Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/01/2007EP1812618A2 Cvd doped structures
08/01/2007EP1812523A2 Metal ion-containing cmp composition and method for using the same
08/01/2007EP1812238A1 Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
08/01/2007EP1779422A4 Method of forming strained si/sige on insulator with silicon germanium buffer
08/01/2007EP1743339A4 Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
08/01/2007EP1665340B1 Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer
08/01/2007EP1642344A4 Back-contacted solar cells with integral conductive vias and method of making
08/01/2007EP1634036A4 Measuring apparatus
08/01/2007EP1628908A4 Formation of silicon nanostructures
08/01/2007EP1558426A4 Polishing apparatus
08/01/2007EP1514275B1 Ferroelectric memory with series connected memory cells
08/01/2007EP1509923B1 Ferroelectric memory integrated circuit with improved reliability and density
08/01/2007EP1509778B1 Cell with fixed output voltage for integrated circuit
08/01/2007EP1478012B1 Polishing method and polishing fluid
08/01/2007EP1459363A4 Method for post-etch and strip residue removal on coral films
08/01/2007EP1432774B1 Adhesive sheet of cross-linked silicone, method of manufacturing thereof and device comprising the sheet
08/01/2007EP1354503B1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
08/01/2007EP1277230B1 Method for producing capacitor structures
08/01/2007EP1256030A4 Laser thermal processing apparatus and method
08/01/2007EP1215730B9 SiC WAFER, SiC SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF SiC WAFER
08/01/2007EP1198837A4 Monolithic low dielectric constant platform for passive components and method
08/01/2007EP1173893A4 Polycrystalline silicon germanium films for forming micro-electromechanical systems
08/01/2007EP1123423B1 High rate silicon deposition method at low pressures
08/01/2007EP1060515B1 Method for producing an electrically programmable memory cell arrangement
08/01/2007CN2929959Y Adhesive sheet-welding wire feeding rail
08/01/2007CN2929958Y Improved semiconductor machine
08/01/2007CN2929957Y Improved structure of semiconductor machine
08/01/2007CN1330225C Multilayer printed circuit board
08/01/2007CN1330223C Electronic device and its design method and making process, circuit substrate and electronic equipment
08/01/2007CN1330219C RF plasma reactor and method for manufacturing the substrate
08/01/2007CN1330170C Apparatus and method for removing fine particles during fabrication of a portable camera module
08/01/2007CN1330004C Semiconductor optical recieving device and manufacturing method thereof
08/01/2007CN1330001C Semiconductor parts
08/01/2007CN1330000C 半导体装置 Semiconductor device
08/01/2007CN1329999C Power semiconducter device with RESURF layer
08/01/2007CN1329998C Memory cell arrangement
08/01/2007CN1329997C Panel display with black matrix and mfg. method thereof
08/01/2007CN1329995C Electrically erasable programmable read only memory location and manufacturing method thereof
08/01/2007CN1329993C Semiconductor device and fabrication method thereof
08/01/2007CN1329992C Memory device and its manufacturing method
08/01/2007CN1329991C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/01/2007CN1329989C Semiconductor integrated circuit device
08/01/2007CN1329988C Manufacturing technics for metallized silicon chip with antistantic diode
08/01/2007CN1329985C Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system
08/01/2007CN1329984C Method for wiring design of semiconductor integrated circuit and semiconductor integrated circuit
08/01/2007CN1329983C Semiconductor device with multilayer inter link structure and method for producing said device
08/01/2007CN1329982C Semiconductor device and its manufacturing method and phase-shift mask
08/01/2007CN1329981C Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
08/01/2007CN1329980C Wiring part and its producing method
08/01/2007CN1329979C Film carrier tape for electronic part and its producing method
08/01/2007CN1329977C Method for producing a multichip module and multichip module
08/01/2007CN1329976C Magnetoelectronics device and method for fabricating the same
08/01/2007CN1329975C Method for fabricating capacitor in semiconductor device
08/01/2007CN1329974C Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method
08/01/2007CN1329973C Interconnect structure, method for its fabricating and IC assembly
08/01/2007CN1329972C Semiconductor device, method for manufacturing the same
08/01/2007CN1329971C Method for making semiconductor and method for producing mask pattern
08/01/2007CN1329970C Semiconductor device manufacturing method
08/01/2007CN1329969C Chip pick-up device and producing method thereof and production apparatus of semiconductor
08/01/2007CN1329968C Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/01/2007CN1329967C Nickel salicide processes and methods of fabricating semiconductor devices using the same
08/01/2007CN1329966C Method for producing thin film transistor
08/01/2007CN1329965C Electrical line end shortening quantification
08/01/2007CN1329964C Method for producing semiconductor
08/01/2007CN1329963C Method for forming nitrated tunnel-through oxidized layer
08/01/2007CN1329962C Flat panel display manufacturing apparatus
08/01/2007CN1329961C Plasma processor electrode and plasma processor
08/01/2007CN1329960C CMP apparatus and polishing method
08/01/2007CN1329959C Strong sonic wave cleaning equipment for mfg. semiconductor device
08/01/2007CN1329958C Cleaning method for semiconductor
08/01/2007CN1329957C Surface processing device
08/01/2007CN1329956C Method for making ultrathin high-k gate dielectric for use in a field effect transistor and ultrathin high-k gate dielectric
08/01/2007CN1329955C Method of preparing high quality non-polar GaN self-support substrate
08/01/2007CN1329954C Process for producing an epitaxial layer of gallium nitride and photoelectric parts including it
08/01/2007CN1329953C Substrate inspecting device, coating/developing device and substrate inspecting method
08/01/2007CN1329952C Optical device manufacturing method
08/01/2007CN1329951C Method for aligning wafer
08/01/2007CN1329950C System and method for process contamination prevention for semiconductor manufacturing
08/01/2007CN1329949C Apparatus and method for splitting substrates
08/01/2007CN1329948C Wafer engine
08/01/2007CN1329947C Acoustic detection of dechucking and appts. and method therefor
08/01/2007CN1329946C Method of forming semiconductor apparatus
08/01/2007CN1329925C Semiconductor device
08/01/2007CN1329918C Thin film magnetic memory of shortened data reading data line charging time
08/01/2007CN1329917C Magnetic storage device
08/01/2007CN1329916C Embracing layer read/wright conductor of soft reference layer fixed in operation
08/01/2007CN1329915C Steering gate and bit line segmentation in non-volatile memories
08/01/2007CN1329771C Contact cushion capable of preventing surface oxidation and manufacturing method thereof
08/01/2007CN1329768C Colour filter of liquid crystal display and liquid crystal display using said colour filter
08/01/2007CN1329767C Support unit for positioning bench and mounting structure thereof
08/01/2007CN1329740C Heater-equipped pusher, electronic component handling apparatus, and temperature control method for electronic component
08/01/2007CN1329561C A substrate for epitaxy and a method of preparing the same
08/01/2007CN1329560C Method for producing by vapour-phase epitaxy a gallium nitride film with low defect density
08/01/2007CN1329470C Binding composition, electric circuit connecting material, electric component connecting structure and production thereof
08/01/2007CN1329467C Passivative chemical mechanical polishing composition for copper film planarization
08/01/2007CN1329285C Method for producing a product having a structured surface
08/01/2007CN1329263C Adsorbed pap
08/01/2007CN1329258C Glass substrate package
08/01/2007CN1329167C Scalar type robot for carrying flat plate-like object, and flat plate-like object processing system
08/01/2007CN1329130C Microdeposition control system and method
1 ... 2920 2921 2922 2923 2924 2925 2926 2927 2928 2929 2930 2931 2932 2933 2934 2935 2936 2937 2938 2939 2940 ... 6590