Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/02/2007CN1957444A End-point detection for FIB circuit modification
05/02/2007CN1957443A Plate member, substrate holding device, exposure device and method, and element manufacturing method
05/02/2007CN1957442A Integrated circuit comprising a capacitor with metal electrodes, and method of producing one such capacitor
05/02/2007CN1957299A Radiation-sensitive composition, multilayer body and method for producing same, and electronic component
05/02/2007CN1957260A Sheet probe, manufacturing method and application therefor
05/02/2007CN1957259A Sheetlike probe, its manufacturing method and its application
05/02/2007CN1957117A Group III nitride semiconductor crystal, method for producing same, and group iii nitride semiconductor device
05/02/2007CN1957115A Method for electroplating bath chemistry control
05/02/2007CN1957110A Material for chemical vapor deposition and thin film forming method
05/02/2007CN1957108A Multi-stage curing method of low k nano-porous films
05/02/2007CN1957107A Opposing target type sputter device
05/02/2007CN1957106A Film forming apparatus and film forming method
05/02/2007CN1957020A Organic silica film, method for forming the same, wiring structure, semiconductor device, and composition for film formation
05/02/2007CN1956899A Substrate reception container, substrate reception body, and substrate conveyance device
05/02/2007CN1956778A Method of oxidizing substance and oxidizing apparatus thereof
05/02/2007CN1956635A Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method
05/02/2007CN1956631A Method of forming pattern, film structure, electrooptical device and electronic equipment
05/02/2007CN1956618A 干蚀刻方法 The dry etching method
05/02/2007CN1956491A Method for driving semiconductor device, method and apparatus for driving load, and electronic apparatus
05/02/2007CN1956489A Ternary pulse generation circuit
05/02/2007CN1956331A 半导体集成电路器件 The semiconductor integrated circuit device
05/02/2007CN1956330A 半导体集成电路器件 The semiconductor integrated circuit device
05/02/2007CN1956225A Thin-film transistor, method of manufacturing the same, liquid crystal display panel having the same and electro-luminescence display panel having the same
05/02/2007CN1956224A Improved thin film transistors
05/02/2007CN1956223A Semiconductor device and method for fabricating the same
05/02/2007CN1956222A Semiconductor device and method for fabricating the same
05/02/2007CN1956221A Transistor with medium stress generation region and manufacturing method thereof
05/02/2007CN1956220A Transistor with medium stress generation region for applying in-plane shear stress and manufacturing method thereof
05/02/2007CN1956219A Semiconductor device and method for fabricating the same
05/02/2007CN1956218A High pressure metal oxide semiconductor element and its manufacturing method
05/02/2007CN1956217A Flash storage structure and its manufacturing method
05/02/2007CN1956216A Semiconductor structure and method of forming the same
05/02/2007CN1956214A 场效应晶体管及其制造方法 The field effect transistor and manufacturing method thereof
05/02/2007CN1956213A Semiconductor material, production method thereof and semiconductor device
05/02/2007CN1956211A Display apparatus and fabricating method thereof
05/02/2007CN1956210A Display device and method of manufacturing the same
05/02/2007CN1956209A Organic el device, manufacturing device thereof, electronic device and liquid droplet ejection apparatus
05/02/2007CN1956204A Solid-state imaging device and manufacturing method thereof
05/02/2007CN1956203A Cmos图像传感器及其制造方法 Cmos image sensor and a method of manufacturing
05/02/2007CN1956202A Image chip package structure and its package method
05/02/2007CN1956199A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/02/2007CN1956198A Read amplifier part of semiconductor memory device
05/02/2007CN1956197A Gain cells and methods of making and using the same
05/02/2007CN1956196A biCMOS device and method of manufacturing a biCMOS device
05/02/2007CN1956195A Semiconductor device and method for fabricating the same
05/02/2007CN1956194A Semiconductor device and method for fabricating the same
05/02/2007CN1956192A Power circuit package and fabrication method
05/02/2007CN1956186A Semiconductor device and method for fabricating the same
05/02/2007CN1956185A Internal connection wire structure and its manufacturing method
05/02/2007CN1956184A High depth-width ratio open and its manufacturing method
05/02/2007CN1956183A Electronic part built-in substrate and manufacturing method thereof
05/02/2007CN1956182A Semiconductor mount circuit board, semiconductor device and method of manufacturing semiconductor package
05/02/2007CN1956179A Chip package structure and lug manufacturing process
05/02/2007CN1956178A Photoelectric chip package structure, manufacturing method and its chip carrier
05/02/2007CN1956177A Chip structure, chip package structure and its process
05/02/2007CN1956173A Semiconductor device and method of manufacture thereof
05/02/2007CN1956172A Film transistor substrate and its manufacturing method
05/02/2007CN1956171A Methods of forming non-volatile memory devices and devices formed thereby
05/02/2007CN1956170A Method for manufacturing semiconductor device
05/02/2007CN1956169A Dynamic RAM and manufacturing method
05/02/2007CN1956168A Manufacturing method of solid-state imaging device and solid-state imaging device
05/02/2007CN1956167A Display device and method of manufacturing the same
05/02/2007CN1956166A Method of forming metal film and tungsten film
05/02/2007CN1956165A Controlling lateral distribution of air gaps in interconnects
05/02/2007CN1956164A Semiconductor device fabrication method
05/02/2007CN1956163A Process method of implementing shallow ridge separation
05/02/2007CN1956162A Method for manufacturing element substrate and supporting apparatus for the substrate
05/02/2007CN1956161A Wafer array apparatus and method for arraying wafer
05/02/2007CN1956160A 供料装置 Feed means
05/02/2007CN1956159A Crystal wafer testing method and structure of LED
05/02/2007CN1956158A Manufacturing method and middle structure of solder projection
05/02/2007CN1956157A Method of forming a leaded molded array package
05/02/2007CN1956156A Nonvolatile storage unit and its manufacturing method
05/02/2007CN1956155A Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, control program and computer storage medium
05/02/2007CN1956154A Method for etching carbon-containing layer and method for manufacturing semiconductor device
05/02/2007CN1956153A Method of forming a trench semiconductor device and structure therefor
05/02/2007CN1956152A Semiconductor device manufacturing method
05/02/2007CN1956151A Manufacturing method for semiconductor and accessorial device
05/02/2007CN1956150A Semiconductor film, semiconductor device and method of their production
05/02/2007CN1956149A Methods for forming germanium-on-insulator semiconductor structures and semiconductor structures formed by these methods
05/02/2007CN1956148A Method for improving quality of Al-Ga-N material
05/02/2007CN1956147A Ge-based semiconductor structure and manufacturing method thereof
05/02/2007CN1956146A Method and apparatus for chuck thermal calibration
05/02/2007CN1956145A Semiconductor process chamber
05/02/2007CN1956144A Lightweight bondhead assembly
05/02/2007CN1956143A Capacity coupling plasma reactor with temperature uniform distribution wafer supporting
05/02/2007CN1956138A Adjustable electrode assembly for use in processing substrates of differing widths in a plasma processing system
05/02/2007CN1955849A Cooling plate, bake unit, and substrate treating apparatus
05/02/2007CN1955848A Immersion lithography apparatus, lithography apparatus and cleaning methods thereof
05/02/2007CN1955847A System and method for photolithography in semiconductor manufacturing
05/02/2007CN1955842A Photoetching equipment
05/02/2007CN1955840A Fabrication method of photomask-blank
05/02/2007CN1955786A Phase modulation element, manufacturing method thereof, crystallization device and crystallization method
05/02/2007CN1955743A Probe device of probe card
05/02/2007CN1955338A Vaporizer and semiconductor processing system
05/02/2007CN1955334A Substrate fixing clamp of magnetic sputtering instrument
05/02/2007CN1955248A Chemical mechanical polishing material for tantalum barrier layer
05/02/2007CN1955212A Chemical mechanical polishing material for barrier layer
05/02/2007CN1955131A Glass-ceramics and a method for manufacturing the same
05/02/2007CN1954967A Lapping pad and its manufacturing method