| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/31/2007 | US7250085 Method of wet cleaning a surface, especially of a material of the silicon-germanium type |
| 07/31/2007 | US7250084 Downward mechanism for support pins |
| 07/31/2007 | US7250082 Mixing a Group 12 metals or Group 12 precursors with a dispersing agent and a solvent followed by heating ; dissolving a Group 16 element or Group 16 precursor in a coordinating solvent, mixing the Group 12 metal precursors and the Group 16 element precursors to form semiconductor nanocrystals |
| 07/31/2007 | US7249995 Apparatus and method for feeding slurry |
| 07/31/2007 | US7249925 System and method for reticle protection and transport |
| 07/31/2007 | US7249485 Substrate processing apparatus |
| 07/31/2007 | US7249409 Method for trimming resistors |
| 07/26/2007 | WO2007085008A2 Apparatus and method for use of indium chloride to deliver indium vapor to ion source |
| 07/26/2007 | WO2007084982A2 Dual-damascene process to fabricate thick wire structure |
| 07/26/2007 | WO2007084907A2 Method for fabricating last level copper-to-c4 connection with interfacial cap structure |
| 07/26/2007 | WO2007084879A2 Low resistance and inductance backside through vias and methods of fabricating same |
| 07/26/2007 | WO2007084783A2 Method for enhancing growth of semipolar (ai,in,ga,b)n via metalorganic chemical vapor deposition |
| 07/26/2007 | WO2007084782A2 Method for improved growth of semipolar (al,in,ga,b)n |
| 07/26/2007 | WO2007084501A2 Method for manufacturing smooth diamond heat sinks |
| 07/26/2007 | WO2007084465A1 Methods of fabricating transistors including supported gate electrodes and related devices |
| 07/26/2007 | WO2007084328A2 High power module with open frame package |
| 07/26/2007 | WO2007084081A1 System and apparatus for cleaning or drying media handling devices |
| 07/26/2007 | WO2007083968A1 Test handler |
| 07/26/2007 | WO2007083966A1 Apparatus for developing a semiconductor wafer |
| 07/26/2007 | WO2007083965A1 Apparatus for automatically venting photoresist |
| 07/26/2007 | WO2007083865A1 Nano electronic device and fabricating method of the same |
| 07/26/2007 | WO2007083810A1 Adhesive composition, filmy adhesive, adhesive sheet, and semiconductor device made with the same |
| 07/26/2007 | WO2007083795A1 Plasma processing equipment |
| 07/26/2007 | WO2007083791A1 Method of liftoff working and liftoff working apparatus |
| 07/26/2007 | WO2007083769A1 Contact device and process for producing the same |
| 07/26/2007 | WO2007083758A1 Moving body drive method, moving body drive system, pattern formation method, pattern formation device, exposure method, exposure device, and device fabrication method |
| 07/26/2007 | WO2007083738A1 Aligning jig, aligning method, method for manufacturing semiconductor module and soldering apparatus |
| 07/26/2007 | WO2007083725A1 Imprint transfer die, imprint transfer method, imprinter, production method of imprint transfer die, and imprint transfer matter |
| 07/26/2007 | WO2007083686A1 Exposure apparatus |
| 07/26/2007 | WO2007083656A1 Method for smoothing wafer surface and apparatus used therefor |
| 07/26/2007 | WO2007083654A1 Process for producing siliceous film and substrate with siliceous film produced thereby |
| 07/26/2007 | WO2007083653A1 Plasma processing apparatus |
| 07/26/2007 | WO2007083651A1 Method for manufacturing semiconductor device |
| 07/26/2007 | WO2007083647A1 Nitride semiconductor light-emitting device |
| 07/26/2007 | WO2007083592A1 Substrate holding apparatus, exposure apparatus, and device production method |
| 07/26/2007 | WO2007083587A1 Soi wafer manufacturing method and soi wafer |
| 07/26/2007 | WO2007083570A1 Method for producing semiconductor chip, and field effect transistor and method for manufacturing same |
| 07/26/2007 | WO2007083538A1 Epoxy bleedout-preventing agent |
| 07/26/2007 | WO2007083498A1 Temperature estimation method and device |
| 07/26/2007 | WO2007083490A1 Method of encapsulating electronic part with resin and die assembly and lead frame both for use in the same |
| 07/26/2007 | WO2007083480A1 Plasma processing apparatus and semiconductor element manufactured by such apparatus |
| 07/26/2007 | WO2007083477A1 Method for manufacturing silicon single crystal wafer |
| 07/26/2007 | WO2007083476A1 Process for producing silicon single crystal wafer |
| 07/26/2007 | WO2007083470A1 Film-forming composition |
| 07/26/2007 | WO2007083458A1 Positive resist composition for immersion exposure and method of forming resist pattern |
| 07/26/2007 | WO2007083455A1 Sheet cutting apparatus and sheet cutting method |
| 07/26/2007 | WO2007083389A1 Integrated circuit device layout method and layout program |
| 07/26/2007 | WO2007083366A1 Semiconductor device, semiconductor wafer structure and method for manufacturing semiconductor wafer structure |
| 07/26/2007 | WO2007083360A1 Semiconductor fabrication device and fabrication method |
| 07/26/2007 | WO2007083358A1 Substrate treating apparatus and substrate treating method |
| 07/26/2007 | WO2007083354A1 Semiconductor device and method for manufacturing same |
| 07/26/2007 | WO2007083352A1 Semiconductor device and method for manufacturing same |
| 07/26/2007 | WO2007083237A1 Integration of self-aligned trenches in-between metal lines |
| 07/26/2007 | WO2007083152A1 Method of etching a silicon-based material |
| 07/26/2007 | WO2007082977A1 Wire-free chemical sensor based on the connection of an inductor to an eis or emis capacitor, and applications thereof |
| 07/26/2007 | WO2007082950A1 Evaluation of an undercut of deep trench structures in soi wafers |
| 07/26/2007 | WO2007082933A2 Micromechanical placement system, and corresponding device |
| 07/26/2007 | WO2007082854A1 Semiconductor devices and methods of manufacture thereof |
| 07/26/2007 | WO2007082760A1 Method for fabricating a semiconductor component having regions with different levels of doping |
| 07/26/2007 | WO2007082745A1 Selective etching for semiconductor devices |
| 07/26/2007 | WO2007082611A1 Apparatus and method for transferring a plurality of chips from a wafer to a substrate |
| 07/26/2007 | WO2007082396A1 Apparatus for degassing a wafer-like substrate |
| 07/26/2007 | WO2007082373A1 A tunable semiconductor component provided with a current barrier |
| 07/26/2007 | WO2007064204A3 Method and system for processing frozen adhesive particles |
| 07/26/2007 | WO2007058909A3 Method of controlling nanowire growth and device with controlled-growth nanowire |
| 07/26/2007 | WO2007056013A3 High density three dimensional semiconductor die package |
| 07/26/2007 | WO2007053202A3 Systems and methods for nanomaterial transfer |
| 07/26/2007 | WO2007050419A3 Semiconductor structure with reduced gate doping and methods for forming thereof |
| 07/26/2007 | WO2007038237A3 Multiple low and high k gate oxides on single gate for lower miller capacitance and improved drive current |
| 07/26/2007 | WO2007004096A3 Methods of fabricating crystalline silicon film and thin film transistors |
| 07/26/2007 | WO2006118652A3 Method for fabricating a mim capacitor high-k dielectric for increased capacitance density and related structure |
| 07/26/2007 | WO2006113318A3 Passive microwave device and method for producing the same |
| 07/26/2007 | WO2006101857A3 A plasma enhanced atomic layer deposition system and method |
| 07/26/2007 | WO2006091285A3 Method and apparatus for cleaning and surface conditioning objects using plasma |
| 07/26/2007 | WO2006073206A9 Bonding wire for semiconductor device |
| 07/26/2007 | WO2005043584A3 Single mask via method and device |
| 07/26/2007 | US20070174807 Semiconductor device manufacturing method, library used for the same, recording medium, and semiconductor device manufacturing system |
| 07/26/2007 | US20070174793 Automatic design device, automatic design method, and automatic design program |
| 07/26/2007 | US20070173187 Chemical mechanical polishing pad with micro-holes |
| 07/26/2007 | US20070173177 Substrate polishing apparatus |
| 07/26/2007 | US20070173076 Equipment for sensing malfunctioning roughing valves in an ion implantation apparatus |
| 07/26/2007 | US20070173075 Laser-based method and system for processing a multi-material device having conductive link structures |
| 07/26/2007 | US20070173074 Semiconductor interlayer dielectric material and a semiconductor device using the same |
| 07/26/2007 | US20070173073 Porous silicon dielectric |
| 07/26/2007 | US20070173072 Method for producing silicon oxide film |
| 07/26/2007 | US20070173071 SiCOH dielectric |
| 07/26/2007 | US20070173070 Porous low-k dielectric film and fabrication method thereof |
| 07/26/2007 | US20070173069 Method of forming insulating layer of semiconductor device |
| 07/26/2007 | US20070173068 Etching of substrates of light emitting devices |
| 07/26/2007 | US20070173067 Opening hard mask and soi substrate in single process chamber |
| 07/26/2007 | US20070173066 Manufacturing method of electronic device |
| 07/26/2007 | US20070173065 Method for manufacturing semiconductor device |
| 07/26/2007 | US20070173064 Manufacturing process for a transistor made of thin layers |
| 07/26/2007 | US20070173063 Self-aligned manufacturing method, and manufacturing method for thin film fuse phase change ram |
| 07/26/2007 | US20070173062 Exposing the surface to an aqueous mixture containing acetic acid, H2SO4, and HF; nitric acid-free; removal of cobalt and noncobalt oxides and cobalt fluorides; semiconductors, integrated circuits |
| 07/26/2007 | US20070173061 Copper metal interconnection with a local barrier metal layer |
| 07/26/2007 | US20070173060 Methods of forming electrically conductive plugs and method of forming resistance variable elements |
| 07/26/2007 | US20070173059 Process kit components for titanium sputtering chamber |
| 07/26/2007 | US20070173058 Semiconductor device |
| 07/26/2007 | US20070173057 Method for fabricating storage node contact in semiconductor device |