Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/08/2007CN1331208C Treatment subject elevating mechanism, and treating device using the same
08/08/2007CN1331207C Method for evaluating semiconductor device error and system for supporting the same
08/08/2007CN1331206C Method for inspecting defect
08/08/2007CN1331205C Large area silicon carbide devices and manufacturing methods therefor
08/08/2007CN1331204C Lead-free solder structure and method for high fatigue life
08/08/2007CN1331203C Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
08/08/2007CN1331202C Thin film transistor and its mfg. method
08/08/2007CN1331201C Low-cost method for semiconductor device with high channel density
08/08/2007CN1331200C Semiconductor device and its conductive structure forming process
08/08/2007CN1331199C UV prtreatment process for ultra-thin oxynitride for formation of silicon nitridefilms
08/08/2007CN1331198C Use of ammonia for etching organic low-K dielectrics
08/08/2007CN1331197C Method for making semiconductor device
08/08/2007CN1331196C Method for preparing nano zinc oxide tube by assistance of radiofrequency plasma
08/08/2007CN1331195C Method of producing integrated semiconductor components on a semiconductor substrate
08/08/2007CN1331194C A method for making metal induced polysilicon film having diffuse layer above metal
08/08/2007CN1331193C Method and its structure for forming semiconductor device
08/08/2007CN1331192C 处理系统 Processing System
08/08/2007CN1331191C Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device,
08/08/2007CN1331190C Method for manufacturing display panel
08/08/2007CN1331189C Semiconductor device and mfg. method thereof
08/08/2007CN1331155C Memory device reading data according to difference in electrical resistance between selected memory cell and reference cell
08/08/2007CN1331154C Method and structure for maximizing SN ratio of electric resistance array
08/08/2007CN1331091C Semiconductor device and production method theref
08/08/2007CN1331079C Block based design methodology
08/08/2007CN1330970C Method for testing power type LED thermal resistance and special purpose chip thereof
08/08/2007CN1330797C A method to increase device-to-device uniformity for polycrystalline thin-film transistors by deliberately mis-aligning the microstructure relative to the channel region
08/08/2007CN1330733C Abrasive slurry having high dispersion stability and manufacturing method for a substrate
08/08/2007CN1330596C Parting method for fragile material substrate and parting device using the method
08/08/2007CN1330557C Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same
08/08/2007CN1330494C Electronic-component alignment method and apparatus therefor
08/08/2007CN1330459C Apparatus and method for controlling wafer temp. in chemical mechanical polishing
08/08/2007CN1330452C Plasma-resistant, welded aluminum structures for use in semiconductor processing apparatus
08/08/2007CN1330451C Wire bonder for ball bonding insulated wire and method of using same
08/08/2007CN1330432C Chemical applying method and its applying device
08/08/2007CN101015123A Optically reconfigurable gate array write state inspection method, write state inspection device, and optically reconfigurable gate array
08/08/2007CN101015070A Method for fabrication of semiconductor light-emitting device and the device fabricated by the method
08/08/2007CN101015068A Function element, storage element, magnetic recording element, solar cell, photoelectric conversion element, light emitting element, catalyst reaction device, and clean unit
08/08/2007CN101015066A Hot electron transistor
08/08/2007CN101015061A Manufacturing method of thin film integrated circuit
08/08/2007CN101015060A Shield plate for limiting cross coupling between floating gates
08/08/2007CN101015056A Integrated transistor module and method of fabricating same
08/08/2007CN101015054A Package and method for packaging an integrated circuit wafer
08/08/2007CN101015053A Method of manufacturing semiconductor device and semiconductor device
08/08/2007CN101015052A Thin film capacitor, method for forming same, and computer readable recording medium
08/08/2007CN101015051A Radio chip
08/08/2007CN101015050A Method for manufacturing semiconductor device and semiconductor device manufactured by such method
08/08/2007CN101015049A Substrate treatment apparatus
08/08/2007CN101015048A Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof
08/08/2007CN101015047A Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata
08/08/2007CN101015046A Method for depositing porous films
08/08/2007CN101015045A Treating agent materials
08/08/2007CN101015044A Dry etching gases and method of dry etching
08/08/2007CN101015043A Method for selective etching
08/08/2007CN101015042A Methods of removing photoresist on substrates
08/08/2007CN101015041A Etch and deposition control for plasma implantation
08/08/2007CN101015040A Substrate cleaning method and developing apparatus
08/08/2007CN101015039A Substrate for exposure, exposure method and device manufacturing method
08/08/2007CN101015038A Exposure equipment and exposure method
08/08/2007CN101015037A Method for processing surface of substrate
08/08/2007CN101014847A Shear test device
08/08/2007CN101014730A System and method for forming multi-component dielectric films
08/08/2007CN101014676A Adhesive film and method for manufacturing semiconductor device using same
08/08/2007CN101013889A Semiconductor integrated circuit apparatus and electronic apparatus
08/08/2007CN101013888A Latch circuit and semiconductor integrated circuit device with the same
08/08/2007CN101013746A Patterning method and apparatus, film forming method and apparatus, electrooptics apparatus, and manufacturing method thereof
08/08/2007CN101013744A Organic electroluminescence device, manufacturing method thereof and electric device
08/08/2007CN101013739A Organic semiconductor crystal thin film and method for preparation of weak oriented epitaxial growth and application
08/08/2007CN101013737A Thermally insulated phase change memory device and manufacturing method
08/08/2007CN101013727A Schottky diode structure with enhanced breakdown voltage and method of manufacture
08/08/2007CN101013724A Semiconductor device having super junction structure and method for manufacturing the same
08/08/2007CN101013723A Semiconductor device having a plurality of metal layers deposited thereon
08/08/2007CN101013722A Semiconductor device and manufacturing method thereof
08/08/2007CN101013719A Luminescence device, manufacturing method thereof, exposure device and electric device
08/08/2007CN101013716A Thin film fuse phase change cell with thermal isolation pad and manufacturing method
08/08/2007CN101013711A Imaging apparatus, radiation imaging apparatus, and manufacturing methods therefor
08/08/2007CN101013710A Image pickup apparatus, fabrication method for the same, camera module, and electronic device
08/08/2007CN101013709A TFT array structure and manufacturing method thereof
08/08/2007CN101013708A Semiconductor device and manufacturing method thereof
08/08/2007CN101013705A Thin film transistor substrate and method of manufacturing the same and mask for manufacturing thin film transistor substrate
08/08/2007CN101013704A Nonvolatile semiconductor memory elememnt and manufacturing method thereof
08/08/2007CN101013700A Semiconductor devices and method of manufacturing the same
08/08/2007CN101013699A Semiconductor pulse power switch and method for making same
08/08/2007CN101013698A Transistor, memory cell and method of manufacturing a transistor
08/08/2007CN101013697A Semiconductor integrated circuit and method of designing the same
08/08/2007CN101013694A Ferroelectric capacitor, memory device comprising the same and method of manufacturing the same
08/08/2007CN101013689A LED packaging structure and packaging method
08/08/2007CN101013688A Electronic circuit module and method for fabrication thereof
08/08/2007CN101013687A Semiconductor device having fuse element and method of cutting fuse element
08/08/2007CN101013686A Interconnect substrate, semiconductor device, and method of manufacturing the same
08/08/2007CN101013683A 半导体集成电路器件 The semiconductor integrated circuit device
08/08/2007CN101013682A 半导体集成电路器件 The semiconductor integrated circuit device
08/08/2007CN101013680A Dicing method and dicing device
08/08/2007CN101013679A Method for preparing integrated circuit copper interconnecting line and barrier layer with ultrasonic chemistry
08/08/2007CN101013678A Method for manufacturing semiconductor structure and semiconductor device
08/08/2007CN101013677A Semiconductor wafer testing apparatus and method of testing semiconductor wafer
08/08/2007CN101013676A Method of inspecting laminated assembly and method of inspecting heat spreader module
08/08/2007CN101013675A Method of spot welding for minitype sensor
08/08/2007CN101013674A Apparatus and method for manufacturing semiconductor device
08/08/2007CN101013673A High-voltage silicon-on-insulator transistors and methods of manufacturing the same
08/08/2007CN101013672A Method for manufacturing thin-film transistor and semiconductor element
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