Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/14/2007US7256118 Semiconductor device using low-K material as interlayer insulating film and its manufacture method
08/14/2007US7256117 Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
08/14/2007US7256116 Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
08/14/2007US7256115 Asymmetric plating
08/14/2007US7256114 Process for oxide cap formation in semiconductor manufacturing
08/14/2007US7256113 System for forming a semiconductor device and method thereof
08/14/2007US7256112 Laser activation of implanted contact plug for memory bitline fabrication
08/14/2007US7256111 Pretreatment for electroless deposition
08/14/2007US7256110 Crystal manufacturing method
08/14/2007US7256109 Isotropic polycrystalline silicon
08/14/2007US7256108 Method for reducing semiconductor die warpage
08/14/2007US7256107 Damascene process for use in fabricating semiconductor structures having micro/nano gaps
08/14/2007US7256106 Method of dividing a substrate into a plurality of individual chip parts
08/14/2007US7256105 Semiconductor substrate and thin processing method for semiconductor substrate
08/14/2007US7256104 Substrate manufacturing method and substrate processing apparatus
08/14/2007US7256103 Method for manufacturing a compound material wafer
08/14/2007US7256102 Manufacturing method of thin film device substrate
08/14/2007US7256101 Methods for preparing a semiconductor assembly
08/14/2007US7256100 Manufacturing method of semiconductor device having trench type element isolation
08/14/2007US7256099 Method of producing electrochemical device, and the electrochemical device
08/14/2007US7256096 Semiconductor device having a dual-damascene gate and manufacturing method thereof
08/14/2007US7256095 High voltage metal-oxide-semiconductor transistor devices and method of making the same
08/14/2007US7256094 Method for changing threshold voltage of device in resist asher
08/14/2007US7256093 Method of forming a recessed buried-diffusion device
08/14/2007US7256092 Method for fabricating integrated circuits having both high voltage and low voltage devices
08/14/2007US7256091 Method of manufacturing a semiconductor device with a self-aligned polysilicon electrode
08/14/2007US7256090 Method for fabricating semiconductor device
08/14/2007US7256089 Top electrode barrier for on-chip die de-coupling capacitor and method of making same
08/14/2007US7256088 Semiconductor device and manufacturing method thereof
08/14/2007US7256087 Techniques for improving negative bias temperature instability (NBTI) lifetime of field effect transistors
08/14/2007US7256086 Trench lateral power MOSFET and a method of manufacturing the same
08/14/2007US7256085 Semiconductor memory device and manufacturing method thereof
08/14/2007US7256084 Composite stress spacer
08/14/2007US7256083 Nitride layer on a gate stack
08/14/2007US7256082 Production method for semiconductor device
08/14/2007US7256081 Structure and method to induce strain in a semiconductor device channel with stressed film under the gate
08/14/2007US7256080 Method of fabricating thin film transistor
08/14/2007US7256079 Evaluation method using a TEG, a method of manufacturing a semiconductor device having a TEG, an element substrate and a panel having the TEG, a program for controlling dosage and a computer-readable recording medium recoding the program
08/14/2007US7256078 High mobility plane FinFETs with equal drive strength
08/14/2007US7256077 Method for removing a semiconductor layer
08/14/2007US7256076 Manufacturing method of liquid crystal display device
08/14/2007US7256075 Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
08/14/2007US7256074 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
08/14/2007US7256073 Semiconductor device and manufacturing method thereof
08/14/2007US7256072 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
08/14/2007US7256071 Underfilling efficiency by modifying the substrate design of flip chips
08/14/2007US7256070 Substrate-based housing component with a semiconductor chip
08/14/2007US7256069 Wafer-level package and methods of fabricating
08/14/2007US7256068 Semiconductor package assembly and method for electrically isolating modules
08/14/2007US7256067 LGA fixture for indium assembly process
08/14/2007US7256066 Flip chip packaging process
08/14/2007US7256065 Methods and fixture for coupling a lid to a support substrate
08/14/2007US7256064 Organic semiconductor device
08/14/2007US7256063 Nanoelectromechanical transistors and switch systems
08/14/2007US7256062 Semiconductor photo-detector, semiconductor photo-detection device, and production methods thereof
08/14/2007US7256061 Array substrate for liquid crystal display device and method of manufacturing the same
08/14/2007US7256059 Underfill integration for optical packages
08/14/2007US7256058 Device and method for package warp compensation in an integrated heat spreader
08/14/2007US7256057 Methods for producing phosphor based light sources
08/14/2007US7256056 Method and apparatus for determining the thickness of a dielectric layer
08/14/2007US7256055 System and apparatus for using test structures inside of a chip during the fabrication of the chip
08/14/2007US7255975 Yield and line width performance for liquid polymers and other materials
08/14/2007US7255971 A compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation; (B) a resin that is insoluble or slightly soluble in alkalis, but becomes alkali-soluble under an action of an acid; (C) a basic compound; and
08/14/2007US7255968 Alignment method of exposure mask and manufacturing method of thin film element substrate
08/14/2007US7255941 Ferroelectric film, ferroelectric capacitor, ferroelectric memory, piezoelectric element, semiconductor element, method of manufacturing ferroelectric film, and method of manufacturing ferroelectric capacitor
08/14/2007US7255919 Mold release layer transferring film and laminate film
08/14/2007US7255899 Heat treatment apparatus and heat treatment method of substrate
08/14/2007US7255898 Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
08/14/2007US7255846 Adding a reducing agent to a solution of a Group IV reagent, a Group VI reagent and a surfactant and maintaining the resultant solution at 20-360 degrees C. to form the binary alloy
08/14/2007US7255810 Polymer with a degree of branching of at least 50% and a polishing pad and/or an abrasive, for use in chemical-mechanical polishing
08/14/2007US7255803 Method of forming contact openings
08/14/2007US7255802 Tape substrate and method for fabricating the same
08/14/2007US7255801 Deep submicron CMOS compatible suspending inductor
08/14/2007US7255799 Method for selectively covering a micro machined surface
08/14/2007US7255784 Polishing method and electropolishing apparatus
08/14/2007US7255775 Semiconductor wafer treatment member
08/14/2007US7255774 Process apparatus and method for improving plasma production of an inductively coupled plasma
08/14/2007US7255773 Plasma processing apparatus and evacuation ring
08/14/2007US7255772 High pressure processing chamber for semiconductor substrate
08/14/2007US7255771 Multiple zone carrier head with flexible membrane
08/14/2007US7255749 Substrate cleaning method and substrate cleaning apparatus
08/14/2007US7255748 Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
08/14/2007US7255746 Nitrogen sources for molecular beam epitaxy
08/14/2007US7255744 Low-resistivity n-type semiconductor diamond and method of its manufacture
08/14/2007US7255719 Wafer rotation device and edge flaw inspection apparataus having the device
08/14/2007US7255635 Polishing apparatus
08/14/2007US7255632 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/14/2007US7255629 Polishing assembly with a window
08/14/2007US7255524 Substrate cassette mapper
08/14/2007US7255494 Low-profile package for housing an optoelectronic assembly
08/14/2007US7255478 Transporting apparatus
08/14/2007US7255476 On chip temperature measuring and monitoring circuit and method
08/14/2007US7255273 Descriptor for identifying a defective die site
08/14/2007US7255128 System and method for detecting flow in a mass flow controller
08/14/2007US7255115 Apparatus for cleaning semiconductor wafers
08/14/2007US7255114 Ion sampling system for wafer
08/14/2007US7254861 Device for cleaning tip and side surfaces of a probe
08/14/2007CA2210130C Device for treating planar elements with a plasma jet
08/09/2007WO2007090193A2 Hydraulic oil well pumping apparatus
08/09/2007WO2007090135A2 Nwell to nwell isolation
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