Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/31/2007US7250669 Process to reduce substrate effects by forming channels under inductor devices and around analog blocks
07/31/2007US7250664 Integrated circuit device packaging structure and packaging method
07/31/2007US7250661 Semiconductor memory device with plural source/drain regions
07/31/2007US7250658 Hybrid planar and FinFET CMOS devices
07/31/2007US7250655 MOS transistor having a T-shaped gate electrode
07/31/2007US7250653 SONOS memory device having nano-sized trap elements
07/31/2007US7250652 Nonvolatile semiconductor memory device including an assistant gate formed in a trench
07/31/2007US7250650 Field-effect transistor structure and associated semiconductor memory cell
07/31/2007US7250649 Capacitor of a memory device and fabrication method thereof
07/31/2007US7250648 Ferroelectric rare-earth manganese-titanium oxides
07/31/2007US7250647 Asymmetrical transistor for imager device
07/31/2007US7250646 TFT mask ROM and method for making same
07/31/2007US7250638 Method of fabricating vertical structure LEDs
07/31/2007US7250635 Light emitting system with high extraction efficency
07/31/2007US7250630 Electronic devices formed of high-purity molybdenum oxide
07/31/2007US7250628 Memory devices and electronic systems comprising thyristors
07/31/2007US7250621 Method and arrangement for the plasma-based generation of intensive short-wavelength radiation
07/31/2007US7250391 Cleaning composition for removing resists and method of manufacturing semiconductor device
07/31/2007US7250380 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry
07/31/2007US7250379 Method of forming metal oxide using an atomic layer deposition process
07/31/2007US7250378 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry
07/31/2007US7250377 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus
07/31/2007US7250376 Method for fabricating semiconductor integrated circuit device
07/31/2007US7250375 Substrate processing method and material for electronic device
07/31/2007US7250374 System and method for processing a substrate using supercritical carbon dioxide processing
07/31/2007US7250373 Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate
07/31/2007US7250372 Method for BARC over-etch time adjust with real-time process feedback
07/31/2007US7250371 Reduction of feature critical dimensions
07/31/2007US7250370 Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
07/31/2007US7250369 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
07/31/2007US7250368 Semiconductor wafer manufacturing method and wafer
07/31/2007US7250367 Deposition methods using heteroleptic precursors
07/31/2007US7250366 Carbon nanotubes with controlled diameter, length, and metallic contacts
07/31/2007US7250365 Fabrication method of semiconductor integrated circuit device
07/31/2007US7250364 Semiconductor devices with composite etch stop layers and methods of fabrication thereof
07/31/2007US7250363 Aligned dummy metal fill and hole shapes
07/31/2007US7250362 Solder bump structure and method for forming the same
07/31/2007US7250361 Method for forming a bonding pad of a semiconductor device including a plasma treatment
07/31/2007US7250360 Single step, high temperature nucleation process for a lattice mismatched substrate
07/31/2007US7250359 Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization
07/31/2007US7250358 Wafer for preventing the formation of silicon nodules and method for preventing the formation of silicon nodules
07/31/2007US7250357 Manufacturing method for strained silicon wafer
07/31/2007US7250356 Method for forming metal silicide regions in an integrated circuit
07/31/2007US7250355 Multilayered circuit substrate, semiconductor device and method of producing same
07/31/2007US7250354 Semiconductor device and method for fabricating the same
07/31/2007US7250353 Method and system of releasing a MEMS structure
07/31/2007US7250352 Methods for manufacturing a hybrid integrated circuit device
07/31/2007US7250350 Method and structure for integrated stacked capacitor formation
07/31/2007US7250349 Method for forming ferroelectric memory capacitor
07/31/2007US7250348 Apparatus and method for packaging semiconductor devices using a patterned photo sensitive film to reduce stress buffering
07/31/2007US7250347 Double-gate FETs (Field Effect Transistors)
07/31/2007US7250346 Dual gate oxide structure in semiconductor device and method thereof
07/31/2007US7250345 Insulated gate transistor
07/31/2007US7250344 Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology
07/31/2007US7250343 Power transistor arrangement and method for fabricating it
07/31/2007US7250342 Method of fabricating a MOSFET having a recessed channel
07/31/2007US7250341 Flash memory device having poly spacers
07/31/2007US7250340 Method of fabricating programmable structure including discontinuous storage elements and spacer control gates in a trench
07/31/2007US7250339 Electrically erasable programmable read-only memory cell and memory device and manufacturing method thereof
07/31/2007US7250338 Scalable Flash/NV structures and devices with extended endurance
07/31/2007US7250337 Method for fabricating a nonvolatile sonos memory device
07/31/2007US7250336 Method for fabricating a shadow mask in a trench of a microelectronic or micromechanical structure
07/31/2007US7250335 Methods of fabricating integrated circuit devices including self-aligned contacts with increased alignment margin
07/31/2007US7250334 Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode
07/31/2007US7250333 Method of fabricating a linearized output driver and terminator
07/31/2007US7250332 Method for fabricating a semiconductor device having improved hot carrier immunity ability
07/31/2007US7250331 Mask for crystallizing and method of crystallizing amorphous silicon using the same
07/31/2007US7250330 Method of making an electronic package
07/31/2007US7250329 Method of fabricating a built-in chip type substrate
07/31/2007US7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same
07/31/2007US7250327 Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
07/31/2007US7250326 Substrate with an electrode and method of producing the same
07/31/2007US7250325 Image sensor with deep well region and method of fabricating the image sensor
07/31/2007US7250324 Method for manufacturing an image sensor
07/31/2007US7250323 Methods of making energy conversion devices with a substantially contiguous depletion regions
07/31/2007US7250322 Method of making microsensor
07/31/2007US7250321 Method of forming a photosensor
07/31/2007US7250320 Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
07/31/2007US7250319 Method of fabricating quantum features
07/31/2007US7250318 System and method for providing automated sample preparation for plan view transmission electron microscopy
07/31/2007US7250317 Method of fabricating optical waveguide reflectors
07/31/2007US7250316 Mask and method of manufacturing liquid crystal display device using the same
07/31/2007US7250315 Method for fabricating a structure for a microelectromechanical system (MEMS) device
07/31/2007US7250314 Display system and method of producing the same
07/31/2007US7250313 Method of detecting un-annealed ion implants
07/31/2007US7250312 Doping method and method for fabricating thin film transistor
07/31/2007US7250311 Wirebond crack sensor for low-k die
07/31/2007US7250310 Process for forming and analyzing stacked die
07/31/2007US7250309 Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control
07/31/2007US7250247 Fabricating an integrated circuit includes placing at least two antireflective coating layers chosen so radiation reflected mutally cancels when combined, between a reflective surface and another material
07/31/2007US7250237 Exposing a pattern onto a plurality of fields of a substrate in accordance with pre-specified exposure information and measuring attributes of the fields to assess deformation of the fields induced by thermal effects of the exposing; determining corrective information based on the measured attributes
07/31/2007US7250235 Focus monitor method and mask
07/31/2007US7250228 Yttrium-doped bismuth titanate thin film and preparation thereof
07/31/2007US7250227 Organic electroluminescent element, material for positive hole injecting layer, and organic electroluminescent display
07/31/2007US7250215 Aluminum nitride sintered body containing carbon fibers and method of manufacturing the same
07/31/2007US7250114 Methods of finishing quartz glass surfaces and components made by the methods
07/31/2007US7250113 Method for manufacturing liquid ejection head
07/31/2007US7250112 Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
07/31/2007US7250104 Method and system for optically enhanced metal planarization
07/31/2007US7250094 Heat treatment apparatus
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