Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/09/2007WO2007090051A2 Method and system for high-speed precise laser trimming and scan lens for use therein
08/09/2007WO2007089949A2 Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes
08/09/2007WO2007089723A2 Thermal enhanced package
08/09/2007WO2007089712A2 Composite diamond assembly
08/09/2007WO2007089505A2 Surface micromachined differential microphone
08/09/2007WO2007089495A1 A semiconductor device comprising a metallization layer stack with a porous low-k material having an enhanced integrity
08/09/2007WO2007089377A2 Method of filling a high aspect ratio trench isolation region and resulting structure
08/09/2007WO2007089360A2 Heterostructure including light generating structure contained in potential well
08/09/2007WO2007089341A2 Integrated circuits with antennas formed from package lead wires
08/09/2007WO2007089229A1 Semiconductor die assembly
08/09/2007WO2007089223A2 Ultralow dielectric constant layer with controlled biaxial stress
08/09/2007WO2007089209A1 Fabrication of a qfn integrated circuit package
08/09/2007WO2007089207A1 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
08/09/2007WO2007089206A1 Vias and method of making
08/09/2007WO2007089204A1 Mems components and method for manufacturing same
08/09/2007WO2007089050A1 Method of forming fine channel using electrostatic attraction and method of forming fine structure using the same
08/09/2007WO2007089004A1 Chemical mechanical polishing pad
08/09/2007WO2007088940A1 Pressure reducing apparatus
08/09/2007WO2007088936A1 Gas flow transportation device
08/09/2007WO2007088927A1 Substrate exchanging apparatus, substrate processing apparatus, and substrate inspection apparatus
08/09/2007WO2007088921A1 Pallet for fixing work and liquid applying apparatus provided with same
08/09/2007WO2007088908A1 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device
08/09/2007WO2007088904A1 Microwave plasma processing apparatus
08/09/2007WO2007088894A1 Substrate processing apparatus, substrate placing table used for same, and member exposed to plasma
08/09/2007WO2007088884A1 Positive resist composition for forming thick resist film, object coated with thick resist, and method of forming resist pattern
08/09/2007WO2007088872A1 Substrate processing method, substrate processing system, program, and recording medium
08/09/2007WO2007088868A1 Cmp abrasive for polishing insulating film, polishing method and semiconductor electronic component polished by such polishing method
08/09/2007WO2007088866A1 Memory card and method for manufacturing memory card
08/09/2007WO2007088862A1 Pellicle for high numerical aperture exposure device
08/09/2007WO2007088848A1 Semiconductor device manufacturing method and method for reducing microroughness of semiconductor surface
08/09/2007WO2007088818A1 Polishing agent for copper-based metal and polishing method
08/09/2007WO2007088817A1 Light source device, substrate treating device, and substrate treating method
08/09/2007WO2007088795A1 Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method
08/09/2007WO2007088792A1 Method for seed film formation, plasma film forming apparatus, and memory medium
08/09/2007WO2007088755A1 Single wafer etching method
08/09/2007WO2007088754A1 Epitaxial wafer manufacturing method
08/09/2007WO2007088722A1 Tft substrate, reflective tft substrate and method for manufacturing such substrates
08/09/2007WO2007088695A1 Soldering apparatus, soldering method and method for manufacturing semiconductor device
08/09/2007WO2007088692A1 Plasma etching method
08/09/2007WO2007088668A1 Heat conductive base material, heat conductive sheet and process for producing them
08/09/2007WO2007088614A1 Nozzle plate and device that floats by gas flow and uses the nozzle plate
08/09/2007WO2007088587A1 Semiconductor measuring apparatus and semiconductor measuring method
08/09/2007WO2007088577A1 Switching power supply apparatus and semiconductor integrated circuit for controlling power supply
08/09/2007WO2007088574A1 Semiconductor device and semiconductor device manufacturing method
08/09/2007WO2007088526A1 An integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package
08/09/2007WO2007088494A1 Semiconductor device and method of manufacturing such a device
08/09/2007WO2007088302A1 Anisotropic etching process
08/09/2007WO2007088182A1 Pulsed chemical dispense system
08/09/2007WO2007088058A2 Support for wafer singulation
08/09/2007WO2007087831A1 'universal' barrier cmp slurry for use with low dielectric constant interlayer dielectrics
08/09/2007WO2007054867A3 Producing a covered through substrate via using a temporary cap layer
08/09/2007WO2007001878A3 Gapfill using deposition-etch sequence
08/09/2007WO2006132905A3 Polishing composition and method for defect improvement by reduced particle stiction on copper surface
08/09/2007WO2006062536A3 Formation of ultra-shallow junctions by gas-cluster ion irridation
08/09/2007WO2006041656B1 Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency
08/09/2007WO2006017376A3 Semiconductor power device having a top-side drain using a sinker trench
08/09/2007WO2005123549A3 Serial thermal processor arrangement
08/09/2007WO2005121407A3 Method and system for supplying carbon dioxide
08/09/2007WO2005013334A3 Holder for supporting wafers during semiconductor manufacture
08/09/2007US20070186207 Method and apparatus for printing patterns with improved cd uniformity
08/09/2007US20070186195 Method and system for debugging using replicated logic and trigger logic
08/09/2007US20070185687 Transportable container including an internal environment monitor
08/09/2007US20070185606 Exposure apparatus and device manufacturing method
08/09/2007US20070185298 Organosilicate resin formulation for use in microelectronic devices
08/09/2007US20070185286 Organic solvent, polyimidesiloxane soluble therein, curable component such as an epoxy compound or a polyvalent isocyanate compound, and silicone defoamer; provides polyimidesiloxane solution excellent in defoaming ability and that can maintain wettability of outer lead bonded on wiring board
08/09/2007US20070185242 Low temperature curing ink for printing oxide coating and process the same
08/09/2007US20070185227 Epoxy resins, cyanate ester resins, thermoplastic polyphenylene ethers, adding flexibilizer (bis(2,3-epoxy-2-methylpropyl)ether), thermoplastic polyphenylene ether; gelling, curing, for semiconductor chip assembled to substrate with solder interconnections; shock/fracture resistance; storage stability
08/09/2007US20070185225 Photoinitiated reactions
08/09/2007US20070184757 Polishing sheet and polishing work method
08/09/2007US20070184672 Fluidic device containing 3d structures
08/09/2007US20070184671 Method for production of group lll nitride semiconductor device
08/09/2007US20070184670 Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment
08/09/2007US20070184669 Via structures and trench structures and dual damascene structures
08/09/2007US20070184668 Poly Silicon Gate Doping Method and Structure for Strained Silicon MOS Transistors
08/09/2007US20070184667 Insulating layer patterning method, insulating layer formed by the insulating layer patterning method, display device having the insulating layer
08/09/2007US20070184666 Method for removing residue containing an embedded metal
08/09/2007US20070184665 Semiconductor device and manufacturing method thereof
08/09/2007US20070184664 Method for fabricating semiconductor device capable of decreasing critical dimension in peripheral region
08/09/2007US20070184663 Method of planarizing a semiconductor device
08/09/2007US20070184662 Double-side polishing carrier and fabrication method thereof
08/09/2007US20070184661 Multi-component barrier polishing solution
08/09/2007US20070184660 Method of manufacturing semiconductor device
08/09/2007US20070184659 Method for Cleaning a Semiconductor Wafer
08/09/2007US20070184658 Etching Liquid for Controlling Silicon Wafer Surface Shape
08/09/2007US20070184657 Etching method
08/09/2007US20070184656 GCIB Cluster Tool Apparatus and Method of Operation
08/09/2007US20070184655 Copper Interconnect Wiring and Method and Apparatus for Forming Thereof
08/09/2007US20070184654 Methods for fabricating and filling conductive vias and conductive vias so formed
08/09/2007US20070184653 Integrated circuit with a very small-sized reading diode
08/09/2007US20070184652 Method for preparing a metal feature surface prior to electroless metal deposition
08/09/2007US20070184651 Copper interconnect systems which use conductive, metal-based cap layers
08/09/2007US20070184650 Copper interconnect systems which use conductive, metal-based cap layers
08/09/2007US20070184649 Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics
08/09/2007US20070184648 Composition for forming a photosensitive organic anti-reflective layer and method of forming a pattern using the same
08/09/2007US20070184647 Integrated Circuit Chip Utilizing Dielectric Layer Having Oriented Cylindrical Voids Formed from Carbon Nanotubes
08/09/2007US20070184646 Semiconductor device, wiring substrate forming method, and substrate processing apparatus
08/09/2007US20070184645 Active area bonding compatible high current structures
08/09/2007US20070184644 Ball grid array copper balancing
08/09/2007US20070184643 Methods of Forming Metal Layers Using Multi-Layer Lift-Off Patterns
08/09/2007US20070184642 Recessed poly extension T-gate
1 ... 2909 2910 2911 2912 2913 2914 2915 2916 2917 2918 2919 2920 2921 2922 2923 2924 2925 2926 2927 2928 2929 ... 6590