Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/26/2007US20070173056 Semiconductor device fabrication method and polishing apparatus
07/26/2007US20070173055 Fabrication method of semiconductor device
07/26/2007US20070173054 Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device
07/26/2007US20070173053 Method for manufacturing wiring and method for manufacturing semiconductor device
07/26/2007US20070173052 Electroplating method by transmitting electric current from a ball side
07/26/2007US20070173051 Method and/or system for forming a thin film
07/26/2007US20070173050 Semiconductor device and method of manufacturing the same
07/26/2007US20070173049 Capacitor and method for fabricating the same
07/26/2007US20070173048 Method of manufacturing an electrical component
07/26/2007US20070173047 FUSI integration method using SOG as a sacrificial planarization layer
07/26/2007US20070173046 Substrate processing apparatus and method and a manufacturing method of a thin film semiconductor device
07/26/2007US20070173045 Method of manufacturing semiconductor device
07/26/2007US20070173044 Wafer Handler Method and System
07/26/2007US20070173043 Ion implantation system having variable screen aperture and ion implantation method using the same
07/26/2007US20070173042 Method for fabricating semiconductor device
07/26/2007US20070173041 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
07/26/2007US20070173040 Method of reducing an inter-atomic bond strength in a substance
07/26/2007US20070173039 Method for fabricating a semiconductor device and apparatus for inspecting a semiconductor
07/26/2007US20070173038 Method for manufacturing semiconductor device
07/26/2007US20070173037 Method of transferring strained semiconductor structures
07/26/2007US20070173036 Production method of compound semiconductor light-emitting device wafer
07/26/2007US20070173035 Manufacturing method of semiconductor device
07/26/2007US20070173034 Method for manufacturing integrated circuit
07/26/2007US20070173033 Method of fabricating a composite substrate with improved electrical properties
07/26/2007US20070173032 Wafer dicing by channels and saw
07/26/2007US20070173031 Thin-film circuit device, method for manufacturing thin-film circuit device, and electronic apparatus
07/26/2007US20070173030 Methods of forming a plurality of capacitors
07/26/2007US20070173029 Method for fabricating high performance metal-insulator-metal capacitor (MIMCAP)
07/26/2007US20070173028 Method of forming dielectric film and capacitor manufacturing method using the same
07/26/2007US20070173027 Semiconductor device and method of manufacturing the same
07/26/2007US20070173026 Method for fabricating bipolar integrated circuits
07/26/2007US20070173025 Semiconductor device and method for fabricating the same
07/26/2007US20070173024 Method for producing two gates controlling the same channel
07/26/2007US20070173023 Semiconductor device manufacturing method
07/26/2007US20070173022 Defect-free SiGe source/drain formation by epitaxy-free process
07/26/2007US20070173021 Self-aligned trench MOSFET structure and method of manufacture
07/26/2007US20070173020 Semiconductor device and method of manufacturing the same
07/26/2007US20070173019 Programmable Resistive Ram and Manufacturing Method
07/26/2007US20070173018 Memory device fabrication
07/26/2007US20070173017 Advanced non-volatile memory array and method of fabrication thereof
07/26/2007US20070173016 Integrated circuit system with dummy region
07/26/2007US20070173015 Method for Fabricating Semiconductor Device
07/26/2007US20070173014 Method for forming memory cell and device
07/26/2007US20070173013 Semiconductor fabrication that includes surface tension control
07/26/2007US20070173012 Semiconductor device featuring common capacitor electrode layer, and method for manufacturing such semiconductor device
07/26/2007US20070173011 Semiconductor device and method of manufacturing the same
07/26/2007US20070173010 Embedded phase-change memory and method of fabricating the same
07/26/2007US20070173009 Method of fabricating a dual-gate structure that prevents cut-through and lowered mobility
07/26/2007US20070173008 Introduction of metal impurity to change workfunction of conductive electrodes
07/26/2007US20070173007 Semiconductor device and method for fabricating the same
07/26/2007US20070173006 Semiconductor memory device and a method of manufacturing the same
07/26/2007US20070173005 Method for fabricating semiconductor device
07/26/2007US20070173004 EPI T-gate structure for CoSi2 extendibility
07/26/2007US20070173003 Methods of manufacturing semiconductor devices with rotated substrates
07/26/2007US20070173002 Spacer T-gate structure for CoSi2 extendibility
07/26/2007US20070173001 Method for manufacturing semiconductor device
07/26/2007US20070173000 Method of manufacturing a semiconductor device
07/26/2007US20070172999 Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate
07/26/2007US20070172998 Thin film transistor substrate, method of manufacturing the same and liquid crystal display having the same
07/26/2007US20070172997 Semiconductor device and method of manufacturing the same
07/26/2007US20070172996 Method of forming a semiconductor device with decreased undercutting of semiconductor material
07/26/2007US20070172995 Method for forming fuse of semiconductor device
07/26/2007US20070172994 Read-only memory device coded with selectively insulated gate electrodes
07/26/2007US20070172993 Flow cell and methods for using the same
07/26/2007US20070172992 Methods for fabricating stiffeners for flexible substrates
07/26/2007US20070172991 Microstructure sealing tool and methods of using the same
07/26/2007US20070172990 Method of packaging a semiconductor die and package thereof
07/26/2007US20070172989 Polymerization initiator systems containing aluminum compounds as curing inhibitors and polymerizable compositions made therewith
07/26/2007US20070172988 Microstructure manufacturing method and microstructure
07/26/2007US20070172987 Membrane-based chip tooling
07/26/2007US20070172986 Three-dimensional package and method of making the same
07/26/2007US20070172985 Three-dimensional package and method of making the same
07/26/2007US20070172984 Three-dimensional package and method of making the same
07/26/2007US20070172983 Three-dimensional package and method of making the same
07/26/2007US20070172982 Three-dimensional package and method of making the same
07/26/2007US20070172981 Method for making flip chip on leadframe package
07/26/2007US20070172980 Semiconductor apparatus manufacturing method
07/26/2007US20070172977 Methods for forming alignment marks on semiconductor devices
07/26/2007US20070172976 Wafer encapsulated microelectromechanical structure and method of manufacturing same
07/26/2007US20070172975 Semiconductor device and fabrication method thereof
07/26/2007US20070172974 Fabrication method of CMOS image sensor
07/26/2007US20070172973 Method of making diode having reflective layer
07/26/2007US20070172972 Manufacture method of display device
07/26/2007US20070172971 Desiccant sealing arrangement for OLED devices
07/26/2007US20070172970 Method of manufacturing a solid-state imaging device
07/26/2007US20070172969 Additive printed mask process and structures produced thereby
07/26/2007US20070172968 Method of processing semiconductor substrate
07/26/2007US20070172967 Pattern forming method and pattern forming system
07/26/2007US20070172966 Automatic on-die defect isolation
07/26/2007US20070172965 Non-destructive trench volume determination and trench capacitance projection
07/26/2007US20070172964 Method of forming self-aligned contact via for magnetic random access memory
07/26/2007US20070172834 Stable metal/conductive polymer composite colloids and methods for making and using the same
07/26/2007US20070172821 Assembly of chitosan onto an electrode surface
07/26/2007US20070172757 base resin comprises homo-/copolyenes having alkali soluble group, exhibits changed alkali solubility under action of acid, acid generator, and tertiary alkanolamines; for patterning semiconductor integrated circuit via lithography; improved resolution
07/26/2007US20070172746 Semiconductor device and manufacturing method thereof
07/26/2007US20070172681 Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
07/26/2007US20070172111 Inspection apparatus of object to be inspected
07/26/2007US20070171692 Semiconductor integrated circuit device
07/26/2007US20070171558 Reflective projection lens for EUV-photolithography
07/26/2007US20070171539 Projection Exposure System
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