Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/09/2007DE102006015686B3 Printing goods e.g. solar cell wafer, transporting method, involves reapplying conveyor belt section for positioning printing goods in working area or movement of another belt section in working area depending on verification results
08/09/2007DE102006006570A1 Verfahren zur Herstellung von Anordnung von Leitern auf Halbleiterbauelementen Process for the preparation of arrangement of conductors on semiconductor devices
08/09/2007DE102006004826A1 Etching solution, useful for wet-chemical structuring of metal layers e.g. silver layers, in production of semiconductor components, comprises oxidizing agent and chelating agent
08/09/2007DE102006004413A1 Verfahren und System zum Disponieren eines Produktstromes in einer Fertigungsumgebung durch Anwendung eines Simulationsprozesses A method and system for scheduling a product stream in a manufacturing environment by application of a simulation process
08/09/2007DE102006004408A1 Verfahren und System zum Analysieren von standardmäßigen Anlagennachrichten in einer Fertigungsumgebung Method and system for analyzing standard system messages in a manufacturing environment
08/09/2007DE102006003930A1 Power semiconductor component, has dielectric intermediate layer arranged between metal layers, where intermediate layer has less ductility than metal layers and laminar extension of intermediate layer is adapted to extension of surfaces
08/09/2007DE102006003735A1 Anordnung zum Befestigen von elektronischen Bauelementen auf einem Träger Arrangement for mounting of electronic components on a carrier
08/09/2007DE102006001680B3 Herstellungsverfahren für eine FinFET-Transistoranordnung und entsprechende FinFET-Transistoranordnung Preparation process for a FinFET transistor arrangement and corresponding FinFET transistor arrangement
08/09/2007DE102005045661B4 Mikroelektronischer Bauelementchip und Herstellungsverfahren, Packung und LCD-Vorrichtung Microelectronic component chip and manufacturing process, pack and LCD device
08/09/2007DE10156386B4 Verfahren zum Herstellen eines Halbleiterchips A method of manufacturing a semiconductor chip
08/09/2007DE10101630B4 Halbleiterspeicherbauelement mit Eingabe-/Ausgabeleitungsstruktur Semiconductor memory device with input / output line structure
08/09/2007DE10084657B4 Modulkarte und Herstellverfahren für diese Module board and manufacturing method of this
08/08/2007EP1816905A2 Printed wiring board and method of manufacturing the same
08/08/2007EP1816675A1 Manufacturing process of spacers for high-voltage transistors in an EEPROM device
08/08/2007EP1816674A1 Anisotropic etching method
08/08/2007EP1816673A2 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification
08/08/2007EP1816672A1 Semiconductor layer structure and method of fabricating it
08/08/2007EP1816671A1 Exposure method, device manufacturing method, and substrate
08/08/2007EP1816519A1 Novel sulfonium compound, photosensitive composition containing the compound and pattern-forming method using the photosensitive composition
08/08/2007EP1816463A1 Method and apparatus for inspection of semiconductor devices
08/08/2007EP1816361A1 Bearing device and stage device, and exposure device
08/08/2007EP1816175A2 Thermal interface material
08/08/2007EP1815545A2 Alkaline fluoride dope molecular films and applications for p-n junction and field-effect transistor devices
08/08/2007EP1815539A2 Methods and structures for electrical communication with an overlying electrode for a semiconductor element
08/08/2007EP1815531A1 Strained fully depleted silicon on insulator semiconductor device and manufacturing method therefor
08/08/2007EP1815530A1 Field effect transistor employing an amorphous oxide
08/08/2007EP1815529A2 Semiconductor devices and methods of making
08/08/2007EP1815528A1 Method of forming a transistor having a dual layer dielectric
08/08/2007EP1815526A1 Insulated gate semiconductor device and method for producing the same
08/08/2007EP1815525A1 Method of forming a thin film component
08/08/2007EP1815524A1 Method for dopant calibration of delta doped multilayered structure
08/08/2007EP1815520A1 Silicon-on-insulator semiconductor device with silicon layer having defferent crystal orientations and method of forming the silicon-on-insulator semiconductor device
08/08/2007EP1815519A1 Self-aligned trench filling with high coupling ratio
08/08/2007EP1815518A1 Flash- and rom-memory
08/08/2007EP1815517A1 Bipolar transistor with selfaligned silicide and extrinsic base
08/08/2007EP1815515A2 Semiconductor device package with bump overlying a polymer layer
08/08/2007EP1815512A2 Method of manufacturing rfid devices using fluidic self assembly and a local printing system
08/08/2007EP1815511A1 A method of making a semiconductor structure for high power semiconductor devices
08/08/2007EP1815510A1 Etching technique for creation of thermally-isolated microstructures
08/08/2007EP1815509A2 Semiconductor wafer thinning
08/08/2007EP1815508A2 A buffer zone for the prevention of metal migration
08/08/2007EP1815507A2 Copper interconnect wiring and method of forming thereof
08/08/2007EP1815506A2 Method to enhance cmos transistor performance by inducing strain in the gate and channel
08/08/2007EP1815505A2 Tensile and compressive stressed materials for semiconductors
08/08/2007EP1815504A1 Control of photoelectrochemical (pec) etching by modification of the local electrochemical potential of the semiconductor structure relative to the electrolyte
08/08/2007EP1815503A2 Method for fabricating and separating semiconductor devices
08/08/2007EP1815502A1 Method and device for treating substrates and corresponding nozzle unit
08/08/2007EP1815501A1 Method for patterning an organic material to concurrently form an insulator and a semiconductor and device formed thereby
08/08/2007EP1815500A2 Equipment for wafer bonding
08/08/2007EP1815041A2 Wafer fab
08/08/2007EP1814817A1 Sacrificial substrate for etching
08/08/2007EP1697987A4 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
08/08/2007EP1660018A4 Electrospray systems and methods
08/08/2007EP1633528A4 Substrate polishing apparatus
08/08/2007EP1609559B1 Laser beam machining method
08/08/2007EP1595284B1 Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
08/08/2007EP1593150B1 Tri-gate and gate around mosfet devices and methods for making same
08/08/2007EP1574867B1 Semiconductor device and method for testing the same
08/08/2007EP1558698B1 Fluorinated surfactants for aqueous acid etch solutions
08/08/2007EP1537183A4 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
08/08/2007EP1509379A4 Methods and apparatus of field-induced pressure imprint lithography
08/08/2007EP1461286B1 Differential stress reduction in thin films
08/08/2007EP1364397B1 High temperature short time curing of low dielectric constant materials using rapid thermal processing techniques
08/08/2007EP1252654B1 A method for transferring and stacking of semiconductor devices
08/08/2007EP1207378B1 Semiconductor pressure sensor and pressure sensing device
08/08/2007EP1064685B1 Method and arrangement for producing thin metal chalcogenide layers
08/08/2007EP1044074B8 Photoresist coating process control with solvent vapor sensor
08/08/2007EP1028457B1 Method of plasma processing
08/08/2007EP0976152B1 Pattern film repair using a gas assisted focused particle beam system
08/08/2007EP0766307B1 Silicon nitride circuit board
08/08/2007CN2932620Y Semiconductor silicon sheet with damage stress ring
08/08/2007CN2932619Y High-precision silicon table
08/08/2007CN2932618Y Spherical grating array chip balling and rework device
08/08/2007CN2932617Y Thin membrane stripping equipment
08/08/2007CN2932616Y 半导体晶片和半导体器件 The semiconductor wafer and the semiconductor device
08/08/2007CN2932407Y Steady-state working life test equipment capable of controlling transistor junction temperature
08/08/2007CN1331283C Semiconductor laser device, optical pickup using the same, and apparatus and method for manufacturing the same
08/08/2007CN1331244C Semiconductor lighting element and mfg method thereof
08/08/2007CN1331242C Electroluminescent display unit and electronic device
08/08/2007CN1331240C High speed ge channel heterostructures for field effect devices
08/08/2007CN1331239C Semi-conductor diode with reduced leakage
08/08/2007CN1331238C Semiconductor device and method for fabricating the same
08/08/2007CN1331235C N-type semiconductor diamond producing method and semiconductor diamond
08/08/2007CN1331233C Semiconductor device, dynamic semiconductor storage device and producing method for semiconductor device
08/08/2007CN1331232C Capacitance element and mfg method thereof
08/08/2007CN1331230C Complementary bipolar transistor and its manufacturing method
08/08/2007CN1331224C Resin packaging semiconductor device
08/08/2007CN1331223C Semiconductor device and its producing method
08/08/2007CN1331222C High-density flip-chip interconnect
08/08/2007CN1331220C Method of manufacturing an electronic device
08/08/2007CN1331219C Semiconductor chip installed substrate, electro-optical evice, liquid crystal device, electroluminescent device and electronic machine
08/08/2007CN1331218C Packaging assembly and method of assembling the same
08/08/2007CN1331216C Silicon nitride memory and a process for making it
08/08/2007CN1331215C Method for producing ferroelectric memory cells
08/08/2007CN1331214C Manufacturing method of semiconductor device
08/08/2007CN1331213C Method for producing a transistor structure
08/08/2007CN1331212C Method for manufacturing integrated circuit
08/08/2007CN1331211C Semiconductor element manufacturing method by detecting nitride content of gage silicon oxide layer
08/08/2007CN1331210C Method for mfg. semiconductor device
08/08/2007CN1331209C Semiconductor device channel termination
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