Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/17/2007US20070111430 High density mimcap with a unit repeatable structure
05/17/2007US20070111429 Method of manufacturing a pipe shaped phase change memory
05/17/2007US20070111428 Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement
05/17/2007US20070111427 Semiconductor device and method of manufacturing the same
05/17/2007US20070111426 Layout design method and layout design tool
05/17/2007US20070111425 Composite gate structure in an integrated circuit
05/17/2007US20070111424 Semiconductor device and manufacturing method thereof
05/17/2007US20070111423 Method of fabricating semiconductor device
05/17/2007US20070111422 Self Aligned Non-Volatile Memory Cells and Processes for Fabrication
05/17/2007US20070111421 Structure and method to generate local mechanical gate stress for mosfet channel mobility modification
05/17/2007US20070111420 Cmos and mos device
05/17/2007US20070111419 CMOS Devices with a single work function gate electrode and method of fabrication
05/17/2007US20070111418 Method of manufacturing pixel structure
05/17/2007US20070111417 Strained-silicon cmos device and method
05/17/2007US20070111416 Method of fabricating strained-silicon transistors
05/17/2007US20070111415 High-voltage metal-oxide-semiconductor device and method of manufacturing the same
05/17/2007US20070111414 A Vertical Replacement-Gate Silicon-On-Insulator Transistor
05/17/2007US20070111413 Method for fabricating semiconductor device
05/17/2007US20070111412 Thin film transistor array panel and method of manufacturing the same
05/17/2007US20070111411 Thin film transistor substrate and manufacturing method for the same
05/17/2007US20070111410 High mobility plane finfets with equal drive strength
05/17/2007US20070111409 Semiconductor device
05/17/2007US20070111408 Manufacturing method for field-effect transistor
05/17/2007US20070111407 Storage capacitor in oled pixels and driving circuits and method for forming the same
05/17/2007US20070111406 FET Channel Having a Strained Lattice Structure Along Multiple Surfaces
05/17/2007US20070111405 Design method for semiconductor integrated circuit
05/17/2007US20070111404 Method of manufacturing strained-silicon semiconductor device
05/17/2007US20070111403 Polycide fuse with reduced programming time
05/17/2007US20070111402 Production and packaging control for repaired integrated circuits
05/17/2007US20070111401 Printed wiring board, its manufacturing method, and circuit device
05/17/2007US20070111400 Dispensing device and mounting system
05/17/2007US20070111399 Method of fabricating an exposed die package
05/17/2007US20070111398 Micro-electronic package structure and method for fabricating the same
05/17/2007US20070111397 Integrated circuit package system with heat sink
05/17/2007US20070111396 Electro-optical device, manufacturing method of the same, and electronic apparatus
05/17/2007US20070111395 Lead frame structure and semiconductor package integrated with the lead frame structure
05/17/2007US20070111394 Integrated circuit package system
05/17/2007US20070111393 Method of forming a leaded molded array package
05/17/2007US20070111392 Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board
05/17/2007US20070111391 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
05/17/2007US20070111390 Semiconductor device and method for processing wafer
05/17/2007US20070111389 Micro chip-scale-package system
05/17/2007US20070111388 Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (BGA) Package
05/17/2007US20070111387 Manufacturing method of wiring board and manufacturing method of semiconductor device
05/17/2007US20070111386 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
05/17/2007US20070111385 Method of manufacture of silicon based package and devices manufactured thereby
05/17/2007US20070111384 Method of manufacturing a semiconductor device
05/17/2007US20070111383 Carbon-carbon and/or metal-carbon fiber composite heat spreader
05/17/2007US20070111382 Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
05/17/2007US20070111381 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls
05/17/2007US20070111380 Fabricating method of printed circuit board having embedded component
05/17/2007US20070111379 Pre-molded leadframe and method therefor
05/17/2007US20070111378 Method of protecting semiconductor chips from mechanical and ESD damage during handling
05/17/2007US20070111377 Connector and method for making the same
05/17/2007US20070111376 Integrated circuit package system
05/17/2007US20070111375 Enhancing shock resistance in semiconductor packages
05/17/2007US20070111374 Reversible leadless package and methods of making and using same
05/17/2007US20070111373 Process for producing semiconductor integrated circuit device
05/17/2007US20070111372 Methods of forming a p-type group ii-vi semiconductor crystal layer on a substrate
05/17/2007US20070111369 Organic light emitting display device and method of manufacturing the same
05/17/2007US20070111368 Photovoltaic structure with a conductive nanowire array electrode
05/17/2007US20070111367 Method and apparatus for converting precursor layers into photovoltaic absorbers
05/17/2007US20070111366 Mesoscale pyramids, arrays and methods of preparation
05/17/2007US20070111365 Manufacturing method of microstructure and microelectromechanical system
05/17/2007US20070111364 Laser generated stress waves for stiction repair
05/17/2007US20070111363 Excitation in Micromechanical Devices
05/17/2007US20070111362 Excitation in Micromechanical Devices
05/17/2007US20070111361 Image sensor having self-aligned and overlapped photodiode and method of making same
05/17/2007US20070111360 Method for producing micromechanical structures and a micromechanical structure
05/17/2007US20070111359 Solid-state image pickup device and method for manufacturing the same
05/17/2007US20070111358 Nuclear medicine imaging system and method thereof
05/17/2007US20070111357 Manufacturing method of a non-volatile memory
05/17/2007US20070111356 Front Lit PIN/NIP Diode Having a Continuous Anode/Cathode
05/17/2007US20070111355 Method and structure of ion implanted elements for the optimization of resistance
05/17/2007US20070111354 Nitride-based light emitting device and method of manufacturing the same
05/17/2007US20070111353 Hybrid microfluidic chip and method for manufacturing same
05/17/2007US20070111352 Wafer with optical control modules in dicing paths
05/17/2007US20070111351 Led and led light source
05/17/2007US20070111350 Semiconductor nanocrystal probes for biological applications and process for making and using such probes
05/17/2007US20070111349 Laser-irradiated thin films having variable thickness
05/17/2007US20070111348 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
05/17/2007US20070111347 Surface emitting device, manufacturing method thereof and projection display device using the same
05/17/2007US20070111346 Laser-marking method for a wafer
05/17/2007US20070111345 Method for controlling the structure and surface qualities of a thin film and product produced thereby
05/17/2007US20070111344 Method for the production of white leds and white led light source
05/17/2007US20070111343 Capacitive bypass
05/17/2007US20070111342 Chemical mechanical polishing test structures and methods for inspecting the same
05/17/2007US20070111341 Devices and methods for detecting current leakage between deep trench capacitors in DRAM devices
05/17/2007US20070111340 Method for in-line testing of semiconductor wafers
05/17/2007US20070111339 Apparatus for processing a substrate
05/17/2007US20070111338 Method of controlling trimming of a gate electrode structure
05/17/2007US20070111337 Laser decapsulation apparatus and method
05/17/2007US20070111336 Semiconductor device and method of manufacturing the same
05/17/2007US20070111335 Ferroelectric memory device
05/17/2007US20070111334 Semiconductor device and method of manufacturing the same
05/17/2007US20070111333 Method for manufacturing a resistively switching memory cell and memory device based thereon
05/17/2007US20070111332 Low resistance tunneling magnetoresistive sensor with natural oxidized double MgO barrier
05/17/2007US20070111256 Method for generating an artificially patterned substrate for stimulating the crystallation of a biomolecule thereon and method for stimulating the crystallization of biomolecules
05/17/2007US20070111215 Customized oligonucleotide microchips that convert multiple genetic information to simpler patterns, are portable and reusable
05/17/2007US20070111137 Resist polymer solution and process for producing the same
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