Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/02/2007US20070178642 Methods for fabricating dram semiconductor devices including silicon epitaxial and metal silicide layers
08/02/2007US20070178641 Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates
08/02/2007US20070178640 Capacitor fabrication methods and capacitor constructions
08/02/2007US20070178639 Triple-well cmos devices with increased latch-up immunity and methods of fabricating same
08/02/2007US20070178638 Semiconductor device and fabrication method thereof
08/02/2007US20070178637 Method of fabricating gate of semiconductor device using oxygen-free ashing process
08/02/2007US20070178636 Method of manufacturing semiconductor device
08/02/2007US20070178635 Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interpoly insulators
08/02/2007US20070178634 Cmos semiconductor devices having dual work function metal gate stacks
08/02/2007US20070178633 Semiconductor device comprising a transistor having a counter-doped channel region and method for forming the same
08/02/2007US20070178632 Manufacturing a semiconductor device including sidewall floating gates
08/02/2007US20070178631 Crystallization method for semiconductor film, manufacturing method for semiconductor device, and laser irradiation apparatus
08/02/2007US20070178630 Method for fabricating a photosensitive semiconductor package
08/02/2007US20070178629 Method for manufacturing a surface mount device
08/02/2007US20070178628 Fabrication of an integrated circuit package
08/02/2007US20070178627 Flip-chip semiconductor device and method for fabricating the same
08/02/2007US20070178626 Method of packaging semiconductor die
08/02/2007US20070178625 Composite interconnect structure using injection molded solder technique
08/02/2007US20070178624 Semiconductor Arrangement
08/02/2007US20070178623 Method of manufacturing semiconductor device
08/02/2007US20070178622 Thermal enhanced package
08/02/2007US20070178620 Method of Forming Copper Indium Gallium Containing Precursors And Semiconductor Compound Layers
08/02/2007US20070178619 Low resistance thin film organic solar cell electrodes
08/02/2007US20070178618 Method for manufacturing liquid crystal display panel
08/02/2007US20070178617 Pixel structure of thin film transistor liquid crystal display
08/02/2007US20070178616 Manufacturing method of semiconductor device having organic semiconductor film
08/02/2007US20070178615 Semiconductor nanocrystal-based optical devices and method of preparing such devices
08/02/2007US20070178614 Semiconductor device
08/02/2007US20070178613 Method of manufacturing semiconductor device and cleaning apparatus
08/02/2007US20070178612 Semiconductor wafer with rear side identification and method
08/02/2007US20070178611 Semiconductor wafer having measurement area feature for determining dielectric layer thickness
08/02/2007US20070178610 Semiconductor Production Apparatus
08/02/2007US20070178609 Magnetoresistive element manufacturing method and magnetic memory device manufacturing method
08/02/2007US20070178608 Magnetic tunnel junction device with improved barrier layer
08/02/2007US20070178516 Self-addressable self-assembling microelectronic integrated systems, component devices, mechanisms, methods, and procedures for molecular biological analysis and diagnostics
08/02/2007US20070178394 Resist composition
08/02/2007US20070178387 A core having a high refractive index and a cladding layer having a low refractive index and an increment of insertion loss of 0.1 dB or less upon subjecting the waveguide to a 360 degrees bending test at a radius of curvature of 2 mm; high flexing property;heat resistance; radiation transparent
08/02/2007US20070178319 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
08/02/2007US20070178259 High temperature, high strength, colorable materials for device processing systems
08/02/2007US20070178234 Method of cleaning surface of semiconductor substrate, method of manufacturing thin film, method of manufacturing semiconductor device, and semiconductor device
08/02/2007US20070177963 End effector for transferring a wafer
08/02/2007US20070177869 Coater/developer and coating/developing method
08/02/2007US20070177639 Wavelength converting optical system, laser light source, exposure apparatus, mask examining apparatus, and macromolecular crystal lens machining device
08/02/2007US20070177445 Semiconductor device
08/02/2007US20070177416 Semiconductor storage device and method of fabricating the same
08/02/2007US20070177274 Optical element, and light source unit and exposure apparatus having the same
08/02/2007US20070177127 Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
08/02/2007US20070177126 Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
08/02/2007US20070177125 Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
08/02/2007US20070176845 Semiconductor device
08/02/2007US20070176724 Monolithically integrated circuit
08/02/2007US20070176622 Id chip and ic card
08/02/2007US20070176619 Probe For Semiconductor Devices
08/02/2007US20070176580 Semiconductor integrated circuit device
08/02/2007US20070176562 Power supply circuit for plasma generation, plasma generating apparatus, plasma processing apparatus and plasma processed object
08/02/2007US20070176531 Phoshor and light-emitting diode
08/02/2007US20070176317 Semiconductor device and method of manufacturing thereof
08/02/2007US20070176305 Alignment mark and overlay inspection mark
08/02/2007US20070176302 Low temperature co-fired ceramic module and method of manufacturing the same
08/02/2007US20070176296 Semiconductor device and method of manufacturing the same
08/02/2007US20070176295 Contact via scheme with staggered vias
08/02/2007US20070176294 Thorough wiring board and method of manufacturing the same
08/02/2007US20070176290 Wafer level chip scale package having a gap and method for manufacturing the same
08/02/2007US20070176289 Plastic Ball Grid Array Package with Integral Heatsink
08/02/2007US20070176274 Functional device-mounted module and a process for producing the same
08/02/2007US20070176273 Card and Manufacturing Method
08/02/2007US20070176267 Aluminum leadframes for semiconductor QFN/SON devices
08/02/2007US20070176265 Substrate processing apparatus
08/02/2007US20070176263 Nwell to nwell isolation
08/02/2007US20070176260 Active area resistors and methods for making the same
08/02/2007US20070176258 Method of manufacturing semiconductor device including bonding pad and fuse elements
08/02/2007US20070176257 Semiconductor device including fuse elements and bonding pad
08/02/2007US20070176249 Semiconductor physical quantity sensor of electrostatic capacitance type and method for manufacturing the same
08/02/2007US20070176245 Fin fet and method of fabricating same
08/02/2007US20070176242 Semiconductor devices having different gate dielectrics and methods for manufacturing the same
08/02/2007US20070176237 Semiconductor device and manufacturing method thereof
08/02/2007US20070176234 Semiconductor device
08/02/2007US20070176232 DRAM access transistor and method of formation
08/02/2007US20070176230 High-breakdown-voltage insulated gate semiconductor device
08/02/2007US20070176228 Non-volatile semiconductor memory device and method of manufacturing the same
08/02/2007US20070176227 MOS device with nano-crystal gate structure
08/02/2007US20070176225 Semiconductor device and method of manufacturing the same
08/02/2007US20070176222 Highly integrated and reliable DRAM and its manufacture
08/02/2007US20070176221 Semiconductor memory device and method for fabricating the same
08/02/2007US20070176217 Ferroelectric varactors suitable for capacitive shunt switching
08/02/2007US20070176209 Semiconductor device and method of manufacture thereof
08/02/2007US20070176207 Method for forming patterns on a semiconductor device using a lift off technique
08/02/2007US20070176199 Nitride-based group III-V semiconductor substrate and fabrication method therefor, and nitride-based group III-V light-emitting device
08/02/2007US20070176198 Chip on board package and manufacturing method thereof
08/02/2007US20070176197 Semiconductor device and method of manufacturing semiconductor device
08/02/2007US20070176193 Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device
08/02/2007US20070176185 Organic light emitting display of mother substrate unit and method of fabricating the same
08/02/2007US20070176178 Thin Film Transistor Array Panel for Liquid Crystal Display and Method for Manufacturing the Same
08/02/2007US20070176177 Organic electroluminescent display and method of fabricating the same
08/02/2007US20070176140 Polishing composition and polishing method
08/02/2007US20070176128 Alignment systems and methods for lithographic systems
08/02/2007US20070176115 Ion implantation system and control method
08/02/2007US20070176114 Ion implantation system and control method
08/02/2007US20070175966 System, method, and apparatus for metallic-composite joint with compliant, non-corrosive interface
08/02/2007US20070175864 Low Cost High Throughput Processing Platform