Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/26/2007US20070171349 Manufacturing method of display device
07/26/2007US20070171337 Liquid crystal display device and method of fabricating the same
07/26/2007US20070170951 Control system and method of semiconductor inspection system
07/26/2007US20070170601 Semiconductor device and manufacturing method of them
07/26/2007US20070170600 Semiconductor device and manufacturing method thereof
07/26/2007US20070170595 Semiconductor device components with conductive vias and systems including the components
07/26/2007US20070170594 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
07/26/2007US20070170592 Apparatus for solder crack deflection
07/26/2007US20070170591 Semiconductor device and method for fabricating the same
07/26/2007US20070170590 Method of fabricating semiconductor device
07/26/2007US20070170588 Connection structure and fabrication method for the same
07/26/2007US20070170574 Buried via technology for three dimensional integrated circuits
07/26/2007US20070170571 Low profile semiconductor system having a partial-cavity substrate
07/26/2007US20070170569 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
07/26/2007US20070170566 Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument
07/26/2007US20070170560 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
07/26/2007US20070170552 Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2cl2) interface seeding layer
07/26/2007US20070170551 Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings
07/26/2007US20070170547 Semiconductor device and method for fabricating the same
07/26/2007US20070170546 Back end thin film capacitor having both plates of thin film resistor material at single metallization layer
07/26/2007US20070170542 Method of filling a high aspect ratio trench isolation region and resulting structure
07/26/2007US20070170538 Process for the fabricating an electronic integrated circuit and electronic integrated circuit thus obtained
07/26/2007US20070170537 Method and device for wavelength-sensitive photo-sensing
07/26/2007US20070170530 Wafer encapsulated microelectromechanical structure and method of manufacturing same
07/26/2007US20070170526 Thin-film transistor and manufacturing method thereof
07/26/2007US20070170522 Semiconductor device and method for fabricating the same
07/26/2007US20070170519 Driver for Driving a Load Using a Charge Pump Circuit
07/26/2007US20070170516 Triple-well cmos devices with increased latch-up immunity and methods of fabricating same
07/26/2007US20070170515 Structure and method for enhanced triple well latchup robustness
07/26/2007US20070170513 Semiconductor Device and Manufacturing Method Thereof
07/26/2007US20070170508 Semiconductor device and method of manufacturing the semiconductor device
07/26/2007US20070170503 Composite substrate and method of fabricating the same
07/26/2007US20070170502 Semiconductor device and method for manufacturing the same
07/26/2007US20070170501 MOS Transistors Including Silicide Layers on Source/Drain Regions
07/26/2007US20070170496 Nrom flash memory devices on ultrathin silicon
07/26/2007US20070170494 Nonvolatile memory device and method for fabricating the same
07/26/2007US20070170490 Nonvolatile memory device and method of fabricating the same
07/26/2007US20070170488 Capacitor of semiconductor device and method for fabricating the same
07/26/2007US20070170487 Storage capacitor for semiconductor memory cells and method of manufacturing a storage capacitor
07/26/2007US20070170486 Semiconductor device having self-aligned contact and method of fabricating the same
07/26/2007US20070170485 Semiconductor memory device and method for fabricating the same
07/26/2007US20070170484 Semiconductor device and its manufacturing method
07/26/2007US20070170477 Solid state imaging device and method for manufacturing the same
07/26/2007US20070170473 Apparatus using manhattan geometry having non-manhattan current flow
07/26/2007US20070170466 Method for producing compound semiconductor wafer and compound semiconductor device
07/26/2007US20070170464 Transistor gate electrode having conductor material layer
07/26/2007US20070170444 Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
07/26/2007US20070170435 Liquid crystal display panel and fabricating method thereof
07/26/2007US20070170434 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this,transparent electrode, and related devices and processes
07/26/2007US20070170433 Multilevel semiconductor device and method of manufacturing the same
07/26/2007US20070170432 Thin film transistor array substrate and method of fabricating the same
07/26/2007US20070170374 Pattern area value calculating method, proximity effect correcting method, and charged particle beam writing method and apparatus
07/26/2007US20070170159 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
07/26/2007US20070170154 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
07/26/2007US20070170149 Vacuum Processing Apparatus And Vacuum Processing Method Of Sample
07/26/2007US20070170148 Methods for in-situ generation of reactive etch and growth specie in film formation processes
07/26/2007US20070170088 Container, container producing method, substrate processing device, and semiconductor device producing method
07/26/2007US20070169895 Suction unit
07/26/2007US20070169890 Exhaust processing method, plasma processing method and plasma processing apparatus
07/26/2007US20070169889 Methods and apparatus for selectively coupling process tools to abatement reactors
07/26/2007US20070169816 Passivating layer for photovoltaic cells
07/26/2007US20070169795 Apparatus for cleaning substrates
07/26/2007US20070169704 Apparatus for shielding process chamber port having dual zone and optical access features
07/26/2007US20070169703 Advanced ceramic heater for substrate processing
07/26/2007US20070169700 Sensing system and method for determining the alignment of a substrate holder in a batch reactor
07/26/2007US20070169699 Method and Apparatus for Depositing a Magnetoresistive Multilayer Film
07/26/2007US20070169697 Method of manufacturing capacitor of semiconductor device by simplifying process of forming dielectric layer and apparatus thereof
07/26/2007US20070169696 Two-step post nitridation annealing for lower eot plasma nitrided gate dielectrics
07/26/2007US20070169694 Feedback control of sub-atmospheric chemical vapor deposition processes
07/26/2007US20070169689 Manufacturing method of aluminum nitride single crystal and aluminum nitride single crystal
07/26/2007US20070169688 Method for manufacturing silicon wafer
07/26/2007US20070169421 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
07/26/2007US20070169343 Methods of fabricating substrates including one or more conductive vias
07/26/2007DE4391302B4 Verfahren zur Herstellung eines Halbleiters mit einer guten Intrinsic-Getterung A process for producing a semiconductor device with a good intrinsic gettering
07/26/2007DE4233792B4 Substrat für ein Matrix-Flüssigkristallelement A substrate for a matrix liquid crystal element
07/26/2007DE19906067B4 Halbleitersensor für physikalische Größen und Verfahren zu dessen Herstellung A semiconductor sensor of physical quantities and methods for its preparation
07/26/2007DE112005001736T5 A method of manufacturing a plurality of electronic assembles A method of manufacturing a Plurality of electronic assembles
07/26/2007DE10335385B9 ROM-Speicherzelle und -Baustein sowie Entwurfsverfahren hierfür ROM memory cell and building block design and method therefor
07/26/2007DE10330456B4 Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer Apparatus for creating a surface structure on a wafer
07/26/2007DE10311699B4 LOMOS-Hochfrequenztransistor und Verfahren zum Herstellen desselben Thereof lomos high frequency transistor and methods for making
07/26/2007DE102007001594A1 Masken-ROM, Halbleiterbauelement und Herstellungsverfahren Mask ROM, semiconductor device and manufacturing method
07/26/2007DE102007001455A1 Elektronisches Bauelement und Verfahren für dessen Montage Electronic device and method for its assembly
07/26/2007DE102006061028A1 Statischer Direktzugriffsspeicher und Verfahren zur Herstellung desselben Static random access memory and method of manufacturing the same
07/26/2007DE102006061023A1 CMOS-Bildsensor und Verfahren zu dessen Herstellung CMOS image sensor and method for its production
07/26/2007DE102006060800A1 Verfahren zum Bilden eines Grabens A method of forming a trench
07/26/2007DE102006060768A1 Gehäusegruppe für Geräte hoher Leistungsdichte Housing group for supplies, high power density
07/26/2007DE102006052140A1 Ladungsteilchenstrahl-Schreibverfahren und -Schreibvorrichtung, Positionsabweichungsmessverfahren und Positionsmessvorrichtung A charged-writing process and writing device, position deviation measurement method and position measuring device
07/26/2007DE102006023088A1 Power semiconductor component has power semiconductor chip arranged on region of flat conductor frame planned as chip pads, power semiconductor chip is connected with chip pad by plumb bob layer
07/26/2007DE102006003464A1 Verfahren zur Erzeugung einer Siliciumschicht auf einer Substratoberfläche durch Gasphasenabscheidung A method for producing a silicon film on a substrate surface by vapor deposition
07/26/2007DE102006003283A1 Fabricating method for semiconductor component e.g. solar cell, involves forming diffusion-inhibiting layer, partial removal of layer in highly doped region, formation of dopant source and diffusion of dopant from dopant source
07/26/2007DE102006001885A1 Accurate fixing microcomponents such as ionizing radiation detectors onto carriers (e.g. in tomographic devices) involves use of a melt adhesive
07/26/2007DE102006001792A1 Semiconductor module, has semiconductor chip stack arranged on wiring substrate, where heat conducting layer e.g. foil with anisotropic heat conducting particles is arranged between semiconductor chips
07/26/2007DE102005032074B4 Halbleiterbauelement mit Feldstopp Semiconductor device with a field stop
07/26/2007DE102005002707B4 Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente A method of making electrical connections in a semiconductor device by means of micro-coaxial connectors
07/26/2007DE102004062392B4 Verfahren zum Bilden einer Metallverdrahtung einer Halbleitervorrichtung A method of forming a metal wiring of a semiconductor device
07/26/2007DE102004007105B4 Verfahren zum Unterdrücken eines Lithographievorgangs am Rand einer Halbleiterscheibe A method of suppressing a lithography process at the edge of a semiconductor wafer
07/26/2007DE10138103B4 Verfahren zum Strukturieren einer Fotolackschicht auf einem Halbleitersubstrat A method for patterning a photoresist layer on a semiconductor substrate
07/26/2007DE10120383B4 Verfahren zur Metallisierung von Siliziumscheiben durch Aufsputtern Process for the metallization of silicon wafers by sputtering
07/26/2007CA2637737A1 Method of etching a silicon-based material
07/26/2007CA2634068A1 Methods of fabricating transistors including supported gate electrodes and related devices