Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/16/2007CN1316609C Semiconductor device and its producing method
05/16/2007CN1316605C Substrate for use in joining element and method thereof
05/16/2007CN1316604C Semiconductor package device with layer-increasing structure and making method thereof
05/16/2007CN1316603C Method for mfg. semiconductor integrated circuit
05/16/2007CN1316602C Method for forming bit-line of semiconductor device
05/16/2007CN1316601C Method for mfg. non-volatile internal memory
05/16/2007CN1316600C Manufacture of semiconductor device
05/16/2007CN1316599C Method for mfg. semiconductor IC device
05/16/2007CN1316598C Integrated circuit and method for programming charge storage memory cells
05/16/2007CN1316597C Rapid integrated design method based on static state random memory
05/16/2007CN1316596C Method of generating wiring pattern
05/16/2007CN1316595C Integrated circuit wiring designing apparatus, method and program
05/16/2007CN1316594C Method for making semiconductor device
05/16/2007CN1316593C Method of forming metal line in semiconductor device
05/16/2007CN1316592C Method for manufacturing semiconductor device
05/16/2007CN1316591C Method of forming wiring structure and semiconductor device
05/16/2007CN1316590C A method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
05/16/2007CN1316589C Method for locally increasing sidewall density by ion implantation
05/16/2007CN1316588C Method for fabricating semiconductor device with recessed channel region
05/16/2007CN1316587C Method of forming junction isolation active assembly
05/16/2007CN1316586C Method for forming a layered semiconductor technology structure and corresponding layered semiconductor technology structure
05/16/2007CN1316585C 半导体器件 Semiconductor devices
05/16/2007CN1316584C Semiconductor device and its mfg. method
05/16/2007CN1316583C Box for storing multiple semiconductor sheets
05/16/2007CN1316582C Method and device for measuring time on semiconductor module with semiconductor chip
05/16/2007CN1316581C Encapsulated pin structure for improved reliability of wafer
05/16/2007CN1316580C Electrode assembly for the removal of surface oxides by electron attachment
05/16/2007CN1316579C Semiconductor device and method of manufacturing the same
05/16/2007CN1316578C Semiconductor device and its producing method, curcuit board and electronic instrument
05/16/2007CN1316577C Chip scale surface mounted device and its process of manufacture
05/16/2007CN1316576C Semiconductor device and method for making same
05/16/2007CN1316575C Production process of high-voltage crystal brake tube
05/16/2007CN1316574C ONO dielectric substance and manufacturing method thereof
05/16/2007CN1316573C Method for producing semiconductor device
05/16/2007CN1316572C Substrate processing system and its processing method
05/16/2007CN1316571C Chemically machinery milling technique and device
05/16/2007CN1316570C Planar metal electroprocessing
05/16/2007CN1316569C Low-temperature post-dopant activation process
05/16/2007CN1316568C Method for mfg. semiconductor device
05/16/2007CN1316567C Preparation of green light gallium nitride base LED epitaxial wafer by adopting multiquantum well
05/16/2007CN1316566C Interconnects with improved barrier layer adhesion
05/16/2007CN1316565C Semiconductor film and its manufacturing method and semiconductor device and display device using it
05/16/2007CN1316564C Composite photoresist layer structure
05/16/2007CN1316563C High temperature annealing of spin coated Pr(1-x)ca(x)Mno3 thin film for RRAM application
05/16/2007CN1316562C Film-forming device
05/16/2007CN1316561C Method and apparatus for fabricating semiconductor device
05/16/2007CN1316560C Docking-type system and method for transferring and treating substrate
05/16/2007CN1316559C Manufacturing method of semiconductor device and semiconductor device
05/16/2007CN1316558C Method for shortening unit spacing of semiconductor assemly
05/16/2007CN1316557C Method and system to provide electrical contacts for electrotreating processes
05/16/2007CN1316556C High energy body supply device, crystal film forming method and method for producing thin film electronic device
05/16/2007CN1316547C Plasma reactor coil magnet system
05/16/2007CN1316546C Method for fault identification in plasma process
05/16/2007CN1316531C Micro electromechanical switch having a deformable elastomeric conductive element
05/16/2007CN1316505C Method for manufacturing solid memory
05/16/2007CN1316503C Integrated memory and method for production and operation of integrated memory
05/16/2007CN1316413C Method and system enabling minimization of designed circuit area
05/16/2007CN1316412C Method for processing design data of semiconductor integrated circuit
05/16/2007CN1316317C Composition for stripping photoresist and organic material from substrate surfaces
05/16/2007CN1316315C Antireflective composition
05/16/2007CN1316310C Liquid crystal display device and manufacturing method thereof
05/16/2007CN1316309C Electronic device and its mfg. method
05/16/2007CN1316295C Substrate bonding apparatus for liquid crystal display device panel
05/16/2007CN1316275C Optical and electrical interconnect
05/16/2007CN1316253C Inverse needle regulating harness for liftable probe card and needle regulating method
05/16/2007CN1316076C Process for Li-N codoping growth P type ZnO crystal film
05/16/2007CN1316072C Low defect density, ideal oxygen precipitating silicon
05/16/2007CN1316070C Substrate for epitaxy
05/16/2007CN1315615C Tool for applying resilient tape and related method
05/16/2007CN1315583C Base plate treater
05/15/2007US7219320 Semiconductor integrated circuit timing analysis apparatus timing analysis method and timing analysis program
05/15/2007US7219312 Method and program for supporting register-transfer-level design of semiconductor integrated circuit
05/15/2007US7218985 Semiconductor manufacturing apparatus
05/15/2007US7218983 Method and apparatus for integrating large and small lot electronic device fabrication facilities
05/15/2007US7218847 Heating unit for heating a workpiece with light-absorbing heat conducting layer
05/15/2007US7218661 Line selected F2 two chamber laser system
05/15/2007US7218555 Imaging cell that has a long integration period and method of operating the imaging cell
05/15/2007US7218544 Mask ROM
05/15/2007US7218503 Method of determining the correct average bias compensation voltage during a plasma process
05/15/2007US7218502 Bonding member and electrostatic chuck
05/15/2007US7218452 Controlling lens shape in a microlens array
05/15/2007US7218445 Microlithographic reduction projection catadioptric objective
05/15/2007US7218431 Laser treatment apparatus and method of manufacturing semiconductor device
05/15/2007US7218399 Method and apparatus for measuring optical overlay deviation
05/15/2007US7218392 Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
05/15/2007US7218389 Method and apparatus for inspecting pattern defects
05/15/2007US7218383 Holding system, exposure apparatus, and device manufacturing method
05/15/2007US7218382 Load-lock technique
05/15/2007US7218379 Scanning exposure apparatus and method
05/15/2007US7218377 Exposure apparatus and device manufacturing method
05/15/2007US7218361 Semiconductor display device and manufacturing method thereof
05/15/2007US7218131 Inspection probe, method for preparing the same, and method for inspecting elements
05/15/2007US7218126 Inspection method and apparatus for circuit pattern
05/15/2007US7218097 Wafer test equipment and method of aligning test equipment
05/15/2007US7218093 Reduced chip testing scheme at wafer level
05/15/2007US7218020 Linear motor, stage apparatus, exposure apparatus, and device manufacturing method
05/15/2007US7218008 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/15/2007US7218003 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
05/15/2007US7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
05/15/2007US7217999 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board
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