| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 08/23/2007 | US20070195325 Method and apparatus for measuring optical overlay deviation |
| 08/23/2007 | US20070195316 Pattern defect inspection method and its apparatus |
| 08/23/2007 | US20070195304 Large field of view projection optical system with aberration correctability |
| 08/23/2007 | US20070195295 Mask pattern data forming method, photomask and method of manufacturing semiconductor device |
| 08/23/2007 | US20070195050 Active matrix type display device |
| 08/23/2007 | US20070194841 Semiconductor integrated circuit device |
| 08/23/2007 | US20070194803 Probe holder for testing of a test device |
| 08/23/2007 | US20070194767 Step-down circuit with stabilized output voltage |
| 08/23/2007 | US20070194741 Driving apparatus, exposure apparatus, and device manufacturing method |
| 08/23/2007 | US20070194700 Active matrix organic electroluminescent device and fabricating method thereof |
| 08/23/2007 | US20070194663 Packaging and Integration System for Micro Sensors in the Marine Environment |
| 08/23/2007 | US20070194467 nanowires comprise ZnO, TiO2, SnO2 or combination and the semiconductor material is CuI or CuSCN; isothiocyanato)bis(2,2'-bipyridyl-4,4'-dicarboxylato)-ruthenium(II) dye; fluorine doped SnO2 or IT conductive layer; photovoltic cells; cost efficiency |
| 08/23/2007 | US20070194460 Cap layer for an aluminum copper bond pad |
| 08/23/2007 | US20070194458 Methods of redistributing bondpad locations on an integrated circuit |
| 08/23/2007 | US20070194457 Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package |
| 08/23/2007 | US20070194449 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 08/23/2007 | US20070194448 Semiconductor interconnection line and method of forming the same |
| 08/23/2007 | US20070194438 Device And Method For Joining Substrates |
| 08/23/2007 | US20070194424 Integrated circuit package system with die on base package |
| 08/23/2007 | US20070194415 Semiconductor device assemblies including face-to-face semiconductor dice, systems including such assemblies, and methods for fabricating such assemblies |
| 08/23/2007 | US20070194413 Method for manufacturing semiconductor substrate |
| 08/23/2007 | US20070194412 Resin layer formation method, semiconductor device and semiconductor device fabrication method |
| 08/23/2007 | US20070194411 Thermal Treatment Apparatus, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Substrate |
| 08/23/2007 | US20070194407 Semiconductor device and manufacturing the same |
| 08/23/2007 | US20070194403 Methods for fabricating semiconductor device structures with reduced susceptibility to latch-up and semiconductor device structures formed by the methods |
| 08/23/2007 | US20070194392 Method and apparatus for indicating directionality in integrated circuit manufacturing |
| 08/23/2007 | US20070194391 Fabricating strained channel epitaxial source/drain transistors |
| 08/23/2007 | US20070194388 Semiconductor device having internal stress film |
| 08/23/2007 | US20070194382 Semiconductor device comprising metal silicide films formed to cover gate electrode and source-drain diffusion layers and method of manufacturing the same |
| 08/23/2007 | US20070194379 Amorphous Oxide And Thin Film Transistor |
| 08/23/2007 | US20070194378 Eeprom memory cell for high temperatures |
| 08/23/2007 | US20070194377 Thin film semiconductor device and manufacturing method |
| 08/23/2007 | US20070194376 MOS transistors and methods of manufacturing the same |
| 08/23/2007 | US20070194374 Shielded gate trench (SGT) MOSFET devices and manufacturing processes |
| 08/23/2007 | US20070194372 Trench-gated mosfet including schottky diode therein |
| 08/23/2007 | US20070194369 Nonvolatile memory devices and methods of forming the same |
| 08/23/2007 | US20070194364 Diode |
| 08/23/2007 | US20070194362 Semiconductor Device and Process for Production Thereof |
| 08/23/2007 | US20070194353 Metal source/drain Schottky barrier silicon-on-nothing MOSFET device and method thereof |
| 08/23/2007 | US20070194352 CMOS image sensor and method for manufacturing the same |
| 08/23/2007 | US20070194347 Compound semiconductor device and method of fabricating the same |
| 08/23/2007 | US20070194344 Nitride semiconductor light-emitting device and method for manufacturing the same |
| 08/23/2007 | US20070194343 Light emitting device having vertical structure, package thereof and method for manufacturing the same |
| 08/23/2007 | US20070194336 Light emitting device package and method of manufacturing the same |
| 08/23/2007 | US20070194335 Boron Phosphide-Based Semiconductor Light-Emitting Device |
| 08/23/2007 | US20070194333 Light emitting diode package and method of manufacturing the same |
| 08/23/2007 | US20070194320 Thin film transistor array panel and display device |
| 08/23/2007 | US20070194315 Semiconductor Device and Fabrication Method Thereof |
| 08/23/2007 | US20070194310 Non-contact electrical connections test device |
| 08/23/2007 | US20070194303 Method for manufacturing organic light-emitting element, organic light-emitting device and organic EL panel |
| 08/23/2007 | US20070194302 Organic thin-film transistor and fabrication method thereof and organic thin-film device |
| 08/23/2007 | US20070194301 Semiconductor arrangement with non-volatile memories |
| 08/23/2007 | US20070194295 Semiconductor device of Group III nitride semiconductor having oxide protective insulating film formed on part of the active region |
| 08/23/2007 | US20070194252 Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions |
| 08/23/2007 | US20070194236 Semiconductor inspection system |
| 08/23/2007 | US20070193990 Laser machining of a workpiece |
| 08/23/2007 | US20070193977 Plasma etching methods using nitrogen memory species for sustaining glow discharge |
| 08/23/2007 | US20070193976 Plasma processing apparatus and plasma processing method |
| 08/23/2007 | US20070193921 Thin wafer insert |
| 08/23/2007 | US20070193907 Composite substrate carrier |
| 08/23/2007 | US20070193688 Process tuning gas injection from the substrate edge |
| 08/23/2007 | US20070193687 Disturbance-free, recipe-controlled plasma processing system and method |
| 08/23/2007 | US20070193686 Method of manufacturing semiconductor substrate and method of evaluating quality of semiconductor substrate |
| 08/23/2007 | US20070193682 Bonding method and apparatus |
| 08/23/2007 | US20070193628 Gas Supply Facility Of A Chamber And A Fethod For An Internal Pressure Control Of The Chamber For Which The Facility Is Employed |
| 08/23/2007 | US20070193517 Plasma generation apparatus and work processing apparatus |
| 08/23/2007 | US20070193514 Method and apparatus for measuring electron density of plasma and plasma processing apparatus |
| 08/23/2007 | US20070193499 Zno single crystal as super high speed scintillator... |
| 08/23/2007 | DE19954352B4 Halbleiterbauelement sowie Verfahren zur Herstellung desselben Of the same semiconductor device and methods for preparing |
| 08/23/2007 | DE19937232B4 Entwicklungs- und Bewertungssystem für integrierte Halbleiterschaltungen Development and evaluation system for semiconductor integrated circuits |
| 08/23/2007 | DE19901623B4 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates |
| 08/23/2007 | DE19626738B4 Waferkassette zur Halbleiterbauelementfertigung, Herstellungsverfahren hierfür und diese verwendende Halbleiterbauelement-Fertigungsanlage Wafer cassette for semiconductor device fabrication, manufacturing method thereof and use this semiconductor device fabrication facility |
| 08/23/2007 | DE112005002373T5 Geteilter Dünnschichtkondensator für mehrere Spannungen Shared thin film capacitor for multiple voltages |
| 08/23/2007 | DE112005002326T5 CPU-Stromversorgungssystem CPU power supply system |
| 08/23/2007 | DE112005002280T5 U-Gate-Transistoren und Verfahren zur Fertigung U-gate transistors and methods of manufacture |
| 08/23/2007 | DE112005001568T5 Antrieb und Transferroboter Drive and transfer robot |
| 08/23/2007 | DE10334940B4 Trägereinrichtung Support means |
| 08/23/2007 | DE10245037B4 Verfahren zum Entwurf von DRAM-Halbleiter-Speicherbauelementen A method for the design of DRAM semiconductor memory devices |
| 08/23/2007 | DE10236646B4 Verfahren zur Herstellung einer nichtflüchtigen Speichervorrichtung mit einer selbstausgerichteten Gate-Struktur A method of manufacturing a nonvolatile memory device having a self-aligned gate structure |
| 08/23/2007 | DE10233641B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 08/23/2007 | DE10220396B4 Leistungshalbleiterbauelementanordnung Power semiconductor device assembly |
| 08/23/2007 | DE10204868B4 Speicherzelle mit Grabenspeichertransistor und Oxid-Nitrid-Oxid-Dielektrikum Memory cell with a memory transistor grave and oxide-nitride-oxide dielectric |
| 08/23/2007 | DE102007007261A1 Semiconductor device has semiconductor layer and multiple side surfaces, where semiconductor layer section is vertical symmetric to given direction in vertical and horizontal directions and gate electrode is formed on gate insulated film |
| 08/23/2007 | DE102007007096A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 08/23/2007 | DE102007004789A1 Verspannte Halbleiteranordnung und Verfahren zur Herstellung derselben Strained semiconductor device and method of manufacturing the same |
| 08/23/2007 | DE102006055895A1 Ätzbeständiges Heizgerät und Zusammenbau desselben The same etch-heater and Assembly |
| 08/23/2007 | DE102006033372A1 Ultraschallaktor zur Reinigung von Objekten Ultrasound actuator for cleaning objects |
| 08/23/2007 | DE102006026799B3 Bonding head for chip bonding, comprises pressure plate for pressing semiconductor chip against substrate, where pressure plate has surface for incorporation of semiconductor chip for varying surface curvature of pressure plate |
| 08/23/2007 | DE102006007331A1 Multilayer capacitance arrangement e.g. metal-insulator-metal capacitance arrangement, for use in integrated circuit, has electrically conductive layer arranged over metallization layer, and dielectric layer arranged over conductive layer |
| 08/23/2007 | DE102006007093A1 Coating method for surface of semiconductor body, involves clearing away thin layer near surface within range of surface of semiconductor body, which is coated, by sputtering |
| 08/23/2007 | DE102006006825A1 Semiconductor component e.g. ball grid array semiconductor component, has semiconductor chip with protective casing, and soldering ball arranged in recess of electrical insulating layer and connected with connecting carrier |
| 08/23/2007 | DE102006006782A1 Method for handling errors with examination of concept of integrated circuit, involves examining concept of integrated circuit on basis of preset rules for errors, where concept comprises several cells |
| 08/23/2007 | DE102006006700A1 Power semiconductor component e.g. cool-metal oxide semiconductor component, has charge carrier recombination zones buried in semiconductor body and exhibiting high temperature resistance so that zones are consistent at temperatures |
| 08/23/2007 | DE102006006561A1 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module |
| 08/23/2007 | DE102006006473A1 Vorrichtung zur Behandlung von dünnen scheibenförmigen Objekten im Durchlaufverfahren A device for treatment of thin disc-shaped objects in a continuous process |
| 08/23/2007 | DE102006006424A1 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method |
| 08/23/2007 | DE102006006423A1 Leistungshalbleitermodul und zugehöriges Herstellungsverfahren The power semiconductor module and associated production method |
| 08/23/2007 | DE102005035083B4 Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren Bonding system, semiconductor device package and wire bonding method |
| 08/23/2007 | DE10147894B4 Verfahren zum Füllen von Gräben in integrierten Halbleiterschaltungen A method of filling trenches in semiconductor integrated circuits |
| 08/23/2007 | DE10012105B4 Device for holding wheelchair at holding frame of motor-operated wheeled vehicle, has cable tightened against pretensioning of compression spring so that locking element is displaced from locking position into releasing position |