Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/02/2007EP1780778A1 Process liquid for semiconductor device, processing method, and apparatus for manufacturing semiconductor
05/02/2007EP1780777A1 Plasma processing device amd method
05/02/2007EP1780776A1 Process for manufacturing a high-scale-integration mos device
05/02/2007EP1780775A1 Vertical heat treatment device and method of operating the same
05/02/2007EP1780774A1 Heat treatment jig for semiconductor silicon substrate
05/02/2007EP1780773A1 Method of determining exposure conditions, exposure method, exposure apparatus, and method of producing device
05/02/2007EP1780772A1 Exposure equipment and device manufacturing method
05/02/2007EP1780771A1 Aligning apparatus, aligning method, exposure apparatus, exposure method and device manufacturing method
05/02/2007EP1780770A1 Light detecting apparatus, illumination optical apparatus, exposure apparatus and exposure method
05/02/2007EP1780765A2 Stage assembly, particle-optical apparatus comprising such a stage assembly, and method of treating a sample in such an apparatus
05/02/2007EP1780764A1 Stage assembly, particle-optical apparatus comprising such a stage assembly, and method of treating a sample in such an apparatus
05/02/2007EP1780748A1 Group III-nitride layers with patterned surfaces
05/02/2007EP1780728A2 Electrode structure for use in an integrated circuit
05/02/2007EP1780600A1 Lower layer film forming composition for lithography including naphthalene ring having halogen atom
05/02/2007EP1780599A1 Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation
05/02/2007EP1780589A2 Semiconductor device and method for fabricating the same
05/02/2007EP1780450A1 Mechanical seal
05/02/2007EP1780305A2 Dielectric film and process for its fabrication
05/02/2007EP1780182A1 Glass ceramics and a method for manufacturing the same
05/02/2007EP1779969A1 Method of grinding the back surface of a semiconductor wafer and semiconductor wafer grinding apparatus
05/02/2007EP1779440A2 Metal-insulator varactor devices
05/02/2007EP1779438A1 Iii-v hemt devices
05/02/2007EP1779437A1 Nitride-based transistors having laterally grown active region and methods of fabricating same
05/02/2007EP1779436A2 Hybrid substrate technology for high-mobility planar and multiple-gate mosfets
05/02/2007EP1779435A2 Monolithic vertical junction field effect transistor and schottky barrier diode fabricated from silicon carbide and method for fabricating the same
05/02/2007EP1779430A2 Schottky diode structure to reduce capacitance and switching losses and method of making same
05/02/2007EP1779426A2 Dram structures with source/drain pedestals and manufacturing method thereof
05/02/2007EP1779425A2 Memory devices, transistors, memory cells, and methods of making same
05/02/2007EP1779424A2 Fabrication of an eeprom cell with emitter-polysilicon source/drain regions
05/02/2007EP1779423A1 STRAINED SILICON-ON-INSULATOR BY ANODIZATION OF A BURIED p+ SILICON GERMANIUM LAYER
05/02/2007EP1779422A1 Method of forming strained si/sige on insulator with silicon germanium buffer
05/02/2007EP1779421A1 Selective encapsulation of electronic components
05/02/2007EP1779420A1 Economical assembly and connection technique by means of a printing method
05/02/2007EP1779419A2 Direct liquid injection system and method for forming multi-component dielectric films
05/02/2007EP1779417A2 Patterning and aligning semiconducting nanoparticles
05/02/2007EP1779416A2 Asymmetric hetero-doped high-voltage mosfet (ah2mos)
05/02/2007EP1779415A1 Solar cell (sliver) sub-module formation
05/02/2007EP1779414A2 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit
05/02/2007EP1779413A2 Mems device and interposer and method for integrating mems device and interposer
05/02/2007EP1779412A2 Semiconductor devices shared element(s) apparatus and method
05/02/2007EP1779411A1 Deposition technique for producing high quality compound semiconductor materials
05/02/2007EP1779200A1 Surface microstructuring device
05/02/2007EP1779190A2 Silicon-insulator thin-film structures for optical modulators and methods of manufacture
05/02/2007EP1779163A1 Method to trim and smooth high index contrast waveguide structures
05/02/2007EP1779128A2 Method to build a wirebond probe card in a many at a time fashion
05/02/2007EP1779097A2 Method and apparatus for inspecting a specimen surface and use of fluorescent materials
05/02/2007EP1779086A2 Shear test device
05/02/2007EP1778897A1 Iii-nitride materials including low dislocation densities and methods associated with the same
05/02/2007EP1778896A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal
05/02/2007EP1778809A1 CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY CONTAINING CLAY AND CeO2 ABRASIVE PARTICLES AND METHOD OF PLANARIZING SURFACES
05/02/2007EP1692718B1 Carrier for receiving an object and method for the production of a carrier
05/02/2007EP1665290B1 Production of electronic devices
05/02/2007EP1629525B1 A structure for a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
05/02/2007EP1609161B1 Stand-alone organic-based passive devices
05/02/2007EP1599298A4 Method and apparatus for megasonic cleaning of patterned substrates
05/02/2007EP1586127B1 Organic electronic component and method for producing organic electronic devices
05/02/2007EP1565933A4 Gcib processing of integrated circuit interconnect structures
05/02/2007EP1442153A4 Gcib processing to improve interconnection vias and improved interconnection via
05/02/2007EP1376667B1 Heat treating device
05/02/2007EP1366505A4 Direct detection of low-energy charged particles using metal oxide semiconductor circuitry
05/02/2007EP1300057B1 Coil for vacuum plasma processor
05/02/2007EP1159757A4 Method and apparatus for elimination of parasitic bipolar action in complementary oxide semiconductor (cmos) silicon on insulator (soi) circuits
05/02/2007EP1147242A4 Large area plasma source
05/02/2007EP1147241A4 Diffusion bonded sputter target assembly and method of making same
05/02/2007EP1119030B1 Plasma reactor
05/02/2007EP1048066B1 Method of manufacturing a semiconductor device with a bipolar transistor
05/02/2007EP1042801B1 Method of selectively forming silicide
05/02/2007EP1028905B1 Integrated intrabay buffer, delivery, and stocker system
05/02/2007EP1027475A4 Large area microwave plasma apparatus with adaptable applicator
05/02/2007EP0974161B1 Semiconductor component with a structure for preventing onset of cross currents
05/02/2007CN1957649A 多层印刷配线板 Multilayer printed wiring board
05/02/2007CN1957648A Resin ejection nozzle, resin encapsulation method, and electronic part assembly
05/02/2007CN1957510A Nitride semiconductor device and method for manufacturing same
05/02/2007CN1957480A Non-volatile transistor memory array incorporating read-only elements with single mask set
05/02/2007CN1957478A Artificial amorphous semiconductors and applications to solar cells
05/02/2007CN1957477A Electric device with vertical component
05/02/2007CN1957476A Planar dual gate semiconductor device
05/02/2007CN1957474A III-nitride current control device and method of manufacture
05/02/2007CN1957472A Integrated circuit chip with electrostatic discharge protection device
05/02/2007CN1957471A Color filter integrated with sensor array for flat panel display
05/02/2007CN1957464A Semiconductor device, wiring board and manufacturing method thereof
05/02/2007CN1957463A Double density method for wirebond interconnect
05/02/2007CN1957462A Vertically stacked semiconductor device
05/02/2007CN1957461A Semiconductor device and method of manufacturing such a device
05/02/2007CN1957460A DRAM structures with source/drain pedestals and manufacturing method thereof
05/02/2007CN1957459A 层叠体及半导体装置 Laminate and the semiconductor device
05/02/2007CN1957458A Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer
05/02/2007CN1957457A Tape adhering apparatus and tape adhering method
05/02/2007CN1957456A Relay station and substrate processing system using relay station
05/02/2007CN1957455A Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
05/02/2007CN1957454A Silicon wafer for probe bonding and probe bonding method using thereof
05/02/2007CN1957453A Method and device for feeding encapsulating material to a mould cavity
05/02/2007CN1957452A Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
05/02/2007CN1957451A Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
05/02/2007CN1957450A Solder bumps formation using paste retaining its shape after UV irradiation
05/02/2007CN1957449A Electroconductive pattern, manufacturintg method for electronic device and electronic device
05/02/2007CN1957448A Decoupled complementary mask patterning transfer method
05/02/2007CN1957447A III nitride semiconductor crystal and manufacturing method thereof, III nitride semiconductor device and manufacturing method thereof, and light emitting device
05/02/2007CN1957446A Fabrication of crystalline materials over substrates
05/02/2007CN1957445A Flexible single-crystal film and method of manufacturing the same