Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2007
08/28/2007US7262133 Enhancement of copper line reliability using thin ALD tan film to cap the copper line
08/28/2007US7262132 Metal plating using seed film
08/28/2007US7262131 Dielectric barrier layer films
08/28/2007US7262130 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
08/28/2007US7262129 Minimizing resist poisoning in the manufacture of semiconductor devices
08/28/2007US7262128 Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards
08/28/2007US7262127 Method for Cu metallization of highly reliable dual damascene structures
08/28/2007US7262126 Sealing and protecting integrated circuit bonding pads
08/28/2007US7262125 Method of forming low-resistivity tungsten interconnects
08/28/2007US7262124 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
08/28/2007US7262123 Methods of forming wire bonds for semiconductor constructions
08/28/2007US7262122 Method of forming metal line in semiconductor memory device
08/28/2007US7262121 Integrated circuit and methods of redistributing bondpad locations
08/28/2007US7262120 Method for fabricating metal line in semiconductor device
08/28/2007US7262119 Method for incorporating germanium into a semiconductor wafer
08/28/2007US7262118 Method for generating a structure on a substrate
08/28/2007US7262117 Germanium integrated CMOS wafer and method for manufacturing the same
08/28/2007US7262116 Low temperature epitaxial growth of silicon-containing films using close proximity UV radiation
08/28/2007US7262115 Method and apparatus for breaking semiconductor wafers
08/28/2007US7262114 Die attaching method of semiconductor chip using warpage prevention material
08/28/2007US7262113 Methods for transferring a useful layer of silicon carbide to a receiving substrate
08/28/2007US7262112 Method for producing dislocation-free strained crystalline films
08/28/2007US7262111 Method for providing a deep connection to a substrate or buried layer in a semiconductor device
08/28/2007US7262110 Trench isolation structure and method of formation
08/28/2007US7262109 Integrated circuit having a transistor level top side wafer contact and a method of manufacture therefor
08/28/2007US7262108 Methods for forming resistors for integrated circuit devices
08/28/2007US7262107 Capacitor structure for a logic process
08/28/2007US7262106 Absorber layer for DSA processing
08/28/2007US7262105 Semiconductor device with silicided source/drains
08/28/2007US7262104 Selective channel implantation for forming semiconductor devices with different threshold voltages
08/28/2007US7262103 Method for forming a salicide in semiconductor device
08/28/2007US7262102 Reduction of field edge thinning in peripheral devices
08/28/2007US7262101 Method of manufacturing a semiconductor integrated circuit device
08/28/2007US7262100 Semiconductor device and manufacturing method thereof
08/28/2007US7262099 Methods of forming field effect transistors
08/28/2007US7262098 Manufacturing process of a semiconductor non-volatile memory cell
08/28/2007US7262097 Method for forming floating gate in flash memory device
08/28/2007US7262096 NAND flash memory cell row and manufacturing method thereof
08/28/2007US7262095 System and method for reducing process-induced charging
08/28/2007US7262093 Structure of a non-volatile memory cell and method of forming the same
08/28/2007US7262092 High-voltage CMOS-compatible capacitors
08/28/2007US7262091 Methods of fabricating MIM capacitors
08/28/2007US7262090 Random access memory (RAM) capacitor in shallow trench isolation with improved electrical isolation to overlying gate electrodes
08/28/2007US7262089 Methods of forming semiconductor structures
08/28/2007US7262088 Thin film device supply body, method of fabricating thin film device, method of transfer, method of fabricating semiconductor device, and electronic equipment
08/28/2007US7262087 Dual stressed SOI substrates
08/28/2007US7262086 Contacts to semiconductor fin devices
08/28/2007US7262085 Display device
08/28/2007US7262084 Methods for manufacturing a finFET using a conventional wafer and apparatus manufactured therefrom
08/28/2007US7262083 Method of manufacturing a semiconductor device
08/28/2007US7262082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
08/28/2007US7262081 Fan out type wafer level package structure and method of the same
08/28/2007US7262080 BGA package with stacked semiconductor chips and method of manufacturing the same
08/28/2007US7262079 Consolidated flip chip BGA assembly process and apparatus
08/28/2007US7262078 Method of forming a wear-resistant dielectric layer
08/28/2007US7262077 Capillary underfill and mold encapsulation method and apparatus
08/28/2007US7262076 Method for production of semiconductor package
08/28/2007US7262075 High-aspect-ratio metal-polymer composite structures for nano interconnects
08/28/2007US7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies
08/28/2007US7262073 CMOS image sensor and method of manufacturing same
08/28/2007US7262072 CMOS image sensor and method for fabricating the same
08/28/2007US7262071 Micromechanical component and suitable method for its manufacture
08/28/2007US7262070 Method to make a weight compensating/tuning layer on a substrate
08/28/2007US7262069 3-D inductor and transformer devices in MRAM embedded integrated circuits
08/28/2007US7262068 Microneedle array module and method of fabricating the same
08/28/2007US7262067 Method for conductive film quality evaluation
08/28/2007US7262066 Systems and methods for thin film thermal diagnostics with scanning thermal microstructures
08/28/2007US7262065 Ferroelectric memory and its manufacturing method
08/28/2007US7262064 Magnetoresistive effect element, magnetic memory element magnetic memory device and manufacturing methods thereof
08/28/2007US7262053 Terraced film stack
08/28/2007US7261997 Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
08/28/2007US7261995 Provide a precise pattern profile and are useful in microfabrication using electron beams or deep-UV light
08/28/2007US7261994 Positive resist composition
08/28/2007US7261984 Exposure pattern or mask and inspection method and manufacture method for the same
08/28/2007US7261980 X-ray mask blank and x-ray mask
08/28/2007US7261920 Process for forming a patterned thin film structure on a substrate
08/28/2007US7261919 Controlling stress in the deposited silicon carbide film by controlling pressure in the reaction chamber during chemical vapor deposition; microelectromechanical systems (MEMS); nanomechanical devices
08/28/2007US7261835 Acid blend for removing etch residue
08/28/2007US7261832 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
08/28/2007US7261831 Positive tone bi-layer imprint lithography method
08/28/2007US7261829 Method for masking a recess in a structure having a high aspect ratio
08/28/2007US7261828 Bumping process
08/28/2007US7261826 Electrostatic actuator for microelectromechanical systems and methods of fabrication
08/28/2007US7261825 Method for the production of a micromechanical device, particularly a micromechanical oscillating mirror device
08/28/2007US7261797 Passive bipolar arc control system and method
08/28/2007US7261796 Method and apparatus for aligning a machine tool
08/28/2007US7261792 Method of producing piezoelectric component and piezoelectric component
08/28/2007US7261780 Ceramic susceptor and a method of cleaning the same
08/28/2007US7261777 Method for fabricating an epitaxial substrate
08/28/2007US7261746 Intermediate product manufacturing apparatus, and manufacturing method
08/28/2007US7261745 Real-time gate etch critical dimension control by oxygen monitoring
08/28/2007US7261621 Pad conditioner for chemical mechanical polishing apparatus
08/28/2007US7261508 Method for aligning a loadport to an overhead hoist transport system
08/28/2007US7261207 Method for carrying a semiconductor device
08/28/2007US7261118 Method and vessel for the delivery of precursor materials
08/28/2007US7260890 Methods for fabricating three-dimensional all organic interconnect structures
08/28/2007CA2558517A1 Micro-pattern forming apparatus, micro-pattern structure, and method of manufacturing the same
08/28/2007CA2462295C Elemental silicon nanoparticle plating and method for the same
08/28/2007CA2241678C Silicon dioxide deposition by plasma activated evaporation process
08/23/2007WO2007095487A1 Exhaust deposit buildup monitoring in semiconductor processing