Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/09/2007US20070182030 High-voltage silicon-on-insulator transistors and methods of manufacturing the same
08/09/2007US20070182021 Semiconductor component comprising flip chip contacts and method for producing the same
08/09/2007US20070182016 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
08/09/2007US20070182014 Semiconductor device and method for manufacturing same
08/09/2007US20070182013 Damascene structure having a reduced permittivity and manufacturing method thereof
08/09/2007US20070182010 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
08/09/2007US20070182009 Wiring board and method for manufacturing the same and semiconductor device and method for manufacturing the same
08/09/2007US20070182001 Semiconductor device
08/09/2007US20070182000 Module part
08/09/2007US20070181994 Circuit board manufacturing method and circuit board
08/09/2007US20070181990 Stacked semiconductor structure and fabrication method thereof
08/09/2007US20070181989 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
08/09/2007US20070181988 Bare chip embedded PCB and method of the same
08/09/2007US20070181987 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
08/09/2007US20070181986 Substrate for device bonding and method for manufacturing same
08/09/2007US20070181985 Method of manufacturing a semiconductor device and used for the same
08/09/2007US20070181983 Semiconductor device and manufacturing method thereof
08/09/2007US20070181979 Microelectromechanical semiconductor component with cavity structure and method for producing the same
08/09/2007US20070181977 Solutions for integrated circuit integration of alternative active area materials
08/09/2007US20070181975 Trench-gate transistors and their manufacture
08/09/2007US20070181974 Planar vertical resistor and bond pad resistor and related method
08/09/2007US20070181971 Semiconductor device and method of manufacturing the same
08/09/2007US20070181968 Semiconductor device and method of manufacturing the same
08/09/2007US20070181966 Fabrication process of semiconductor device and semiconductor device
08/09/2007US20070181961 Intercalated superlattice compositions and related methods for modulating dielectric property
08/09/2007US20070181960 Semiconductor device, an electronic device and an electronic apparatus
08/09/2007US20070181956 Field-effect transistors with weakly coupled layered inorganic semiconductors
08/09/2007US20070181951 Selective CESL structure for CMOS application
08/09/2007US20070181950 Semiconductor device and its manufacturing method capable of suppressing junction leakage current
08/09/2007US20070181945 Semiconductor device and manufacturing method thereof
08/09/2007US20070181941 High voltage semiconductor devices and methods for fabricating the same
08/09/2007US20070181940 Trench field effect transistor and method of making it
08/09/2007US20070181939 Trench-gate semiconductor devices and the manufacture thereof
08/09/2007US20070181938 Field-effect transistors with weakly coupled layered inorganic semiconductors
08/09/2007US20070181936 Novel architecture to monitor isolation integrity between floating gate and source line
08/09/2007US20070181935 Method of fabricating flash memory device and flash memory device fabricated thereby
08/09/2007US20070181920 Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method
08/09/2007US20070181910 Heterobipolar transistor and method of fabricating the same
08/09/2007US20070181903 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
08/09/2007US20070181895 Nitride based led with a p-type injection region
08/09/2007US20070181894 Radiation emitting semi-conductor element
08/09/2007US20070181890 Light emitting device
08/09/2007US20070181885 Display device and method of manufacturing the same
08/09/2007US20070181880 Semiconductor device and method for forming the same
08/09/2007US20070181879 Display device and manufacturing method thereof
08/09/2007US20070181869 Heterostructure including light generating structure contained in potential well
08/09/2007US20070181868 Silicon electrode plate for plasma etching with superior durability
08/09/2007US20070181852 Passivative chemical mechanical polishing composition for copper film planarization
08/09/2007US20070181851 Polishing composition and polishing method
08/09/2007US20070181850 Polishing liquid for barrier layer
08/09/2007US20070181832 Controlling the characteristics of implanter ion-beams
08/09/2007US20070181831 Method and apparatus for processing a micro sample
08/09/2007US20070181825 Measurement method, transfer characteristic measurement method, adjustment method of exposure apparatus, and device manufacturing method
08/09/2007US20070181685 Automated package dimensioning subsystem
08/09/2007US20070181644 Component mounting method and component mounting apparatus
08/09/2007US20070181557 Heat treatment apparatus, heat treatment method, and computer readable storage medium
08/09/2007US20070181543 Protective sheet for laser processing and manufacturing method of laser processed parts
08/09/2007US20070181535 Chemical mechanical polishing of a bimetallic substrate with a mixture of an abrasive and two polishing rate modifiers: 9,10-anthraquinone-1,8-, 1.5- or 2,6-disulfonic acid having a standard reduction potential less than 0.34 and a second agent having a standard reduction potential greater than 0.34 V
08/09/2007US20070181534 Barrier polishing liquid and chemical mechanical polishing method
08/09/2007US20070181532 Cmp clean process for high performance copper/low-k devices
08/09/2007US20070181531 Plasma processing apparatus and plasma processing method
08/09/2007US20070181530 Reducing line edge roughness
08/09/2007US20070181529 Corona discharge plasma source devices, and various systems and methods of using same
08/09/2007US20070181434 Method and apparatus for fabricating metal layer
08/09/2007US20070181432 Electrolytic processing apparatus and substrate processing apparatus and method
08/09/2007US20070181431 Methods and Apparatus for Monitoring Deposition Quality During Conformable Contact Mask Plating Operations
08/09/2007US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing
08/09/2007US20070181255 Gas supply system, substrate processing apparatus and gas supply method
08/09/2007US20070181246 Method of manufacturing display device
08/09/2007US20070181240 Method for inspecting a film carrier tape for mounting electronic components
08/09/2007US20070181218 Solder composition and method of bump formation therewith
08/09/2007US20070181192 Method and apparatus for monitoring gas flow amount in semiconductor manufacturing equipment
08/09/2007US20070181152 Substrate edge part cleaning apparatus and substrate edge part cleaning method
08/09/2007US20070181150 Cleaning Solution and Cleaning Method of a Semiconductor Device
08/09/2007US20070181149 Single wafer backside wet clean
08/09/2007US20070181146 Plasma cvd apparatus and dry cleaning method of the same
08/09/2007US20070181145 Method for cleaning process chamber of substrate processing apparatus, substrate processing apparatus, and method for processing substrate
08/09/2007US20070181064 Plasma source assembly and method of manufacture
08/09/2007US20070181060 Direct Write™ System
08/09/2007US20070180778 CMP Porous Pad with Component-Filled Pores
08/09/2007DE202007007721U1 Greifer, insbesondere Bernoulli-Greifer Gripper, especially Bernoulli gripper
08/09/2007DE19954832B4 Roboterarm-Mechanismus Robotic arm mechanism
08/09/2007DE19626822B4 Tintenstrahlkopf und Herstellungsverfahren einer Düsenplatte Ink jet head and method of manufacturing a nozzle plate
08/09/2007DE19521985B4 Halbleitervorrichtung und diesbezügliches Herstellungsverfahren A semiconductor device manufacturing method and to this effect
08/09/2007DE112005002149T5 Logisches Verifizierungsverfahren, logische Moduldaten, Vorrichtungsdaten und logische Verifizierungsvorrichtung Logical verification process logic module data, device data and logic verification device
08/09/2007DE112005001961T5 Integrierte Hartmaske mit niedrigem K-Wert Integrated hard mask with a low K value
08/09/2007DE10350702B4 Halbleiterbauelement mit einer kapazitiven, gegenüber Fehlern einer Dielektrikusschicht robusten Struktur Semiconductor device with a capacitive, against errors Dielektrikusschicht a robust structure
08/09/2007DE10317628B4 Matrixsubstrat für eine Flüssigkristallanzeigevorrichtung und Verfahren zu dessen Herstellung Matrix substrate for a liquid crystal display device and process for its preparation
08/09/2007DE10223533B4 Ionenimplantiervorrichtung An ion implanter
08/09/2007DE102007006144A1 Strukturierungsverfahren und -Masken Structuring process and masks
08/09/2007DE102007005558A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
08/09/2007DE102007004881A1 Mehrkomponenten-Barrierepolierlösung Multi-barrier polishing solution
08/09/2007DE102007003583A1 Transistor, Speicherzelle und Verfahren zum Herstellen eines Transistors Transistor memory cell and method for manufacturing a transistor
08/09/2007DE102007001134A1 Semiconductor component e.g. n-type metal oxide semiconductor, has substrate with active region, and charge producing layer is formed along boundary surface between active region and gate dielectric layer on substrate
08/09/2007DE102006062381A1 EEPROM und Verfahren zum Betreiben und Herstellen desselben EEPROM thereof and methods of operating and manufacturing
08/09/2007DE102006062029A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
08/09/2007DE102006061170A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
08/09/2007DE102006061169A1 CMOS-Bildsensor und Verfahren zu dessen Herstellung CMOS image sensor and method for its production
08/09/2007DE102006060996A1 Verfahren zur Herstellung von Isolationsbereichen in Halbleiteranordnungen sowie zugehörige Strukturen A process for producing isolation regions in semiconductor devices and related structures
08/09/2007DE102006031158A1 Verfahren zur Herstellung eines Flashspeicherbauelements A process for producing a flash memory device
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