| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/16/2007 | US20070187142 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 08/16/2007 | US20070187037 Semiconductor development apparatus and method using same |
| 08/16/2007 | US20070186972 Plasma processing apparatus |
| 08/16/2007 | US20070186970 Solar cell and method of fabricating the same |
| 08/16/2007 | US20070186858 Susceptor |
| 08/16/2007 | US20070186850 Substrate processing apparatus and substrate processing method |
| 08/16/2007 | US20070186845 Single crystal silicon wafer for insulated gate bipolar transistors and process for producing the same |
| 08/16/2007 | US20070186486 Polishing composition and rinse composition |
| 08/16/2007 | US20070186485 Polishing composition and rinse composition |
| 08/16/2007 | US20070186414 Multilayer wiring board incorporating carbon fibers and glass fibers |
| 08/16/2007 | US20070186412 Method for Fabricating Circuit Board with Conductive Structure |
| 08/16/2007 | DE202004021352U1 Leistungshalbleitervorrichtungen Power semiconductor devices |
| 08/16/2007 | DE19935946B4 Verfahren zum Ausbilden einer dielektrischen Schicht A method of forming a dielectric layer |
| 08/16/2007 | DE19928524B4 IC-Prüfgerät IC tester |
| 08/16/2007 | DE19721322B4 Elektrostatische Entladungsschutzeinrichtung Electrostatic discharge protection device |
| 08/16/2007 | DE19637497B4 Waferaufnahmevorrichtung, insbesondere zur Verwendung in einem vertikalen Diffusionsofen Wafer holding device, in particular for use in a vertical diffusion furnace |
| 08/16/2007 | DE10350354B4 Orientierungs-unabhängige Oxidation von nitriertem Silizium Orientation independent oxidation of nitrided silicon |
| 08/16/2007 | DE10349908B4 Zweifach passiviertes Leistungshalbleiterbauelement mit einer MESA Randstruktur und Verfahren zu dessen Herstellung Dual passivated power semiconductor device having a mesa edge structure and process for its preparation |
| 08/16/2007 | DE10338422B4 Selektiver Plasmaätzprozess zur Aluminiumoxid-Strukturierung und dessen Verwendung Selective plasma etching of alumina structure and its use |
| 08/16/2007 | DE10332573B4 Verfahren zum Erzeugen von Lotkontakten auf Bauelementen A method of generating components on Lotkontakten |
| 08/16/2007 | DE10313255B4 Transfer-Kopf für eine Vorrichtung zum Transportieren von Bauelementen sowie Vorrichtung mit einem solchen Transferkopf Transfer head for a device for transporting devices and device with such a transfer head |
| 08/16/2007 | DE10311312B4 Isolatorstruktur und Verfahren zur Erzeugung von Isolatorstrukturen in einem Halbleitersubstrat Insulator structure and method of producing insulator structures in a semiconductor substrate, |
| 08/16/2007 | DE10244570B4 Liner-Schicht mit geringer Stufenüberdeckung zur Verbesserung des Kontaktwiderstands bei W-Kontakten Liner layer with low step coverage to improve the contact resistance at W contacts |
| 08/16/2007 | DE10222958B4 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element A method of manufacturing an organic electro-optical element and an organic electro-optical element |
| 08/16/2007 | DE102006029334A1 Material zum Ausbilden eines Belichtungslicht blockierenden Films, mehrschichtige Verbindungsstruktur und Herstellungsverfahren dafür, und Halbleitervorrichtung Material for forming an exposure light-blocking film, multilayer interconnection structure and manufacturing method therefor, and the semiconductor device |
| 08/16/2007 | DE102006027657A1 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production |
| 08/16/2007 | DE102006024423A1 Structure producing method for multiple opto-electronic components, involves producing pressure between roller and auxiliary carrier by relative movement of roller relatively to auxiliary carrier |
| 08/16/2007 | DE102006007267A1 Two-stage process to dope a semiconductor by atomization of alcoholized droplets followed by heating |
| 08/16/2007 | DE102006007053A1 Optimierte Isolationsstruktur und Verfahren zu deren Herstellung Optimized isolation structure and methods for their preparation |
| 08/16/2007 | DE102006007040A1 Bauelement mit integriertem Heizelement und Verfahren zum Beheizen eines Halbleiterkörpers Device with an integrated heating element and method for heating a semiconductor body |
| 08/16/2007 | DE102006005994A1 Semiconductor component e.g. semiconductor chip useful in semiconductor wafer comprises semiconductor substrate having active area region, interspace between carrier and covering filled with underfiller material |
| 08/16/2007 | DE102006005522A1 Elektrische Kontaktiervorrichtung sowie elektrisches Kontaktierverfahren The electrical contactor and electrical contacting method |
| 08/16/2007 | DE102006005419A1 Semiconductor component for electronic device, includes walls with photolithographically patterned polymer, and cavity covering having polymer layer, where molecular chains of the polymers are crosslinked to form stable cavity housing |
| 08/16/2007 | DE102006004870A1 Halbleiterschichtstruktur und Verfahren zur Herstellung einer Halbleiterschichtstruktur Semiconductor layer structure and process for producing a semiconductor layer structure |
| 08/16/2007 | DE102006004796A1 BiCMOS component production method, involves masking emitter window of former bipolar element and base layer is illuminated in base zone of latter bipolar element with auxiliary emitter implant by associated emitter window |
| 08/16/2007 | DE102006004595A1 Electrical characteristic calculation method for integrated electrical circuit, involves determining circuit part with larger contribution for electrical characteristics, and are considered as important parts for computing |
| 08/16/2007 | DE102005056364B3 Bipolarer Trägerwafer und mobile, bipolare, elektrostatische Waferanordnung Bipolar carrier wafer and mobile, bipolar electrostatic wafer assembly |
| 08/16/2007 | DE102005035735B4 Verfahren und System zum Abschätzen eines Zustands einer nicht initialisierten fortschrittlichen Prozesssteuerung durch Anwendung unterteilter Steuerungsdaten A method and system for estimating a state of a non-initialized advanced process control by use of divided control data |
| 08/16/2007 | DE102005013783B4 Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung A method for separating brittle materials by means of laser radiation with asymmetrical density distribution |
| 08/16/2007 | DE102005006639B4 Erzeugen von SiC-Packs auf Wafer-Ebene Generating SiC-packs at the wafer level |
| 08/16/2007 | DE102004059616B4 Verfahren zum Reinigen einer Halbleitervorrichtungs-Herstellungsvorrichtung A method of cleaning a semiconductor device manufacturing apparatus |
| 08/16/2007 | DE102004027356B4 Verfahren zur Herstellung eines integrierten Schaltkreises A process for producing an integrated circuit |
| 08/16/2007 | DE10164305B4 Verfahren zum Ausbilden eines integrierten Halbleiterelements A method of forming an integrated semiconductor element |
| 08/16/2007 | DE10146353B4 Verfahren zur Herstellung einer Lötperle und Lötperlenstruktur A method for preparing a solder bump and Lötperlenstruktur |
| 08/16/2007 | DE10085092B4 Conditioner for a polishing pad used in chemical mechanical polishing used in the manufacturing of semiconductor devices, comprising a substrate with uniform geometric protrusions on one side covered by a diamond layer |
| 08/16/2007 | DE10014915B4 Verfahren zum Freilegen einer Kontaktfläche A method for exposing a contact surface |
| 08/16/2007 | DE10009876B4 Verfahren zum Bilden eines einkristallinen Films A method for forming a single-crystal film |
| 08/16/2007 | CA2641563A1 Semiconductor production plant |
| 08/15/2007 | EP1819202A2 Semiconductor device and manufacturing method thereof |
| 08/15/2007 | EP1818989A2 Nonvolatile semiconductor storage device and manufacturing method thereof |
| 08/15/2007 | EP1818987A1 Semi-conductor component assembly |
| 08/15/2007 | EP1818985A1 Interconnection structure and manufacturing method |
| 08/15/2007 | EP1818984A2 Semiconductor chip with multiple rows of bond pads |
| 08/15/2007 | EP1818979A1 Electronic component and production method therefor |
| 08/15/2007 | EP1818978A1 Semiconductor storage device and manufacturing method thereof |
| 08/15/2007 | EP1818977A2 Lithographic projection apparatus and device manufacturing method |
| 08/15/2007 | EP1818976A1 Process for transferring a thin layer formed in a substrate having crystal originated particles (COPs). |
| 08/15/2007 | EP1818975A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 08/15/2007 | EP1818974A2 Non-volatile memory cells and methods for fabricating the same |
| 08/15/2007 | EP1818973A1 Formation of a monocrystalline semiconductor layer portion separated from a substrate |
| 08/15/2007 | EP1818972A1 Device processing system, information display method, program, and recording medium |
| 08/15/2007 | EP1818971A1 Method for manufacturing direct bond wafer, and direct bond wafer |
| 08/15/2007 | EP1818900A2 Organic light emitting device and manufacturing method of the same |
| 08/15/2007 | EP1818723A1 Composition for forming antireflection film, layered product, and method of forming resist pattern |
| 08/15/2007 | EP1818429A2 Method of growing single crystal GaN, method of making single crystal GaN substrate and single crystal GaN substrate |
| 08/15/2007 | EP1818351A1 Underfill encapsulant for wafer packaging and method for its application |
| 08/15/2007 | EP1818312A1 METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES |
| 08/15/2007 | EP1817941A2 Compositions exhibiting inhibition of cyclooxygenase-2 |
| 08/15/2007 | EP1817801A1 A damascene copper wiring image sensor |
| 08/15/2007 | EP1817798A2 Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabricating same |
| 08/15/2007 | EP1817797A2 Low turn-on voltage, non-electron blocking double hbt structure |
| 08/15/2007 | EP1817795A1 Metallised film for sheet contacting |
| 08/15/2007 | EP1817793A1 Methods for forming co-planar wafer-scale chip packages |
| 08/15/2007 | EP1817792A2 Multiple mask and method for producing differently doped regions |
| 08/15/2007 | EP1817791A1 Apparatus and method for wet treatment of wafers |
| 08/15/2007 | EP1817544A2 Overlay measurement target |
| 08/15/2007 | EP1817500A2 Fore-line preconditioning for vacuum pumps |
| 08/15/2007 | EP1817445A1 Method for making a dismountable substrate |
| 08/15/2007 | EP1817443A2 Membrane-limited selective electroplating of a conductive surface |
| 08/15/2007 | EP1817440A1 Method and device for the deposition of gallium nitrite layers on a sapphire substrate and associated substrate holder |
| 08/15/2007 | EP1719161A4 Polishing apparatus and substrate processing apparatus |
| 08/15/2007 | EP1537585A4 Memory cell |
| 08/15/2007 | EP1537258B1 Method of fabricating substrates, in particular for optics, electronics or optoelectronics---------------------------------------- |
| 08/15/2007 | EP1516031B1 Heat curable adhesive composition, article, semiconductor apparatus and method |
| 08/15/2007 | EP1466357A4 Surface mounted package with die bottom spaced from support board |
| 08/15/2007 | EP1441392B1 Magnetic memory device |
| 08/15/2007 | EP1425432A4 Atmospheric pressure wafer processing reactor having an internal pressure control system and method |
| 08/15/2007 | EP1399306B1 Method and device for cutting a single crystal |
| 08/15/2007 | EP1350321B1 Method and system for efficient and accurate filtering and interpolation |
| 08/15/2007 | EP1348236B1 Silicon controlled rectifier electrostatic discharge protection device with external on-chip triggering and compact internal dimensions for fast triggering |
| 08/15/2007 | EP1309976A4 Photolithographically-patterned out-of-plane coil structures |
| 08/15/2007 | EP1276356B1 Apparatus for plasma processing |
| 08/15/2007 | EP1226286A4 Apparatus for atomic layer chemical vapor deposition |
| 08/15/2007 | EP1166323B1 Method and apparatus for compensating non-uniform wafer processing in plasma processing |
| 08/15/2007 | EP1142012A4 Method of fabricating a high power rf field effect transistor with reduced hot electron injection and resulting structure |
| 08/15/2007 | EP1125321B1 Chemical deposition reactor and method of forming a thin film using the same |
| 08/15/2007 | EP1053567B1 Lateral thin-film silicon-on-insulator (soi) jfet device |
| 08/15/2007 | EP0922198A4 Method and device for measuring the concentration of ions implanted in semiconductor materials |
| 08/15/2007 | EP0889510B1 Method and device for heat-treating single-crystal silicon wafer, single-crystal silicon wafer, and process for producing single-crystal silicon wafer |
| 08/15/2007 | CN2935709Y High voltage automatic discharge device for ion implantation apparatus |