance to dicing induced cracking and delamination in the scribe region
05/17/2007US20070108636 Semiconductor device
05/17/2007US20070108632 Semiconductor chip having bond pads
05/17/2007US20070108631 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
05/17/2007US20070108624 Integrated circuit package system with downset lead
05/17/2007US20070108620 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
05/17/2007US20070108618 Semiconductor device
05/17/2007US20070108616 Semiconductor device and method for fabricating the same
05/17/2007US20070108614 Semiconductor device and method for manufacturing the same
05/17/2007US20070108609 Bumped chip carrier package using lead frame and method for manufacturing the same
05/17/2007US20070108597 Integrated circuit package system with heat dissipation enclosure
05/17/2007US20070108593 Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
05/17/2007US20070108592 Method for fabricating semiconductor package
05/17/2007US20070108590 Semiconductor package system with thermal die bonding
05/17/2007US20070108581 Offset integrated circuit package-on-package stacking system
05/17/2007US20070108580 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
05/17/2007US20070108579 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
05/17/2007US20070108572 Structure for reducing stress for vias and fabricating method thereof
05/17/2007US20070108571 Method for fabricating semiconductor package with stacked chips
05/17/2007US20070108570 Semiconductor device and method of manufacturing the same
05/17/2007US20070108568 Integrated circuit package to package stacking system
05/17/2007US20070108566 Integrated circuit package system with multi-planar paddle
05/17/2007US20070108565 Etched leadframe flipchip package system
05/17/2007US20070108563 Semiconductor device
05/17/2007US20070108547 Second Schottky contact metal layer to improve GaN Schottky diode performance
05/17/2007US20070108537 Corner dominated trigate field effect transistor
05/17/2007US20070108536 QUASI SELF-ALIGNED SOURCE/DRAIN FinFET PROCESS
05/17/2007US20070108534 Schottky barrier diode and method of forming a schottky barrier diode
05/17/2007US20070108530 Semiconductor device and method for manufacturing the same
05/17/2007US20070108525 Structure and method to increase strain enhancement with spacerless fet and dual liner process
05/17/2007US20070108523 Semiconductor device and fabrication method for the same
05/17/2007US20070108521 Flexible semiconductor device and identification label
05/17/2007US20070108514 Semiconductor device and method of fabricating the same
05/17/2007US20070108512 Power Semiconductor Component With Charge Compensation Structure And Method For The Fabrication Thereof
05/17/2007US20070108510 Process for production of SOI substrate and process for production of semiconductor device
05/17/2007US20070108508 Single-poly non-volatile memory device
05/17/2007US20070108504 Non-volatile memory and manufacturing method and operating method thereof
05/17/2007US20070108502 Nanocrystal silicon quantum dot memory device
05/17/2007US20070108501 SRAM circuit having a SONOS-based NAND device
05/17/2007US20070108496 Nonvolatile semiconductor storage device and method of manufacture thereof
05/17/2007US20070108494 Semiconductor device including insulated gate type transistor and insulated gate type capacitance, and method of manufacturing the same
05/17/2007US20070108493 Capacitor and process for manufacturing the same
05/17/2007US20070108491 Semiconductor memory device having high electrical performance and mask and photolithography friendliness
05/17/2007US20070108485 Image sensor cells
05/17/2007US20070108482 Non-volatile electromechanical field effect devices and circuits using same and methods of forming same
05/17/2007US20070108474 Semiconductor device and method of fabricating the same
05/17/2007US20070108466 Group III-nitrides on Si substrates using a nanostructured interlayer
05/17/2007US20070108458 Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
05/17/2007US20070108453 N-type ohmic electrode for n-type group III nitride semiconductor, semiconductor light-emitting device with the electrode, and method for forming n-type ohmic electrode
05/17/2007US20070108450 Reduction of carrot defects in silicon carbide epitaxy
05/17/2007US20070108449 Display device and fabrication method thereof
05/17/2007US20070108447 Thin film transistor and liquid crystal display
05/17/2007US20070108446 Semiconductor device and manufacturing method thereof
05/17/2007US20070108432 Damascene phase change memory
05/17/2007US20070108394 Ion implantation ion source, system and method
05/17/2007US20070108301 Semiconductor device and IC card
05/17/2007US20070108166 Thermal flux processing by scanning a focused line beam
05/17/2007US20070108095 Wafer container and door with vibration dampening latching mechanism
05/17/2007US20070108067 Polishing apparatus and method of polishing work
05/17/2007US20070108066 Voltage mode current control
05/17/2007US20070108042 Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
05/17/2007US20070108020 Break-away positioning conveyor mount for accommodating conveyor belt bends
05/17/2007US20070108019 Break-away positioning conveyor mount for accommodating conveyor belt bends
05/17/2007US20070107846 Method and apparatus for an improved baffle plate in a plasma processing system
05/17/2007US20070107845 Semiconductor processing system
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